Abstract: A data storage module alignment system and method for use in a data storage module and enclosure system including a module enclosure having a plurality of bay slots and at least one data storage module. The data storage module alignment system comprises at least one alignment guide that is adapted to be mounted at the module enclosure entrance and at least one guide rail that is adapted to be mounted to the data storage module. The alignment guide includes a plurality of guide channels having rounded edges. The guide rail is sized and shaped for receipt within the guide channels. Typically, the alignment guide further includes a plurality of guide flanges that are arranged asymmetrically along the alignment guide. The inner side of each guide flange defines an edge of one of the guide channels and includes chamfers which facilitate initial alignment of the data storage module within one of the bay slots of the module enclosure.

Abstract: A hard disk drive assembly is electrically connected to a printed circuit board assembly motherboard using a connector on the hard disk drive assembly connected with a mating connector mounted on the motherboard. The hard disk drive assembly is secured to standoffs that allow sufficient space between the hard disk drive assembly and the motherboard for an integrated circuit package to be positioned between the hard disk drive assembly and the motherboard.

Abstract: A leadframe for making an electric connection to a semiconductor die contains a plurality of notches which correspond to the edges of the die. Shorts are thereby prevented between the leadframe and electrical elements near the edge of the die, even when the leadframe is bent in the direction of the die to make a surface mount package. Alternatively or additionally, the leads in the leadframe may contain moats which prevent the epoxy or solder used to attach the leadframe to a die from spreading outward and thereby creating electrical shorts with other leads.

Abstract: A method for improving spatial impression in a four-speaker system using dynamic and piezo transducers. The use of a piezo transducer eliminates the need for a low-pass filter.

Abstract: The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a semiconductor device. The semiconductor device is thermally and electrically coupled to the second metal film, and a thickness of the second metal film is larger than that of the first metal film.

Abstract: The present invention relates to a book-shaped information terminal, and an object of the present invention is to help users to conveniently carry and use a portable computer like a book, as it constitutes an information terminal as a portable computer in such a shape as a book. The present invention comprises an armoring cover which can be opened and closed, a thin film display unit attached and fixed on one side and a main body attached and fixed to another side, opposite to the thin film display unit when the information terminal is folded like a book.

Abstract: The present disclosure provides a computer mounted rack system and an apparatus enabling displacement of a slide mounted chassis. The apparatus includes an elongated member having respective first and second ends and respective first and second surfaces. A handle is also included and is preferably coupled proximate the first end of the elongated member. The apparatus further includes a releasable latch preferably coupled proximate the second end of the elongated member and configured to engage a releasable latch aperture in the slide. Additionally, at least one locking member is preferably coupled to the first surface of the elongated member and is operable to engage the slide.

Abstract: A semiconductor device comprising an insulating film having a device hole, a plurality of bumps formed on the insulating film, a plurality of first leads having end faces thereof exposed on an outline edge of the insulating film, each of the first leads being electroplated and connected with one of the bumps, a plurality of second leads having end portions thereof protruding into the device hole, each of the second leads being electroplated and connected with one of the bumps, and a semiconductor chip connected with the end portions of the second leads in the device hole. The insulating film is outlined to have a cut in a region including each of the exposed end faces of the first leads.

Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

Abstract: An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit board for different wave settings. The component leads are either parallel or perpendicular to the solder wave during the soldering process. In one embodiment, the parallelogram shaped solder thieving pad is disposed contiguous or adjacent to the through hole. In another embodiment, the parallelogram shaped solder thieving pad is spaced from a thin annular ring surrounding the through-hole. In still another embodiment, the pad may be linked to the ring by a thin connecting bridge. Dimensions of the solder thieving pad vary according to the component lead size, spacing, and number of rows.

Abstract: The present invention provides a modular data storage system that can constraint movement of a data storage module within an enclosure during operation, handling, and transportation. The present invention achieves the objective by employing compliant features at strategic locations in the data storage system by utilizing shock/vibration isolators and the frictional forces generated by the compliant elements to introduce damping effects. In addition, this invention provides a locking mechanism that will allow the user to smoothly insert, remove and firmly grip a data storage module.

Abstract: A support bracket, which can be used in a method of reinforcing a printed circuit board, secures the printed circuit board, such as a backplane having a plurality of electrical connectors that engage corresponding electrical connectors of daughter boards. The support bracket includes a cross member attachable to the printed circuit board in a direction substantially transverse to a direction of motion of the daughter boards. The support bracket also includes first and second end support members attached transversely to the cross member at corresponding ends of the cross member. The end support members are fixable to a support surface and are adapted to secure the support bracket in the direction of motion of the daughter boards.

Abstract: A support apparatus for portable computers utilizes a plurality of legs removably coupled to a pedestal that incorporates a storage compartment within which the plurality of removable legs may be stored when not in use. By incorporation of a storage compartment within the pedestal, the overall bulk of the support apparatus is reduced, and furthermore, the removable legs are retained in such a manner that all components of the support apparatus can be transported as a unit.

Abstract: An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.

Abstract: The specification describes a high density I/O IC package in which the IC chip is bonded to a silicon intermediate interconnection substrate (IIS), and the IIS is wire bonded to a printed wiring board. This marriage of wire bond technology with high density I/O IC chips results in a low cost, high reliability, state of the art IC package.

Abstract: A semiconductor package is present along with an associated method. The package comprises a substrate with a top surface and a bottom surface, the substrate having a plurality of electrically conductive vias extending from the top surface of the substrate to the bottom surface of the substrate. A semiconductor device having an active surface, the active surface having a plurality of bonding pads, is attached to the substrate by an adhesive that bas holes that align with the vias. The vias are also aligned with the bonding pads. Solder serves to electrically and mechanically couple each of the bonding pads with a corresponding via. Each of the vias, in turn, is coupled to a solder ball formed on the bottom of the substrate.

Abstract: A Plastic Ball Grid Array electronic package of the Cavity Down type particularly for use in high-frequency applications. In these packages the substrate has a cavity for receiving an active device (chip), which is usually attached to the substrate by means of the layer of glue. Due to the small dimensions of the chip and the gap between the chip and the cavity walls, it is extremely difficult to control the right quantity of glue in the dispensing operations. When the chip is pressed against the bottom of the cavity the glue may overflow and damage the circuits. According to the present invention, a secondary cavity is created inside the primary one and acts as a reservoir for the glue in excess.

Abstract: An ejector device for removing a mobile module from a main board includes a support frame and a lever. The support frame is secured on the main board so as to extend in a direction transverse to a plane of the main board, and is disposed adjacent to the mobile module. The lever includes an ejecting plate portion disposed between the main board and the mobile module, a connecting plate portion and an operating plate portion. The connecting plate portion extends from the ejecting plate portion, and is disposed between the support frame and the mobile module. The connecting plate portion is mounted pivotally on the support frame about an axis parallel to the plane of the main board. The operating plate portion extends from the connecting plate portion, and is operable to cause the connecting plate portion to pivot relative to the support frame and enable the ejecting plate portion to push the mobile module away from the main board.

Abstract: A chip-sized semiconductor device includes a semiconductor element having a plurality of electrodes and a plurality of connecting pads electrically connected to the respective electrodes. A connecting board includes a base substrate having a first surface and a second surface, a plurality of connecting holes extending from the first surface to the second surface, a plurality of lands formed on the first surface to close the respective connecting holes, the lands being arranged in conformity with positions of the connecting pads of the semiconductor element, each of the connecting pads having a surface area smaller than that of the land. The semiconductor element is mounted on the connecting board in such a manner that the connecting pads of the semiconductor element are electrically connected to the respective lands of the connecting board by means of a plurality of bumps, respectively.

Abstract: The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.