Abstract: A cabinet For electronic components, the cabinet comprising an outer wall, a closure, and an attachment structure, the cuter wall encapsulating an internal space and forming an opening, the closure being attached to the outer wall by the attachment structure, and the attachment structure allowing movement of the closure relative to the outer wall between an open position where the opening is uncovered and a closed position where the opening is covered by the closure. To enable automatic and fast opening of the cabinet in case of over pressure, e.g. caused by arching of electronic components in the cabinet, the cabinet Further comprises a magnet structure comprising at least one magnet arranged to hold the closure in the closed position and to release the closure in response to a pressure in the internal space.

Abstract: A VR integrated machine and a running method thereof are provided. The VR integrated machine includes a heat generating device, a heat conducting member and thermoelectric conversion member, the heat conducting member is connected with the heat generating device, the thermoelectric conversion member has a first end connected with the heat conducting member, and is configured to generate electrical energy and to supply the electrical energy to the UR integrated machine.

Abstract: A relay arrangement includes at least two series-connected relays, which are mechanically and electrically connected to a main printed circuit board via first terminals and second terminals, and at least one flat conductor for conducting current between the at least two series connected relays. The flat conductor is mechanically connected to the main printed circuit board and electrically and thermally connected to the first terminals of the relays, and the at least one flat conductor is configured to dissipate heat produced during operation of the relays.

Abstract: Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

Abstract: The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.

Abstract: An electrical distribution panel for controlling the distribution of electrical power to a plurality of loads includes a plurality of solid-state circuit breakers (SSCBs), each including a thermally conductive heatspreader and one or more power semiconductor devices that control whether electrical current is able to flow to an attached load; a distribution panel heatsink configured in thermal contact with the SSCB heatspreaders; one or more cooling fans that blow air onto the distribution panel heatsink; a stacked bus bar with quick-fit pin-mount receptacles for receiving mating/matching press-fit connection pins located on line-side terminals of the SSCBs; a communications and control (comm/control) bus communicatively coupled to the plurality of SSCBs; and a head-end interface and gateway to which an external computer can connect, to, among other things, set and alter trip settings of the plurality of SSCBs via the comm/control bus.

Abstract: The present invention relates to a modular solar photovoltaic inverter where by reducing the size of the filtering module and reducing the number of components, it reduces the size of the solar inverter compared to the state of the art; and with the configuration of the power modules, it generates channels that allow the passage of air from the cooling module, obtaining a modular photovoltaic solar inverter that improves the dimensions, weight, maintenance, cooling and safety with respect to those known up until now.

Abstract: An electrical assembly may include a first contactor, a second contactor, a bus bar assembly electrically connected to the first contactor and the second contactor, a cooling member, a bracket configured to connect the cooling member to the first contactor and the second contactor, and/or potting material that may be disposed at least partially between the bus bar assembly and the cooling member. A method of assembling an electrical assembly may include disposing the first contactor and the second contactor on a fixture, connecting the bus bar assembly to the first contactor and the second contactor, connecting the bracket to the bus bar assembly, the first contactor, and/or the second contactor, connecting the cooling member to the bracket, and/or providing the potting material between the bus bar assembly and the cooling member.

Abstract: A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

Abstract: The present disclosure provides a coupling system for coupling a medical accessory to an accessory support is provided. The present disclosure also provides a system for powering a medical accessory with an accessory support.

Abstract: Provided is an electric power converter, including: a casing; a heat radiating plate having a first main surface and a second main surface; and a substrate which is fixed to the main surface and to which a heat generating component is mounted, wherein the casing has an inner wall surface in which a first tapered portion is formed, wherein the heat radiating plate includes a second tapered portion which is connected to the first tapered portion in a heat exchangeable manner and slid with respect to the first tapered portion, wherein the heat radiating plate is configured to be displaced in a first direction with respect to the casing by the second tapered portion being slid with respect to the first tapered portion, and wherein the heat generating component is connected to the casing in a heat exchangeable manner by the heat radiating plate being displaced in the first direction.

Abstract: A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling. A first conductive column of the clamp is configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead. The first conductive column extends from a load spreading plate. The load spreading plate is an insulator that electrically isolates a fastener extending therefrom from the first conductive column. The fastener is configured to cooperate with the circuit board to connect the clamp to the circuit board, compress the load spreading plate against the first conductive column to compress the first electrical connection, and connect the clamp to ground.

Abstract: An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.

Abstract: A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 ?m or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in3.

Abstract: A spring lock includes a sinusoidal spring that has one or more crests and troughs formed along a length of the sinusoidal spring, the length extending along a sliding axis, the one or more crests and troughs forming a sinusoidal spring profile. The spring lock further includes a lock bar that has a track extending along the sliding axis, the track being configured to hold the sinusoidal spring and allow the sinusoidal spring to move along the sliding axis, the track further including one or more depressions and plateaus with the depressions and plateaus forming a lock bar profile, wherein the spring lock is locked when the sinusoidal spring profile and the lock bar profile are out-of-phase and the spring lock is unlocked when the sinusoidal spring profile and the lock bar profile are in-phase.

Abstract: The present disclosure is directed to a direct liquid cooling system for cooling of electronic components and configured to maintain a predetermined thermostable environment for the electronic components. The system includes a reservoir and a rack removably placed in the reservoir and securely containing electronic components to be cooled. The system also includes a dielectric coolant which is configured to flow upward in parallel streams between the electronic components and a pump that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components and overflowing the dielectric coolant within the reservoir. A heat exchanger is also provided and coupled with the reservoir via an outlet pipeline. Additionally, a controller is provided to monitor the temperature of the dielectric coolant and adjust the flow of the coolant.

Abstract: A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.

Abstract: A power distribution assembly is disclosed for use with at least one computer in a data centre. The power distribution assembly (11) comprises i) at least one controller (14) comprising at least one heat sensitive component (16) and ii) at least one cooling arrangement (17) comprising a casing (18) configured to contain a coolant (19). At least a portion of the coolant (19) is configured to come into contact with at least part of the controller (14) and/or at least one component for transferring heat away from the at least one controller (14)/component (16) towards at least one wall of the casing (18). This arrangement ensures that even in increased temperature data centres, there is provided consistent and reliable operation of heat sensitive components in smart power strips through dedicated cooling of the components (16).

Abstract: A modular inverter arrangement comprising one or more cages of a cage assembly, including at least a first cage of the cage assembly. Each of the one or more cages can be in the form of a cuboid, and each of the one or more cages can be adapted to accommodate therein respective sets of one or more power modules. The modular inverter arrangement can also be comprised of a heatsink extending transversely through each of the one or more cages, from a first end of the cage assembly to a second end of the cage assembly opposite the first end.

Abstract: An electronic apparatus with a cooling system includes a chassis having a mounting slot; a heat exchanger disposed in the chassis; a removable device is disposed in the mounting slot, and includes a housing and a first pump disposed in the housing; a tube is connected to the heat exchanger and the first pump and a sliding mechanism is disposed in the chassis, and connected to the tube. When the removable device is moved to a mounting location, the tube drives the sliding mechanism to a storage location. When the removable device is moved to a detachable location, the tube drives the sliding mechanism to an extension location, wherein the extension location is closer to the mounting slot than the storage location.