Abstract: An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted.

Abstract: A method is provided for fabricating a seal ring. The method includes positioning a mount assembly adjacent to at least one of an inner diameter and an outer diameter of an annular seal ring, and securing the annular seal ring to the mounting assembly. The method also includes forming at least one of an admission side hook and a steam joint side hook in the annular seal ring.

Abstract: There is provided a structure of a vibration insulating member for firmly fixing the member between a fuel tank mounted on a vehicle body by means of a tank band and the vehicle body. The vibration insulating member includes an engaging protrusion that is fixed to a fixing hole that is made through the vehicle body in a direction orthogonal to a direction in which the tank band is fastened.

Abstract: A method for manufacturing a nozzle substrate includes forming a first hollow recess in a first surface of a silicon substrate, forming a liquid-resistant protective film on the first surface of the silicon substrate including an inner wall of the first hollow recess, forming a second hollow recess in a first surface of a glass substrate, bonding the first surfaces of the silicon substrate and the glass substrate by anodic bonding, reducing a thickness of the glass substrate from a second surface until an aperture is formed in a bottom surface of the second hollow recess to form a second nozzle hole disposed on a droplet feed side, and reducing a thickness of the silicon substrate from a second surface until an aperture is formed in a bottom surface of the first hollow recess to form a first nozzle hole disposed on a droplet discharge side.

Abstract: The present invention is directed to a physiological recording device, or other types of sensors to detect a biopotential, and more particularly, a physiological recording electrode that can be used without skin preparation or the use of electrolytic gels. The invention is further directed to the configurations of structures on the physiological recording electrode's lower surface. The structures having a length, width, and height, which are capable, at least in part, of transmitting an electric potential from the skin which can be measured. The structures may or may not limit the depth of application, and/or anchor the electrode or other device during normal application, and/or allow for uniform application of the electrode or other device over unprepared skin.

Abstract: A process is provided for manufacturing a multielectrode that may be used to record a bioelectrical potential difference at a detection site. The manufacturing process may comprise manufacturing a carrier from multiple thin layers of an insulating material. The manufacturing process may further comprise providing at least one recording electrode of a set of electrode pairs on at least one of the layers of the carrier. Each recording pair may include one active electrode surface and a different reference electrode surface. Also, the manufacturing process may further comprise folding, fastening, and gluing the layers of the insulating material to one another.

Abstract: A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture.

Abstract: A mounting assembly for attaching the drive system and stand to a ring in a medicine gantry is disclosed. The mounting assembly includes at least one mounting bar (e.g., two mounting bars), at least one mounting plate and at least one adjuster (e.g., a screw). The mounting bar is securable to a portion of the ring. The mounting bar includes a base and at least one transverse face. At least a portion of the base is substantially parallel to a surface of a portion of the ring and at least a portion of the transverse face is substantially perpendicular to the surface of the portion of the ring. The mounting plate is secured to the drive system and is securable to the transverse face of the mounting bar. Movement of the adjuster moves the drive assembly relative to the mounting bar when the mounting plate is adjacent the transverse face of the mounting bar.

Abstract: Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product.

Abstract: The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.

Abstract: A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate.

Abstract: A method of manufacturing a coil assembly of a rotary electric machine is disclosed wherein first and second coil wire segments are located on an axis direction in opposition to each other to allow first turn portions of the first and second coil wire segments to intersect with each other (in locating step). Engaging movement, composed of a forward transferring movement, a rotating movement and a translating movement, is conducted on the second coil wire segment with respect to the first coil wire segment to allow the first turn portion of the second coil wire segment to engage a second turn portion of the first coil wire segment (first engaging step). Conducting the engaging movement allows to engage a third turn portion of the first coil wire segment (second engaging step).

Abstract: A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity.

Abstract: There is provided a fixing method for fixing components together in which two components in the form of a first component and a second component are positioned such that they are mutually superimposed in predetermined relative positions, and are then fixed together, wherein the first component has at least two portions for engagement that are recessed in a contact surface thereof which is placed against the second component towards a surface thereof which is located on an opposite side from the contact surface, and the second component is formed from thermoplastic resin and has at least two protruding portions that protrude from positions that correspond to the portions for engagement of the first component on a surface of the second component which is located on the opposite side from a contact surface thereof which is placed against the first component, and wherein the fixing method for fixing components together includes: a first step in which the contact surfaces of both the first component and the second

Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.

Abstract: Disclosed are a coreless packaging substrate and a manufacturing method thereof. The substrate includes a built-up structure and a first wiring layer. The built-up structure has a first outside and an opposite second outside, and includes one or more second dielectric layers and second wiring layers, and a plurality of conductive vias. The second dielectric layers have first and second surfaces respectively facing the first and second outsides. The second wiring layers are disposed on the second surface. The conductive vias are disposed in the second dielectric layer. The outermost second wiring layer at the second outside has a plurality of second conductive pads. The first wiring layer is embedded into and exposed from the first surface of the outermost second dielectric layer at the first outside, and has a plurality of first conductive pads. The conductive vias electrically connect the first wiring layer and the second wiring layer.

Abstract: A method for production of a membrane/electrode unit for a fuel cell is disclosed. The conducting polymer membrane is compressed with two electrodes until a given compression is achieved. The method permits an increase in resting voltage of the membrane/electrode unit in use, the amount of damage during production is reduced, and a constant thickness within a production run is achieved.

Abstract: An armature for an electric motor has a lamination stack on a shaft with a commutator mounted on one end of the shaft. Magnet wires wound in slots in the lamination stack, the commutator and armature shaft are at least partially encapsulated in thermoset. The commutator has a commutator ring divided into a plurality of segments with slots between the segments that are filled with a second plastic when the commutator is made by molding a core of the second plastic, such as phenolic, in the commutator ring before the commutator ring is mounted on the armature shaft. Prior to molding the thermoset, the commutator ring is sealed. The seal prevents the thermoset from flowing into the slots between the commutator ring segments or over the commutator ring.