Patents Examined by Cynthia Britt
  • Patent number: 11664824
    Abstract: According to certain embodiments, a method is provided for fast layered decoding for Low-density Parity-Check (LDPC) codes with a Parity-Check Matrix (PCM) that includes at least a first layer and a second layer. The method includes reading, from a memory, Variable Node (VN) soft information, wherein the VN soft information is associated with a message from a VN to a Check Node (CN) of the second layer of the PCM. A new CN to VN message is calculated from the CN of the second layer of the PCM. New VN soft information is calculated for the VN. The new VN soft information is calculated based on the VN soft information and a new CN to VN message from a CN of the first layer to the VN and an old CN to VN message from the CN of the first layer to the VN such that the updating of new VN soft information is delayed by at least one layer. The fast layered decoding has lower decoding latency and utilizes the decoding hardware more efficiently than standard layered decoding techniques.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: May 30, 2023
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Amirpasha Shirazinia, Mattias Andersson, Magnus Malmberg, Sara Sandberg
  • Patent number: 11662380
    Abstract: A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: May 30, 2023
    Assignee: Apple Inc.
    Inventors: Fabien S. Faure, Arnaud J. Forestier, Vikram Mehta
  • Patent number: 11663073
    Abstract: An apparatus and method for efficiently transmitting data are described. A transmitter sends data to a receiver. An encoder of the transmitter divides a received first block of data into multiple sub-blocks. The encoder selects a portion of each sub-block to compare to one another. A portion in a particular sub-block has a same offset and a same size as other portions of other sub-blocks. If the encoder determines the multiple portions match one another, the encoder sends, to the receiver, a second block of data corresponding to the first block of data. The second block of data has a same size as a size of the received first block of data, and the second block of data includes security data from one of multiple error correction schemes. Therefore, the second block of data provides security without increasing an amount of data to transmit.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: May 30, 2023
    Assignee: Advanced Micro Devices, Inc.
    Inventors: SeyedMohammad SeyedzadehDelcheh, Sergey Blagodurov
  • Patent number: 11656939
    Abstract: In some embodiments, a method for die-level monitoring is provided. The method includes distributing user data throughout a plurality of storage nodes through erasure coding, wherein the plurality of storage nodes are housed within a chassis that couples the storage nodes. Each of the storage nodes has a non-volatile solid-state storage with non-volatile memory and the user data is accessible via the erasure coding from a remainder of the storage nodes in event of two of the storage nodes being unreachable. The method includes producing diagnostic information that diagnoses the non-volatile memory on a basis of per package, per die, per plane, per block, or per page, the producing performed by each of the plurality of storage nodes. The method includes writing the diagnostic information to a memory in the storage cluster.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: May 23, 2023
    Assignee: PURE STORAGE, INC.
    Inventors: John D. Davis, John Hayes, Hari Kannan, Nenad Miladinovic, Zhangxi Tan
  • Patent number: 11656278
    Abstract: The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The selecting and accessing of the access ports is achieved using only the dedicated TDI, TMS, TCK, and TDO signal terminals of the device. The selecting and accessing of device access ports can be achieved when a single device is connected to the controller, when multiple devices are placed in a daisy-chain arrangement and connected to the controller, or when multiple devices are placed in a addressable parallel arrangement and connected to the controller. Additional embodiments are also provided and described in the disclosure.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: May 23, 2023
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 11650898
    Abstract: An on-die logic analyzer (ODLA) can reduce the time and resources that would otherwise be spent in validating or debugging memory system timings. The ODLA can receive an enable signal with respect to a start command and start a count of clock cycles in response to a first issued command matching the start command defined in a first mode register. The ODLA can stop the count of clock cycles in response to a second issued command matching a stop command defined in a second mode register. The ODLA can write a value indicative of the stopped count to a third mode register or an on-die storage array in response to the stopped count exceeding a previously stored count.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: May 16, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Jackson N. Callaghan, Kazuaki Ohara, Ji-Hye G. Shin, Vyjayanthi Prasad, Rosa M. Avila-Hernandez, Gitanjali T. Ghosh, Rachael R. Skreen
  • Patent number: 11652579
    Abstract: An apparatus and method for a base station (BS) in a cellular network for uplink (UL) Joint Reception of Coordinated Multi Point (JR-CoMP) operations, wherein the User Equipment (UE) sends to the serving and coordinating Radio Units (RUs) a first data block, wherein because of different channel qualities, first data block arriving as second data block at serving RU and as third data block at coordinating RU, respectively. The Baseband Unit (BBU) associated with these RUs using two nested HARQ processes: First, a ‘fake’ HARQ process to combine the separately channel processed second data block with the third data block; then, a real HARQ process to combine the fake HARQ-combined data block with the retransmitted first data block. Fake HARQ uses Chase Combining while real HARQ uses Incremental-Redundancy Combining.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: May 16, 2023
    Assignee: ULAK HABERLESME A.S.
    Inventors: Rohat Gunes, Mehmet Can Buyukyavuz, Ilke Altin, Ali Arsal
  • Patent number: 11646095
    Abstract: Systems and methods to perform multiple row repair mode for soft post-packaging repair of previously repaired data groups are disclosed. The devices may have activation circuitry that includes a mode register bit or a control antifuse that sends an input signal upon activation. The devices may also include a logic element that receives the input signal and sends, upon receiving the input signal, a configuration signal that enables a multiple row repair mode.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 9, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Gary Howe, John E. Riley
  • Patent number: 11644482
    Abstract: The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 9, 2023
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 11646093
    Abstract: The present technology relates to a memory system and a method of operating the same. The memory system includes a memory device including a plurality of semiconductor memories, and a controller configured to control the memory device to select a victim block based on a fail bit number of some data, among data that is programmed in each of the plurality of semiconductor memories, corresponding to a specific program state, and configured to perform a garbage collection operation on the selected victim blocks.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 9, 2023
    Assignee: SK hynix Inc.
    Inventor: Jae Wook Yang
  • Patent number: 11640331
    Abstract: Techniques for establishing a network connection via a physical medium after exiting a low-power state. The technique includes receiving circuit configuration information for configuring a circuit for establishing a network connection via a physical medium. The technique also includes determining first redundancy information based on the circuit configuration information. The technique also includes storing the determined first redundancy information and the circuit configuration information. The technique also includes entering, by the circuit, a low-power state, and exiting the low-power state. The technique also includes determining second redundancy information based on the stored circuit configuration information after the circuit has exited the low-power state. The technique also includes comparing the second redundancy information to the first redundancy information. The technique also includes detecting an error based on the comparing.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: May 2, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ralf Eckhardt, Aniruddha Khadye
  • Patent number: 11639964
    Abstract: A method and an apparatus for testing a chip, as well as a storage medium, and a chip thereof are provided. The chip includes an operation module. The method includes receiving, via a first pin of the chip, a test control signal indicating a test type of the operation module; performing a first test for the operation module using a first test vector based on the test type; or performing a second test for the operation module using a second test vector, where the first test is a test for the memory included in the operation module and the second test is a test for the functional logic in included in the operation module.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 2, 2023
    Assignees: Beijing Baidu Netcom Science and Technology Co., Ltd., Kunlunxin Technology (Beijing) Company Limited
    Inventor: Ziyu Guo
  • Patent number: 11639963
    Abstract: The disclosure describes novel methods and apparatuses for controlling a device's TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customers system using the device. Additional embodiments are also provided and described in the disclosure.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: May 2, 2023
    Assignee: Texas Instmments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 11639962
    Abstract: An integrated circuit (IC) can include a plurality of circuit blocks, wherein each circuit block includes design for testability (DFT) circuitry. The DFT circuitry can include a scan interface, wherein each scan interface is uniform with the scan interface of each other circuit block of the plurality of circuit blocks, an embedded deterministic test circuit coupled to the scan interface, wherein the embedded deterministic test circuit couples to circuitry under test, and a scan response analyzer coupled to the scan interface. The scan response analyzer is configured to operate in a selected scan response capture mode selected from a plurality of scan response capture modes. The IC can include a global scan router connected to the scan interfaces of the plurality of circuit blocks. The global scan router is configured to activate a subset of the plurality of circuit blocks in parallel for a scan test.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: May 2, 2023
    Assignee: Xilinx, Inc.
    Inventors: Niravkumar Patel, Amitava Majumdar, Partho Tapan Chaudhuri
  • Patent number: 11637567
    Abstract: There is provided a decoding circuit including; a first decoding unit that decodes a first signal from a multiplexed signal in which the first signal and a second signal are multiplexed in an LDM (Layered Division Multiplexing) system; and a second decoding unit that decodes the second signal from the multiplexed signal using the decoding result of the decoded first signal, wherein the second signal is selectively decoded based on noise information related to a reception state of the multiplexed signal.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: April 25, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yutaka Nakada, Satoshi Okada
  • Patent number: 11635465
    Abstract: An integrated circuit includes a data propagation path including a flip-flop. The flip-flop includes a first latch and a second latch. The integrated circuit includes a third latch that acts as a dummy latch. The input of the third latch is coupled to the output of the first latch. The integrated circuit includes a fault detector coupled to the output of the flip-flop and the output of the third latch. The third latch includes a signal propagation delay selected so that the third latch will fail to capture data in a given clock cycle before the second latch of the flip-flop fails to capture the data in the given clock cycle. The fault detector that detects when the third latch is failed to capture the data.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 25, 2023
    Assignee: STMicroelectronics International N.V.
    Inventors: Rohit Goel, Anand Kumar Mishra, Rajnish Garg
  • Patent number: 11631454
    Abstract: In described examples, an apparatus includes: a set of control registers containing control bits for controlling circuitry coupled to receive register write enable signals and to receive input data; a memory for storing data corresponding to the control bits coupled to receive an address and a memory write enable signal; decode circuitry coupled to output the register write enable signals; a data output bus coupled to receive data from the memory but free from connections to the control registers; and a controller coupled to receive an address, coupled to output the address on an internal address bus, coupled to output a register write enable signal, and coupled to output the memory write enable signal, configured to cause data to be written to a selected control register corresponding to the address received, and to cause the data to be contemporaneously stored at a memory location corresponding to the address received.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: April 18, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Saket Jalan, Sudesh Chandra Srivastava, Mohammed Nabeel
  • Patent number: 11630151
    Abstract: The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: April 18, 2023
    Assignee: Texas Instruments Incorporated
    Inventor: Lee D. Whetsel
  • Patent number: 11630786
    Abstract: A memory device such as a page mode NAND flash including a page buffer, and an input/output interface for I/O data units having an I/O width less than the page width supports continuous page read with non-sequential addresses. A controller controls a continuous page read operation to output a stream of pages at the I/O interface. The continuous read operation includes responding to a series of commands to output a continuous stream of pages. The series of commands including a first command and a plurality of intra-stream commands received before completing output of a preceding page in the stream. The first command includes an address to initiate the continuous page read operation, and at least one intra-stream command in the plurality of intra-stream commands includes a non-sequential address to provide the non-sequential page in the stream of pages.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 18, 2023
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventor: Shuo-Nan Hung
  • Patent number: 11626180
    Abstract: A system and method for measuring the degradation of one or more memory devices of a memory sub-system. An example system including a memory controller operatively coupled with a memory device and configured to perform operations comprising: testing different values for a setting of the memory device, wherein the setting of the memory device affects a duty cycle of a signal internal to the memory device; selecting an optimum value for the setting based on access errors during the testing, wherein the optimum value minimizes access errors; determining a degradation measurement for the memory device based on the optimum value; and providing a notification to a host system based on the degradation measurement.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: April 11, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Zhenming Zhou, Yang Lu, Jiangli Zhu, Tingjun Xie