Abstract: A method of manufacturing an inkjet print head simplifies a manufacturing process and uniformly forms an ink channel and includes forming a chamber layer using a low-speed optical hardening material on a substrate, hardening regions of the chamber layer for the wall of an ink channel by selectively exposing the chamber layer to light, forming a nozzle layer using a high-speed optical hardening material, having a higher optical reaction speed than that of the low-speed optical hardening material, on the chamber layer, hardening regions of the nozzle layer other than nozzles by selectively exposing the nozzle layer to light, and forming the ink channel and the nozzles by developing the chamber layer and the non-exposed regions of the nozzle layer.

Abstract: A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information.

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.

Abstract: A manufacturing method for integrating a passive component within a substrate is disclosed. The manufacturing method comprises the steps of: providing a circuit layer, wherein a positioning blind hole is formed in the circuit layer; forming a conductive material in the positioning blind hole; positioning the passive component in the positioning blind hole of the circuit layer and electrically connecting the passive component to the circuit layer via the conductive material in the positioning blind hole; and laminating a core layer, the passive component, and the circuit layer as the substrate.

Abstract: A tool for installing connectors on cables includes a base member and a plunger movably mounted on the base member. A lever mechanism on the base member moves the plunger. There is a wheel member that carries a plurality of dog fixtures thereon. A detent mechanism provides engagement between the wheel member and the base member to define a plurality of rotational positions for the wheel member. In each rotational position, a dog fixture is aligned with the plunger. Preferably, each dog fixture on the wheel member is configured to receive a different size cable.

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract: The invention relates to a device (11) for handling an article (13) such as a coil spring, and to an installation for handling an article. The device (11) comprises a body (10) having an internal housing (12) suitable for containing said article (13), said housing (12) presenting at least one open end (10A, 10B) and a constriction zone (14) that is suitable in a stable state, in which said constriction zone (14) presents a reduce dimension (D14X) that is reduced in a first direction (X), for retaining said article (13) inside the body (10), and for being deformed to adopt a deformed configuration enabling said article (13) to be inserted into the housing (12) or enabling said article (13) to be extracted from the housing (12). The installation includes force-application means for acting on the device to change it between its stable state and its deformed configuration.

Abstract: A wiring substrate comprises: a flexible substrate having a first region and a second region; a wiring line formed on the flexible substrate; and an electronic element that is disposed on the flexible substrate in the first region and electrically coupled to the wiring line. Flexibility of the first region is lower than flexibility of the second region.

Abstract: A method of fabricating an inkjet printhead. The method includes the steps of: (a) forming a plurality of MEMS ink ejection assemblies on an ink-ejection surface of a silicon substrate, each ink ejection assembly being sealed with roof material spanning across the ink ejection assemblies to define a nozzle plate; (b) etching partially into the roof material to form simultaneously a respective nozzle rim for each ink ejection assembly and a plurality of projections patterned across the nozzle plate between nozzle rims; and (c) etching through the roof material to form a respective nozzle aperture for each ink ejection assembly. The projections patterned across the nozzle plate between nozzle rims are useful for reducing stiction between particulates and the nozzle plate.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.

Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract: A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved.

Abstract: A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.

Abstract: A method and apparatus are provided for total profile machining of a part, such as from a block of thermoplastic polymer. A first side of the part is machined together with an encircling recess. A registration/potting fixture is placed into the encircling recess. The registration/potting fixture is used to evacuate air from the machined side of the part and to pressure pack degassed fluid potting compound against the machined side of the part. The registration/potting fixture is cooled such as with a coolant to solidify the potting material. Then the registration/potting fixture is used to fixture the block in a new orientation for CNC machining another side of the part. Upon removal of the potting material from the part, the total profile machined part is freed for shipment to the customer.

Abstract: The present invention provides a system and method for providing a improved device for dismounting integrated circuits for rework tools in the fabrication and manufacture of hard disk drives. Embodiments of the present invention include a vacuum cap with suction capabilities for dismounting the integrated circuits. The vacuum cap includes a cylindrical portion with a vacuum path for holding a rod-like vacuum cylinder which when pressurized causes the integrated circuit to dismount. Embodiments of the present invention further include a light weight aluminum heat-shield that is disposed around the vacuum cap to protect the vacuum cap from excessive heat and to preserve the suction capabilities of the vacuum cap. In one embodiment the heat shield acts as a stopper to prevent the vacuum cap from moving upwards and helps the vacuum cap from absorbing multiple mechanical stress in order to protect the vacuum cylinder from being damaged.

Abstract: A shipping comb combined with a head stack assembly (HSA) which includes sliders recording data onto or reading data from disks, suspensions having the sliders thereon, and end-taps at front ends of the suspensions, the shipping comb preventing the HSA from being damaged, the shipping comb including a body unit having protruding suspension spacers which are each inserted between middle portions of a pair of suspensions having a pair of sliders facing each other to prevent a collision of the middle portions of the pair of suspensions, and a head unit having protruding end-tap spacers inserted between the end-taps of the pair of the suspensions to prevent a collision of the front ends of the pair of suspensions, and connected to a front end of the body unit with a hinge.

Abstract: A capacitor device includes a capacitor Q constituted by a lower electrode (12) formed on a substrate (10), a dielectric film (14), and an upper electrode (16); an insulating film (18) covering the capacitor Q; a first contact hole (18a) formed in the insulating film (18) on a connection portion (16a) of the upper electrode (16); an electrode pad (20) for preventing a diffusion of solder, formed in the first contact hole (18a); and a solder bump (22) electrically connected to the electrode pad (20), and the upper electrode (16) has a protrusion portion (16a) protruding from the dielectric film (14), and is connected to the first contact hole (18a) on the protrusion portion (16a).

Abstract: A method for manufacturing a conductive contact holder includes forming, from a conductive material, a substrate having a hollow portion to which a holder member for holding a plurality of conductive contacts can be fitted; fixing the substrate formed from the conductive material and an insulating member by fitting the substrate and the insulating member into the hollow portion of the substrate, the insulating member being a raw material of the holder member; polishing a surface of the fixed holder member and a surface of the substrate adjoining the surface so as to make the surfaces smooth; and forming a plurality of holder holes for containing the conductive contacts, respectively, the holder holes penetrating the holder member, the surface of which is polished. The fixing includes filling an insulating adhesive between the holder member and the substrate.

Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.