Abstract: An electronic apparatus with a cooling system includes a chassis having a mounting slot; a heat exchanger disposed in the chassis; a removable device is disposed in the mounting slot, and includes a housing and a first pump disposed in the housing; a tube is connected to the heat exchanger and the first pump and a sliding mechanism is disposed in the chassis, and connected to the tube. When the removable device is moved to a mounting location, the tube drives the sliding mechanism to a storage location. When the removable device is moved to a detachable location, the tube drives the sliding mechanism to an extension location, wherein the extension location is closer to the mounting slot than the storage location.

Abstract: A cooling apparatus having a compartment for storing products to be cooled and one or more tubes and/or wires connected to the compartment. A connecting element secures the tubes/wires to a compartment wall. The connecting element has a base portion configured to connect to the compartment wall and a supporting portion for supporting the tubes/wires. The supporting portion has first and second arms protruding from the base portion and defining a seat configured to receive the tubes/wires. The supporting portion has at least one elastic traverse member protruding from the first arm and/or the second arm towards the receiving seat. The elastic traverse member is configured to contact the tubes/wires that are inserted into the seat and secure the tubes/wires into the seat.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: A tablet cooling device includes a copper plate, having a fan mounted on the coper plate to direct airflow; a heat sink secured directly under the fan; a thermal control board to control and regulate the fan and heat sink; and a peltier cooler secured underneath the heat sink; a sub cooling plate, having a circulation channel embedded in the sub cooling plate; a liquid mixture is circulated through the circulation channel; a power source; the thermal control board detects temperature to maintain a predetermined temperature range via active and passive cooling.

Abstract: Electrical power distribution devices with a bypass unit that electrically engages one of two alternate units for powering a load while electrically isolating the other using a six pole power transfer switch and mechanical and electrical interlocks to allow a technician to access one of the alternate units when de-energized and in position while the other of the alternate units is energized and powering the load.

Abstract: An efficient, high density, inline converter module includes a power conversion circuit and an input wiring harness for connecting the input of the power circuit to a unipolar source. A second wiring harness or electrical connectors may be provided for connecting the output of the power conversion circuit to a load. Connections between a wiring harness and the power conversion circuit may comprise conductive contacts, configured to distribute heat. The power circuit may be over molded to provide electrical insulation and efficient heat transfer to external ambient air. A DC transformer based inline converter module may be used in AC adapter, vehicular, and power system architectures. An input connector for connecting the input wiring harness to the input source may be provided. In some embodiments the input source may be an AC source and the input connector may comprise a rectifier for delivering a rectified, unipolar, voltage to the input of the power conversion assembly via an input wiring harness.

Abstract: Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop, and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, and the heat exchanger is to receive fluid from the inlet port, to exchange heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. A buffer loop is coupled to the inlet port and the main loop. The second loop includes a buffer unit and a first valve to control the fluid to flow into the buffer unit for storage and to discharge the fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit comprises an air section to store air and a buffer section to store a portion of the fluid.

Abstract: The present disclosure provides a cooling casing and a cooling device applied to a vehicle and an in-vehicle server. The cooling device applied to the in-vehicle server includes: a first housing and a second housing, an accommodating cavity is formed between the first housing and the second housing; and a cooling duct, the cooling duct being spirally disposed in the accommodating cavity, two ends of the cooling duct are connected to an external cooling system, and the cooling duct is filled with cooling liquid. The present disclosure is simple in structure and low in costs, and can effectively resolve the heat dissipation problem of the in-vehicle server.

Abstract: A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.

Abstract: This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

Abstract: The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.

Abstract: A liquid cooling enclosure configured to house and cool at least one circuit component, the liquid cooling enclosure including an inner wall, an outer wall, the outer wall being spaced from the inner wall to form an internal channel, an inlet in fluid communication with the internal channel, the inlet being configured to receive cooling liquid, and an outlet in fluid communication with the internal channel, the outlet being configured to return cooling liquid, wherein the at least one circuit component is positioned within the liquid cooling enclosure and the cooling liquid is circulated around the at least one circuit component via the internal channel.

Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.

Abstract: A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 ?m or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in3.

Abstract: The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 ?m, a D10 of 10 to 25 ?m, and a D90 of 75 to 85 ?m, and the ?50 of the flat boron nitride is arranged to form an angle of 40° or less with horizontal components of the sheet layer.

Abstract: Embodiments are disclosed of an apparatus multiple information technology (IT) units arranged into an IT cluster. Each IT unit includes an IT container paired with a corresponding cooler. The IT cluster includes first and second rows, each row having an upstream end and a downstream end and including one or more IT units positioned adjacent to and abutting each other. The cooler of each IT unit in each row is either fluidly coupled by an intra-row fluid connection to the IT container of the next downstream IT unit in the same row or is fluidly coupled by an inter-row fluid connection to the IT container of an IT unit in the second row. The cluster includes at least one pair of inter-row fluid connections, so that the pair of inter-row fluid connections, the intra-row fluid connections in the first row, and the intra-row fluid connections in the second row, form at least one fluid loop within the IT cluster. The internal and external loop are arranged in different modular designs.

Abstract: An electrical power module comprising power components and supports, each including at least one metal portion, the metal portions of the supports forming a substrate of the electrical power module, at least one support comprising two angled metal portions that are angled relative to each other at an angle that is greater than 0°, each power component being fastened to two metal portions of two distinct supports by being positioned between said two metal portions, the electrical power module being arranged in such a manner that electrical power currents going to or coming from the power components flow in the metal portions of the supports.

Abstract: An underfloor device includes first and second closed portions. The outer surfaces of the first and second closed portions form a portion of a housing. A portion of the outer surfaces of the first and second closed portions are in contact with an open portion that is a space extending into a vertical direction from an opening formed on the vertically top face of the housing. The portion of the outer surface of the first closed portion in contact with the open portion and the portion of the outer portion of the second closed portion in contact with the open portion are provided with a first connection port and a second connection port, respectively. A first outfitting cable and a second outfitting cable are to be passed through the opening and the open portion, and respectively through the first connection port and the second connection port.

Abstract: An electronic component housing that internally houses an electronic component includes a portion formed of a resin material and a portion formed of a metallic material. The portion formed of the resin material is a connection side portion opposed to a member as a connection partner of the electronic component housing, or an opposite portion opposed to the connection side portion. The electronic component housing further includes an electromagnetic shield member that covers an outer surface of the portion formed of the resin material.