Abstract: An apparatus for assembling an electronic device is disclosed, which includes one or more grid holders for maintaining one or more grids in association with a plurality of conducting components positioned perpendicular to the grid(s). One or more insulating components are also provided for mounting and supporting the conducting components. The grid holder(s) can be pushed onto the conducting components in order to eliminate the need for applying spot weld currents to the conducting components and thereby provide a weldless assembly apparatus for the precise construction of an electronic device.

Abstract: Methods are provided for fabricating a write head with a self aligned wrap around shield and a self aligned flared region of a write pole. A flare point and a track width of a write pole may be fabricated using multiple processes. The multiple processes utilize several masking structures to define the track width and the flare point of the write pole. A mask structure is formed to cover a first portion of the write pole. An edge of the mask structure adjacent to an exposed second portion of the write pole defines a flare point of the write pole. Various structures of the write head, including shield gap layers, a wrap around shield and a flared region (e.g., the yoke) of the write pole may be fabricated from the flare point defined by the mask structure.

Abstract: According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

Abstract: A wire routing tool includes a guiding tip, a malleable shaft having a first end operatively connected to said guiding tip and a second end, and a guiding head having a first end operatively connected to said second end of said malleable shaft and a second end including a connector.

Abstract: The manufacturing device for bending an electromagnetic element of an electrical machine, which includes a stator lamination (5), has a first device (10) for bending the stator lamination (5) to form a pre-curved stator lamination and a second device (25) for final forming of the pre-curved stator lamination. The second device (25) includes a first assembly (29) for axially fixing and pressing the pre-curved stator lamination and a second assembly for radially centering and pressing the pre-curved stator lamination. The first device (10) includes a bending mandrel (11) around which the stator lamination (5) bendable, which has an outer diameter that is larger than an inner diameter of the fully bent electromagnetic element.

Abstract: To provide a reliable terminal crimping apparatus and a terminal crimping method, which crimps an electric wire to a terminal having crimping pieces, ends of which curve in a direction of approaching each other, the terminal crimping apparatus includes a first die for placing the terminal on a surface thereof, a second die arranged correspondingly to the first die and freely approaching and parting the first die to crimp the crimp pieces by approaching the first die, and a third die arranged correspondingly to the first die and freely approaching and leaving from the first die to approach the first die before the second die crimps the crimping piece so as to push the electric wire toward the bottom plate and insert the electric wire between the pair of crimp pieces.

Abstract: Embodiments of a process comprising forming one or more micro-electro-mechanical (MEMS) probe on a conductive metal oxide semiconductor (CMOS) wafer, wherein each MEMS probe comprises a cantilever beam with a fixed end and a free end and wherein the CMOS wafer has circuitry thereon; forming an unsharpened tip at or near the free end of each cantilever beam; depositing a silicide-forming material over the tip; annealing the wafer to sharpen the tip; and exposing the sharpened tip.

Abstract: A resonant element is manufactured through a process including a setting step and a forming step. A substrate of the resonant element is made of a dielectric material. A ground electrode is formed on a rear principal surface side of the substrate. Principal-surface electrodes that define resonators together with the ground electrode and the dielectric material are formed on a front principal surface side of the substrate. An electrode protecting layer is formed on substantially entire surfaces on a front principal surface side of the principal-surface electrodes and the substrate. A coupling adjusting electrode with both ends facing a plurality of the principal-surface electrodes is formed on a front principal surface side of the electrode protecting layer. In the setting step, the shape of the coupling adjusting electrode is set in each manufactured lot.

Abstract: An arrangement for fastening a support of a scale of a linear measuring device on a mounting surface of an object to be measured. The arrangement includes a clamping jaw and a force-exerting element urging the clamping jaw against the support. The clamping jaw acts together with the support in such a way that the clamping jaw urges said support with a clamping force that includes 1) a first force component against the mounting surface by the force-exerting element and 2) a second force component that urges the support against an attachment face extending transversely to the mounting surface. The attachment face is directly constituted by an attachment body, which can be fixed positively and free of play in a receptacle on the object to be measured.

Abstract: Embodiments in accordance with the present invention relate to the design and manufacturing of inexpensive photovoltaic or thermal receivers for cost-effective solar energy conversion of concentrated light. Particular embodiments in accordance with the present invention disclose the design of a photovoltaic receiver and a low-pressure, low-flow-rate liquid cooler. Embodiment of the present invention also disclose a preferred low-cost and scalable manufacturing approach.

Abstract: A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.

Abstract: An AT cut quartz crystal resonator element includes a quartz crystal element piece having an exciting part formed from an AT cut quartz crystal plate in a rectangular shape having an X-axis direction of a quartz crystal set to a long side, and an exciting electrode formed on each of front and back main surfaces of the exciting part, in which each side surface in the longitudinal direction of the exciting part is composed of two faces, an m-face of a quartz crystal and a crystal face other than the m-face.

Abstract: A method and apparatus for compressing the endplate of an electric generator to relieve the restraining force on a plurality of key blocks that restrain the endplate in compression. The method includes simultaneously applying independent compressive loads at each of the key block locations to the endplate to relieve pressures on the key blocks and removing the key blocks so the endplate can be removed.

Abstract: A method for fabrication of a filter includes forming an input transformer pole in a first substrate by forming a first conductive via, forming an output transformer pole in the first substrate by forming a second conductive via, forming one or more filter poles in the first substrate between the input transformer pole and the output transformer pole by forming one or more conductive vias in the first substrate between the input transformer pole and the output transformer pole, fabricating one or more tuning elements on a second substrate, wherein the number of tuning elements corresponds to the number of filter poles between the input transformer pole and the output transformer pole, and bonding the second substrate to a top surface of the first substrate so that each tuning element on the second substrate is aligned with and overlays a filter pole on the first substrate.

Abstract: A method of producing a busbar structure includes a busbar arranging step for arranging a plurality of the busbars at predetermined positions in a cavity which is formed between a fixed mold and a movable mold which can be clamped and opened with respect to the fixed mold, and clamping the two molds, a resin filling step for filling molten resin into the cavity in which the busbars have been arranged, and a busbar fixing step for hardening the molten resin which has been filled thereby to fix the busbars at predetermined positions with the hardened resin, and opening the two molds. Interposed pins to be interposed between the busbars which are arranged in close proximity to each other are detachably disposed in an engaged part of the movable mold, and removed from a molded product when the two molds are opened.

Abstract: A method of and a device for mounting and functional verification of roll fittings (4) in rolling mill stands (1), wherein at least a partial number of the roll fittings (4) forms a respective module (5), with savings of mounting and verification time, and wherein the modules (5) are arranged, for pre-assembly with functional verification, on a mounting plate outside of the roll stand (1), is adjusted and/or verified, and at least one adjusted and/or verified module (5) is operatively arranged between two rolling mill stands (1), primarily, in the stand gap (9) and is arranged on a base frame (8) at constructively fixable support points (10).

Abstract: A combined terminal is made by combination of first and second terminals. The first terminal has a first plate portion. The second terminal has a second plate portion and a window portion formed in the second plate portion. The first and second terminals are combined so that the first and second plate portions are superposed while the first terminal remains to be linked to a frame by a link portion therebetween. The combined first and second terminals are removed from the frame by cutting the link portion through the window portion.

Abstract: A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

Abstract: A process for mechanical assembly and electrical interconnection of the functional components of an active implantable medical device. A first step involves preparing an interconnection flex circuit (20) that is able to be electrically and mechanically linked to an electronic circuit module (14), a supply battery (12) and a series of feedthrough terminals (16) of the device, prior to being placed in a common case. The flex circuit has a series of pads (34) for linking to homologous metallizations (46) of the substrate. The mechanical assembling and electrical linking of these pads (34) to the metallizations (46) is performed without either the use of any activation flux or introduction of fusible brazing, and rather by applying an intermediate anisotropic conductive material (38) placed between the pads (34) and metallizations (46), followed by polymerizing this material. The applying and polymerizing are performed under controlled conditions of pressure, temperature and duration.

Abstract: A method of forming structure. A substrate and an interposer are provided. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N?2). N interposer channels are coupled to the N substrate channels so as to form M continuous loops (1?M?N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.