Patents Examined by Derris Banks
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Patent number: 8234784Abstract: Apparatus and method for extending the life of a booster valve in an automatic transmission. The booster valve commonly resides in the pump stator body and is modulated by reverse oil pressure and pressure control solenoid pressure signals. Pressure signals from the reverse oil pressure and the pressure control solenoid force a booster valve piston towards a pressure regulator valve piston also generally residing in the pump stator body. The booster valve piston slides inside a booster valve sleeve, and over time, the booster valve sleeve wears and the performance of the booster valve degrades or fails. The present invention replaces an original inner booster valve spring with a longer (or in some cases shorter) replacement booster valve spring to shift the operating range of the booster valve piston to an unworn portion of the booster valve sleeve to extend the life of the booster valve.Type: GrantFiled: February 13, 2008Date of Patent: August 7, 2012Inventor: Steven W. Younger
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Patent number: 8234787Abstract: A first film adhesive between actuator units and a supply port plate, a second film adhesive between a reservoir plate and the supply port plate, and a third film adhesive between the reservoir plate and a nozzle plate are each provided with round holes having an equal size and formed in correspondence to the locations of nozzle communication ports. Thanks to the round holes having the equal size one another, irregularity in capacities of spaces formed by layers of the first film adhesive, the second adhesive, and the third film adhesive are reduced, thereby reducing a difference of passage resistance caused in the nozzle communication ports. Accordingly, it is possible to realize a printing head capable of reducing irregularity in an amount of ejected ink and a speed of ink drops between nozzles.Type: GrantFiled: March 24, 2011Date of Patent: August 7, 2012Assignee: Seiko Epson CorporationInventor: Satoshi Sugawara
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Patent number: 8234780Abstract: A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.Type: GrantFiled: February 27, 2008Date of Patent: August 7, 2012Assignee: Universal Instruments CorporationInventors: Laurence A. Harvilchuck, George R. Westby
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Patent number: 8230590Abstract: A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.Type: GrantFiled: January 3, 2008Date of Patent: July 31, 2012Assignee: Fujitsu Semiconductor LimitedInventors: Takao Nishimura, Yoshiaki Narisawa
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Patent number: 8225477Abstract: A fairing removal tool and a method of using the tool provide for an improved method of removing a fairing from an engine inlet case. The fairing removal tool employs a hook and notch to engage the fairing and release the bonds joining the fairing to an inner structural element of the inlet case.Type: GrantFiled: March 13, 2008Date of Patent: July 24, 2012Assignee: United Technologies CorporationInventor: Phillip Alexander
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Patent number: 8225479Abstract: A first and a second object (1 and 2) are joined with the aid of a joining element (8) including at least in the region of its distal and proximal ends (8.1 and 8.2) a thermoplastic material. Two blind holes (5 and 6) facing each other are provided in the two objects (1 and 2) and the joining element (8) is positioned in the blind holes such that its distal and proximal ends (8.1) are in contact with the bottom faces of the blind holes and such that there is a gap (9) between the two objects (1 and 2). This assembly is then positioned between a support (3) and a sonotrode (4). The sonotrode (4) and the support (3) are forced towards each other, while the sonotrode (4) is vibrated, thereby liquefying at least part of the material having thermoplastic properties, there, where the joining element ends (8.1 and 8.2) are pressed against the bottom faces of the holes (5 and 6) and allowing the liquefied material to infiltrate into pores of the hole surfaces or unevennesses or openings provided in the hole surfaces.Type: GrantFiled: May 6, 2011Date of Patent: July 24, 2012Assignee: Woodwelding AGInventors: Colin Clinch, Marcel Aeschlimann, Laurent Torriani, Elmar Mock
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Patent number: 8225507Abstract: A hybrid rocket motor is manufactured by photopolymerizing the solid fuel grain in a stereolithography method, wherein fuel grains in a plastic matrix are deposited in layers for building a solid fuel rocket body in three dimensions for improved performance and for a compact design.Type: GrantFiled: February 28, 2008Date of Patent: July 24, 2012Assignee: The Aerospace CorporationInventor: Jerome K. Fuller
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Patent number: 8225504Abstract: In one embodiment, a process, for fabricating a medical lead for stimulation of tissue of a patient, comprises: forming a plurality of electrode assemblies wherein each electrode assembly of the plurality of electrode assemblies comprises a respective plurality of segmented electrodes angularly separated by ribs formed in one or more segments of thermoplastic tape; electrically coupling a conductor to each segmented electrode; molding polymer material around each segmented electrode of the plurality of segmented electrodes to interlock each segmented electrode with polymer material to form a distal end of the medical lead; and fusing the one or more segments of thermoplastic tape of each of the plurality of electrode assemblies with the polymer material.Type: GrantFiled: April 23, 2010Date of Patent: July 24, 2012Assignee: Advanced Neuromodulation Systems, Inc.Inventors: Don Dye, Cory Brinkman
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Patent number: 8220148Abstract: A method for producing a first flexible conductor carrier includes applying at least one conductor track to a base insulating film. A covering layer is applied to the conductor track and the base insulating film in such a way that, in at least one conduction region of the first flexible conductor carrier, the conductor track is completely enclosed by the covering layer and the base insulating film. The base insulating film is free of the conductor track and the covering layer in at least one insulating region. The conductor track is free of the covering layer in at least one contact region of the first flexible conductor carrier.Type: GrantFiled: May 14, 2007Date of Patent: July 17, 2012Assignee: Continental Automotive GmbHInventors: Georg Fischer, Josef Loibl, Karl Smirra
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Patent number: 8220133Abstract: The invention relates to the attachment of a multiple-conductor electronic cable to an electronic circuit in a sealed housing. The cable is placed in a sheath of a heat-deformable material and the method comprises the following steps: placing a rigid bushing (40) with a protruding collar (48) on the exposed end of the cable, heating the end in a conical mold or softening the sheath, inserting the bushing between the cable conductors and the softened sheath, the collar of the bushing pushing the sheath material until the conical portion of the mold is filled, cooling the sheath for solidifying it, extracting the end of the cable from the mold, the end having a conical portion with an increasing diameter ending with the protruding collar, inserting the cable in the housing opening from the inside before closing the housing. The invention can be used or an intra-oral dental radiology sensor.Type: GrantFiled: April 14, 2008Date of Patent: July 17, 2012Assignee: E2V SemiconductorsInventor: Frédéric Girard
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Patent number: 8220143Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.Type: GrantFiled: May 22, 2009Date of Patent: July 17, 2012Assignee: Kuang Hong Precision Co., LtdInventor: Cheng-Feng Chiang
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Patent number: 8220145Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: December 7, 2007Date of Patent: July 17, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr.
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Patent number: 8220136Abstract: A method for forming a planarized surface for at least one bar of sliders for utilization in a hard disk drive is disclosed. In general, at least one bar of sliders is placed on an adhesive layer. A single thermoplastic layer is then provided above the at least one bar of sliders. The single thermoplastic layer is then heated to a softening temperature such that the single thermoplastic layer will flow between the at least one bar of sliders. The single thermoplastic layer is then cooled to form a planarized surface of both said single thermoplastic layer and said at least one bar of sliders at said adhesive layer.Type: GrantFiled: May 3, 2007Date of Patent: July 17, 2012Assignee: Hitachi Global Storage Technologies Netherlands B. V.Inventors: Cherngye Hwang, Jorge Goitia, Kenneth L. Larson, Dennis R. McKean
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Patent number: 8222532Abstract: A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.Type: GrantFiled: June 1, 2011Date of Patent: July 17, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Shigetsugu Muramatsu, Yasuhiko Kusama
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Patent number: 8215001Abstract: A tapered cage coil is prepared, having a small-diameter top coil end 101 and a large-diameter base coil end. The tapered cage coil is axially inserted into a stator core. Then, the tapered cage coil is radially expanded to thrust slot-accommodated portions of the coil into slots of the stator core. This can eliminate the necessity of deforming the base coil end to thereby facilitate the manufacturing procedures. At the same time, possible spring back can be mitigated.Type: GrantFiled: April 21, 2009Date of Patent: July 10, 2012Assignee: Denso CorporationInventors: Akito Akimoto, Masaomi Dobashi
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Patent number: 8215009Abstract: This is directed to a power adapter plug arm manufactured from a single piece of material. The plug arm can include a plug operative to extend into a wall socket, an elongated plate coupled to an end of the plug such that the plug extends from a first surface of one end of the plate, and a pin coupled to the opposite end of the plate and extending from the opposite surface of the plate. The pin can be operative to engage a circuit board of the power adapter to provide power received from the wall socket to an electronic device coupled to the power adapter. To enhance the strength of the plug arm, the plate can be manufactured by creating a co-axial plug and a stem from a single piece of material, bending the stem, and cold heading the bent portion of the stem to form a plate. Because the cold heading process involves cold working the material, the arm and in particular the bridge member at the interface between the plate and the stem can become stronger as a result of the manufacturing process.Type: GrantFiled: August 23, 2011Date of Patent: July 10, 2012Assignee: Apple Inc.Inventors: Malcolm Early, Brandon Connors, Kevin Walsh
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Patent number: 8209839Abstract: A process for redesigning a distressed component, such as a turbine blade in a gas turbine engine, in which the distressed component is under thermal and structural loads, for improving the life of the component. The process includes obtaining the operating conditions of the machine in which the distressed component is used, finding the boundary conditions under which the distressed component operates, producing a 3-dimensional model of the distressed component with such detail that the distress levels are accurately represented on the model, subjecting the model to a series of technical analysis to predict a life for the component, reiterating the technical analysis until the levels of distress on the model accurately represent the distress that appears on the actual component, and then predicting a remaining life of the component based on the analysis, or redesigning the model and reanalyzing the model until a maximum life for the component has been found.Type: GrantFiled: August 3, 2010Date of Patent: July 3, 2012Assignee: Florida Turbine Technologies, Inc.Inventors: Joseph D Brostmeyer, Andrew R Narcus
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Patent number: 8209855Abstract: A method of splicing a power cable used to supply electricity to down hole submersible pumps uses a pair of annular armored seal members that are slid over the ends of an insulated electrical conductor being spliced together. Each armored seal member has a plurality of O-ring seals on one end thereof and a plurality of openings in the side thereof and are used to cover and protect a crimped conductor being spliced together. The method and apparatus allow a pair of spliced electrical cables to be used in an adverse environment.Type: GrantFiled: October 26, 2010Date of Patent: July 3, 2012Assignee: M.C. Miller Co.Inventors: Albert J. Hilberts, James Miller, James H. Muir
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Patent number: 8209862Abstract: An insulating material formed by impregnating a base material with a liquid composition and curing the liquid composition, the liquid composition being 20 to 50 parts by weight of a PMDA-ODA mixture, the PMDA-ODA mixture including pyromellitic dianhydride (PMDA) and oxydianiline (ODA) mixed in a weight ratio of 40:60 to 60:40; 50 to 80 parts by weight of a triazine derivative; and 300 to 600 parts by weight of an organic solvent. A printed circuit board includes an insulator formed of the above insulating material; a circuit pattern formed on one or either side of the insulator; and a via penetrating the insulator.Type: GrantFiled: September 21, 2011Date of Patent: July 3, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jong-Seok Song
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Patent number: 8205327Abstract: A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.Type: GrantFiled: November 13, 2006Date of Patent: June 26, 2012Assignee: Panasonic CorporationInventors: Hidenori Miyakawa, Atsushi Yamaguchi, Kazuhiro Nishikawa, Kunio Hibino