Patents Examined by Derris Banks
  • Patent number: 8312612
    Abstract: Disclosed is a method and apparatus for the refurbishing of compaction tooling components, particularly the tips and heads of compaction punches.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: November 20, 2012
    Assignee: Blue Sky Vision Partners, LLC
    Inventor: Luka Gakovic
  • Patent number: 8312628
    Abstract: A method for manufacturing a liquid discharge head includes heating the surface portion of power line that is to be in contact with a member made of resin, thereby forming, from a precious metal layer and a nickel layer, an adhesion layer made of an alloy containing precious metal and nickel as major components.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 20, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Sadayoshi Sakuma, Hirokazu Komuro, Takuya Hatsui, Yuzuru Ishida
  • Patent number: 8312621
    Abstract: A handheld tool device to facilitate maintenance and installation of hollow through-hole audio input jacks on electrical guitars and other electronic musical devices. The tool has an expandable tip that can be placed inside the hollow opening of the through-hole audio input jack, and then be expanded by the operator. The device enables the operator to hold the audio input jack in a fixed position while a nut or other jack fastening device is tightened. Other applications for the device include stabilizing a large variety of different through-hole connectors, embedded in a wide variety of different surfaces.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: November 20, 2012
    Inventor: Christopher John Shahin
  • Patent number: 8307530
    Abstract: A system for introducing a geothermal system having a geothermal line and a releasable grout line into a bore in the earth is described. The grout line is withdrawn at a point where it is desired to introduce grout into the bore in the earth.
    Type: Grant
    Filed: June 13, 2010
    Date of Patent: November 13, 2012
    Assignee: Geothermal Professionals ltd
    Inventors: Kevin E. Neff, Robert G. Silvers
  • Patent number: 8307521
    Abstract: A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: November 13, 2012
    Assignee: Seiko Epson Corporation
    Inventor: Yoshikuni Saito
  • Patent number: 8302294
    Abstract: A method for making a coaxial cable including an inner conductor, an outer conductor, and a dielectric material layer therebetween may include forming the inner conductor by at least forming a bimetallic strip into a tubular bimetallic layer having a pair of longitudinal edge portions at a longitudinal seam. The bimetallic strip may include an inner metal layer and an outer metal layer bonded thereto and coextensive therewith. Each of the longitudinal edge portions may be folded over. The method may also include forming a welded joint between adjacent portions of the folded over longitudinal edge portions and defining surplus material at the welded joint. The method may further include removing the surplus material at the welded joint and forming the dielectric material layer surrounding the inner conductor. The method may also include forming the outer conductor surrounding the dielectric material layer.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: November 6, 2012
    Assignee: Andrew LLC
    Inventor: Alan N. Moe
  • Patent number: 8302296
    Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by friction welding is provided with a monolithic connector body with a bore. A sidewall of the bore is provided with an inward annular projection angled toward a cable end of the bore. A sidewall of the inward annular projection and the sidewall of the bore form an annular friction groove open to a cable end of the bore. The annular friction groove is dimensioned with a taper at a connector end of the friction groove less than a thickness of a leading end of the outer conductor. The taper provides an annular material chamber between the leading end of the outer conductor, when seated in the friction groove, and the connector end of the friction groove.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: November 6, 2012
    Assignee: Andrew, LLC
    Inventor: Kendrick Van Swearingen
  • Patent number: 8302281
    Abstract: A method and apparatus for providing motor vehicle sub-assemblies with unrestricted model mix and quick changeover between models. The apparatus includes a track; a carriage mounted for longitudinal movement along the track between first and second positions; and first and second turrets rotatably mounted on the carriage at longitudinally spaced locations and each including a plurality of circumferentially spaced individual faces and unique tooling fixtures on the respective faces for receiving unique work piece components corresponding to a plurality of motor vehicle body styles.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: November 6, 2012
    Assignee: Comau, Inc.
    Inventor: Velibor Kilibarda
  • Patent number: 8302313
    Abstract: A method of manufacturing a base includes the following steps. First, a plate is provided. Next, the plate is machined to form a bottom frame. The bottom frame has a bottom portion and a plurality of side walls disposed at the bottom portion. Next, whether the bottom frame is designed for being assembled to a first display panel or a second display panel is determined. The size of the first display panel is different from that of the second display panel. Next, if the bottom frame is designed for being assembled to the first display panel, a pad is formed on the bottom portion of the bottom frame such that a first base is formed. Next, if the bottom frame is designed for being assembled to the second display panel, the bottom portion is punched to form a plurality of barricades such that a second base is formed.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: November 6, 2012
    Assignee: E Ink Holdings Inc.
    Inventors: Yu-Sheng Lin, Ted-Hong Shinn, Wan-Tien Chen, Chi-Ming Wu
  • Patent number: 8302282
    Abstract: Placing device for placing a fastener. The device includes a housing, a mounting surface for a fastener and comprising an opening, a drive mandrel comprising a rotation axis and a portion which passes through the opening and that is structured and arranged to engage the fastener, and a fork-shaped receptacle arranged at least one of in an area of the mounting surface, adjacent the mounting surface, and associated with the mounting surface.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: November 6, 2012
    Assignee: Gesipa Blindniettechnik GmbH
    Inventor: Lothar Wille
  • Patent number: 8302292
    Abstract: A truss assembly system may include a truss assembly station. The truss assembly station may be configured to enable assembly of a truss from truss members via an automatic sequential placement of the truss members based at least in part upon a planned location of pre-plated truss members within an assembled truss. The pre-plated truss members may be truss members including at least one connector plate installed thereon prior to placement at the truss assembly station.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: November 6, 2012
    Assignee: Illinois Tool Works Inc.
    Inventors: David L. McAdoo, Timothy K. McAdoo
  • Patent number: 8296921
    Abstract: A method of insulating a space including the steps of: forming an insulation piece using at least one base material that are interlocked so as to produce a body with a predetermined starting shape; and placing the insulation piece in a space to define an insulating barrier between first and second regions between which the space resides.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: October 30, 2012
    Inventor: George Kasboske
  • Patent number: 8296940
    Abstract: A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.
    Type: Grant
    Filed: April 19, 2010
    Date of Patent: October 30, 2012
    Assignee: General Electric Company
    Inventors: Charles Gerard Woychik, John Eric Tkaczyk, Brian David Yanoff, Tan Zhang
  • Patent number: 8296941
    Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: October 30, 2012
    Assignee: RF Micro Devices, Inc.
    Inventors: David J. Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
  • Patent number: 8291581
    Abstract: A plurality of reference holes are formed in the surface of a first substrate made of a first material, and a plurality of columnar members are each fitted in the reference holes in such a manner that at least a part of each of the columnar members projects from the surface of the first substrate. Subsequently, an electrode surface layer made of a second material is formed on the surface of the first substrate in such a manner that an end portion of each of the columnar members are exposed at the surface and then the columnar members are removed. Thus obtained is a substrate-like electrode including at least an electrode surface layer provided with through holes having a cross section matching a sectional shape of the projecting portion of the columnar members.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: October 23, 2012
    Assignees: Mitsui Engineering & Shipbuilding Co., Ltd., ADMAP, Inc.
    Inventor: Fimitomo Kawahara
  • Patent number: 8291583
    Abstract: A packaging method for assembling a captive screw to a printed circuit board (PCB) includes the steps of providing a captive screw having a screw head, a threaded shank and a sleeve; pressing a fixture toward the screw head for a part of the threaded shank to exposed from a distal end of the sleeve, and then clamping the fixture on the sleeve; providing a PCB having through holes and a layer of solder provided thereon; using a tool to pick up the fixture and the captive screw and align the threaded shank with one through hole on the PCB; releasing the fixture and the captive screw from the tool for a flange at the distal end of the sleeve to extend into the through hole; heating, melting and then cooling to harden the solder layer, so that the sleeve is fixedly held to the PCB; and removing the fixture.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: October 23, 2012
    Inventor: Ting-Jui Wang
  • Patent number: 8291565
    Abstract: A bipolar electrostatic chuck refurbishing process in accordance with an aspect of the present invention does not require physical separation of the two electrodes of the electrostatic chuck. One aspect of the present invention is drawn to method of treating a bipolar electrostatic chuck having a front surface and a back surface and comprising a first electrode disposed at the front surface, a second electrode at the front surface and an anodized layer disposed on the front surface, the first electrode and the second electrode.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: October 23, 2012
    Assignee: Lam Research Corporation
    Inventor: Hong Shih
  • Patent number: 8291573
    Abstract: A stator has conductor segments serially wound on a core. Each segment inserted in one of slots of the core has a slanting portion protruding from the slot and inclined toward circumferential and axial directions of the core. Each slanting portion has an oblique portion with a film removal surface and a film removal portion with a film removed surface to have a slanting removal area covered with no insulation film and extending on the oblique portion. Each film removal portion has a connection portion on an end thereof. The connection portions are aligned along a radial direction of the core to form a plurality of end pairs. The connection portions of each end pair are connected with each other so as to serially connect the segments with one another.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: October 23, 2012
    Assignee: Denso Corporation
    Inventor: Takashi Tokizawa
  • Patent number: 8286350
    Abstract: An object of the invention is to provide a method of manufacturing a liquid discharge head in which a distance between a discharge opening and an energy generating element is uniform, simply and with good precision.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: October 16, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tsuyoshi Takahashi, Shuji Koyama, Masaki Ohsumi, Masahisa Watanabe
  • Patent number: 8286340
    Abstract: A printed circuit board for mounting an electronic part includes a mounting surface configured so that the electronic part is mounted. A warpage correcting metal pattern is provided on a back surface of the printed circuit board opposite to the mounting surface. The warpage correcting metal pattern may be formed of a metal film or a metal layer joinable with a thermally meltable joining material.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: October 16, 2012
    Assignee: Fujitsu Limited
    Inventor: Yukihiko Ohashi