Abstract: A display device includes a pixel array including a plurality of pixels, and a sensor disposed below the pixel array that includes a first region having a low resolution and overlapping the sensor, and a second region having a high resolution and disposed adjacent to the first region, the first region includes a plurality of first pixels having a first structure, the second region includes a plurality of second pixels having a second structure different from the first structure, and a light-emitting region of each of the first pixels is wider than a light-emitting region of each of the second pixels.

Abstract: A method for producing a printable ink for an electronic component in which a transition metal-containing pseudohalide or chalcogenide is first complexed by a pyridine-like or thiol-like solvent, in order to improve or achieve solubility. Subsequently, by filtering and mixing with at least one solvent a printable ink is produced. The printable ink can be used to produce hole transport or electron blocking layers of electronic components.

Abstract: A semiconductor device includes a substrate that includes a first active region, a second active region, and an isolation region. An isolation layer pattern fills a trench in the substrate. A first gate insulation layer pattern and a first gate electrode structure are formed on the first active region. A second gate insulation layer pattern and second gate electrode structure are formed on the second active region. The first gate electrode structure includes a first polysilicon pattern, a second polysilicon pattern, and a first metal pattern. The second gate electrode structure includes a third polysilicon pattern, a fourth polysilicon pattern, and a second metal pattern. An upper surface of the isolation layer pattern is higher than upper surfaces of each of the first and third polysilicon patterns. A sidewall of each of the first and third polysilicon patterns contacts sidewalls of the isolation layer pattern.

Abstract: An organic light emitting display apparatus include a substrate including a plurality of pixels having a plurality of sub-pixels, a plurality of organic light emitting elements disposed at the plurality of sub-pixels, and a plurality of light extraction patterns on the plurality of organic light emitting elements and having different shapes at each of the plurality of sub-pixels.

Abstract: A method for fabricating an organic electronic device comprises providing a plurality of photoresist structures on a substrate, the substrate having a first electrode layer, the photoresist structures having a bottom surface attached to the substrate and a top surface opposite the bottom surface, the top surface having a dimension greater than a dimension of the bottom surface, positioning a mask over the structures, the mask having a plurality of openings, and depositing an emissive material over the substrate through at least one of the plurality of openings to form at least one emissive element. An organic electronic device and a method of fabricating an organic electronic component are also described.

Abstract: In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.

Abstract: Selective deposition of a sacrificial material on a semiconductor substrate, the substrate having a surface with a plurality of regions of substrate materials having different selectivities for the sacrificial material, may be conducted such that substantial deposition of the sacrificial material occurs on a first region of the substrate surface, and no substantial deposition occurs on a second region of the substrate surface. Deposition of a non-sacrificial material may then be conducted on the substrate, such that substantial deposition of the non-sacrificial material occurs on the second region and no substantial deposition of the non-sacrificial material occurs on the first region. The sacrificial material may then be removed such that net deposition of the non-sacrificial material occurs substantially only on the second region.

Abstract: A semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.

Abstract: A display panel and an electronic device are provided. The display panel includes a substrate including a display area and a frame area surrounding the display area, a plurality of sub-pixels located in the display area, and a plurality of pins and a plurality of alignment marks located in the frame area. The plurality of pins includes a first pin and a second pin. At least one alignment mark of the plurality of alignment marks is a first photosensitive element. The first photosensitive element is connected to the first pin. The second pin is connected to the plurality of sub-pixels.

Abstract: An electronic apparatus comprising: a substrate; an organic light-emitting device disposed on the substrate; and a thin film encapsulation portion sealing the organic light-emitting device and comprising at least one organic film, wherein the organic film comprises a cured product of a composition for forming an organic film, the composition comprising a curable material and an ultraviolet (UV) absorber, wherein the curable material comprises at least one selected from an acryl-based material, a methacryl-based material, an acrylate-based material, a methacrylate-based material, a vinyl-based material, an epoxy-based material, a urethane-based material, and a cellulose-based material, and the organic light-emitting device that includes a first electrode, a second electrode facing the first electrode, an emission layer between the first electrode and the second electrode, and a hole transport region between the first electrode and the emission layer is presented.

Abstract: An electroluminescent display device includes a substrate including a first pixel column and a second pixel column that respectively include first pixels and second pixels arranged in a first direction and respectively have a first width and a second width in a second direction, wherein the second pixel column is positioned in the second direction from the first pixel column, and the second width is greater than the first width; a light emitting diode in each first pixel and each second pixel and including a first electrode, a light emitting layer and a second electrode; a first bank positioned between adjacent first pixels and between adjacent second pixels and covering an edge of the first electrode; a second bank positioned between the first and second pixel columns; and a first partition wall across the second pixel column along the first direction and positioned on the first electrode.

Abstract: This disclosure provides a packaging structure for a display substrate, a packaging method and a display device. The packaging structure for the display substrate includes a base substrate, a light-emitting device arranged on the base substrate, and a packaging thin film covering the light-emitting device. The packaging thin film includes an inorganic thin film and an organic thin film that are laminated, and the organic thin film is arranged on a surface of the inorganic thin film away from the base substrate. The packaging thin film includes a central region and a peripheral region surrounding the central region, the inorganic thin film located in the central region has surface energy greater than that of the inorganic thin film in the peripheral region, and the organic thin film in the central region has a thickness less than that of the organic thin film in the peripheral region.

Abstract: A source to facilitate precise vapor deposition in processes to obtain organic light emitting diodes (OLEDs) in a display panel, includes forming a plurality of grooves on a first substrate; in filling organic light emitting materials into the grooves and providing a second substrate to receive the vaporized organic light emitting materials. The first substrate is aligned with the second substrate and the first substrate is heated to vaporize the organic light emitting materials in the grooves. The vapor deposition regions of the second substrate form an organic light emitting material layer after the deposition, the layer can then be used in an OLED display panel. The shadow effect is greatly reduced, a method for the procedure is also disclosed.

Abstract: The present disclosure provides a method for patterning a nanoparticle layer, including steps of: (S1) connecting a first base to a surface of a predetermined area of a substrate, to form a substrate modified with the first base in the predetermined area of the substrate; (S2) depositing the nanoparticle in the predetermined area of the substrate, to form a nanoparticle layer in the predetermined area of the substrate by self-assembling, a ligand of the nanoparticle includes a second base, and the first base and the second base being connected by a hydrogen bond; and (S3) removing the nanoparticle in a non-predetermined area of the substrate.

Abstract: Integrated circuit structures including device terminal interconnect pillar structures, and fabrication techniques to form such structures. Following embodiments herein, a small transistor terminal interconnect footprint may be achieved by patterning recesses in a gate interconnect material and/or a source or drain interconnect material. A dielectric deposited over the gate interconnect material and/or source or drain interconnect material may be planarized to expose portions of the gate interconnect material and/or drain interconnect material that were protected from the recess patterning. An upper level interconnect structure, such as a conductive line or via, may contact the exposed portion of the gate and/or source or drain interconnect material.

Abstract: A semiconductor device includes: a first stack structure; a second stack structure; a slit insulating layer located between the first stack structure and the second stack structure, the slit insulating layer extending in a first direction; a conductive plug located between the first stack structure and the second stack structure, the conductive plug including a first protrusion part protruding to the inside of the slit insulating layer; and an insulating spacer surrounding a sidewall of the conductive plug.

Abstract: One or more embodiments are directed to establishing electrical connections through silicon wafers with low resistance and high density, while at the same time maintaining processability for further fabrication. Such connections through silicon wafers enable low resistance connections from the top side of a silicon wafer to the bottom side of the silicon wafer.

Abstract: A semiconductor memory cell comprising an electrically floating body having two stable states is disclosed. A method of operating the memory cell is disclosed.

Abstract: A display device is discussed, which can ensure transmittance and drive regions having different resolutions using the same driver IC due to a structural difference therebetween within a panel, in a structure having a camera provided under a substrate. The display device can include the substrate having a first region and a second region, a first array unit in the first region and having at least one subpixel having a first light emitting part, and a second array unit in the second region and having a plurality of subpixels. Each of the plurality of subpixels includes a second light emitting part having a smaller area than an area of the first light emitting part.

Abstract: A light emitting display panel includes a substrate, a pixel driving circuit disposed on the substrate, a planarization layer disposed on the pixel driving circuit, a pixel driving electrode disposed on the planarization layer and electrically connected to the pixel driving circuit, a light emitting layer disposed on the pixel driving electrode, and a common electrode disposed on the light emitting layer. The pixel driving electrode includes a plurality of first electrodes apart from one another and a second electrode covering the first electrodes, and at least one of the second electrode or the plurality of first electrodes is connected to the pixel driving circuit.