Abstract: Adaptive read-threshold schemes for a memory system determine read-threshold with the lowest BER/UECC failure-rates while continuing to serve the host-reads with the required QoS. When it is determined that the QoS or other quality metric is not met for a particular read-threshold, which may be an initial, default, read-threshold, the performance of other read-thresholds are estimated. These estimates may then be used to determine an optimal read-threshold. During the iterative process, selection variables, e.g., how many times, and for which read commands, to use each of the non-default read-thresholds in future read-attempts may be determined on-the-fly.

Abstract: A semiconductor device includes a stack structure comprising decks. Each deck of the stack structure comprises a memory element level comprising memory elements and control logic level in electrical communication with the memory element level, the control logic level comprising a first subdeck structure comprising a first number of transistors comprising a P-type channel region or an N-type channel region and a second subdeck structure comprising a second number of transistors comprising the other of the P-type channel region or the N-type channel region overlying the first subdeck structure. Related semiconductor devices and methods of forming the semiconductor devices are disclosed.

Abstract: A timing control circuit in an integrated circuit memory device. The circuit has an input line, a first output line and a second output line. The input line configured to receive a control signal for the timing control circuit to generate, a first selection input on the first output line and a second selection input on the second output line. In response to the control signal transitioning from a first state to a second state, the first selection input completes a first transition before the second selection input starts a second transition (e.g., for selection between 0V and ?4.5V); and in response to the control signal transitioning from the second state to the first state, the second selection input completes a third transition before the first selection input starts fourth transition (e.g., for selection between 5V and 1.2V). The sequential transitions avoid simultaneous selection of 5V and ?4.5V.

Abstract: A memory cell includes a first anti-fuse element, a first select transistor, a second anti-fuse element, a second select transistor, and a sensing control circuit. The first anti-fuse element is coupled to an anti-fuse control line, and the first select transistor transmits a voltage between a first bit line and the first anti-fuse element according to a voltage on the word line. The second anti-fuse element is coupled to the anti-fuse control line. The second select transistor transmits a voltage between a second bit line and the second anti-fuse element according to the voltage on the word line. The sensing control circuit provides a discharging path to a system voltage terminal from the first select transistor or the second select transistor according to states of the first anti-fuse element and the second anti-fuse element during a read operation.

Abstract: Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Different calibration algorithms and systems are also disclosed. Optionally, the duration of a programming voltage can change as the number of cells to be programmed changes.

Abstract: A power on reset method for a resistive memory storage device is provided and includes performing a forming procedure on a memory cell of the resistive memory storage device. The forming procedure includes applying at least one forming voltage and at least one reset voltage to the memory cell. The forming procedure further includes a thermal step. The step of applying at least one reset voltage to the memory cell may be preformed before or after the thermal step. After one forming voltage is applied, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. After the thermal step, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. In addition, after one reset voltage is applied, if the memory cell passes verification, the next reset voltage is not applied to the memory cell.

Abstract: A circuit includes a memory array, a write circuit configured to store data in memory cells of the memory array, a read circuit configured to retrieve the stored data from the memory cells of the memory array, and a computation circuit configured to perform one or more logic operations on the retrieved stored data. The memory array is positioned between the write circuit and the read circuit.

Abstract: Methods, systems, and devices for dual mode ferroelectric memory cell operation are described. A memory array or portions of the array may be variously operated in volatile and non-volatile modes. For example, a memory cell may operate in a non-volatile mode and then operate in a volatile mode following a command initiated by a controller while the cell is operating in the non-volatile mode. The memory cell may operate in the volatile mode and then operate in the non-volatile mode following a subsequent command. In some examples, one memory cell of the memory array may operate in the non-volatile mode while another memory cell of the memory array operates in the volatile mode.

Abstract: Methods, systems, and devices for dual mode ferroelectric memory cell operation are described. A memory array or portions of the array may be variously operated in volatile and non-volatile modes. For example, a memory cell may operate in a non-volatile mode and then operate in a volatile mode following a command initiated by a controller while the cell is operating in the non-volatile mode. The memory cell may operate in the volatile mode and then operate in the non-volatile mode following a subsequent command. In some examples, one memory cell of the memory array may operate in the non-volatile mode while another memory cell of the memory array operates in the volatile mode.

Abstract: A vertically alternating stack of insulating layers and dielectric spacer material layers is formed over a semiconductor substrate. The vertically alternating stack is patterned into a first alternating stack located at a center region of a memory die and a second alternating stack that laterally encloses the first alternating stack. Memory stack structures are formed through the first alternating stack, and portions of the dielectric spacer material layers in the first alternating stack are replaced with electrically conductive layers while maintaining the second alternating stack intact. At least one metallic wall structure is formed through the second alternating stack. An edge seal assembly is provided, which includes at least one vertical stack of metallic seal structures. Each vertical stack of metallic seal structures vertically extends contiguously from a top surface of the semiconductor substrate to a bonding-side surface of the memory die, and includes a respective metallic wall structure.

Abstract: A weight cell and device are herein disclosed. The weight cell includes a first field effect transistor (FET) and a first resistive memory element connected to a drain of the first FET, a second FET and a second resistive memory element connected to a drain of the second FET, the drain of the first FET is connected to a gate of the second FET and the drain of the second FET is connected to a gate of the first FET, and a third FET, and a load resistor connected to a drain of the third FET.

Abstract: A semiconductor device includes a memory string that includes a plurality of memory cells and is coupled between a source line and a bit line. A method for operating the semiconductor device may include: boosting a first channel region in a channel region of the memory string, wherein the channel region includes the first channel region at one side of the selected memory cell and a second channel region at the other side of the selected memory cell; applying a pre-program bias to a gate electrode of the selected memory cell, to inject electrons into a space region of the selected memory cell; and applying a program bias to the gate electrode.

Abstract: Apparatuses and methods for protecting transistors through charge sharing are disclosed herein. An example apparatus includes a transistor comprising a gate node and a bulk node, a charge sharing circuit coupled between the gate and bulk nodes, and logic. The charge sharing circuit is configure to equalize charge differences between the gate and bulk nodes, and the logic is configured to enable the charge sharing circuit based at least in part on a combination of first and second signals, which indicate the presence of a condition.

Abstract: Techniques are described for reducing an injection type of program disturb in a memory device during the pre-charge phase of a program loop. In one approach, a pre-charge voltage on the selected word line and drain side word lines is adjusted based on a risk of the injection type of program disturb. Risk factors such as temperature, WLn position, Vpgm and the selected sub-block, can be used to set the pre-charge voltage to be lower when the risk is higher. In another approach, the pre-charge voltage on the source side word lines is adjusted to reduce a channel gradient and/or the amount of time in which the injection type of program disturb occurs.

Abstract: A memory management method and a storage controller using the same are provided. The method includes reading a target word-line to identify a plurality of raw Gray code indexes corresponding to a plurality of memory cells of the target word-line; performing a decoding operation on raw data of the target word-line to identify a plurality of decoded Gray code indexes corresponding to the memory cells; calculating a plurality of Gray code absolute bias values corresponding to the memory cells according to the raw Gray code indexes and the decoded Gray code indexes; and identifying one or more abnormal memory cells among the memory cells according to the Gray code absolute bias values; and recording the one or more abnormal memory cells into an abnormal memory cell table, wherein a Gray code absolute bias value of each of the one or more abnormal memory cells is greater than a bias threshold.

Abstract: A circuit or associated system or apparatus includes a first transistor, a second transistor, a first switch, a second switch, a first current source, and a third switch. The first transistor is configured to sample a first current of a control line. The second transistor is configured to apply a second current to the control line. The second transistor is also configured to match the second current to the first current. The first switch is connected in series between a control terminal of the first transistor and a control terminal of the second transistor. The second switch is connected in series between the second transistor and the control line. The third switch is connected in series between the first current source and the control line.

Abstract: A twelve-transistor (12T) memory cell for a memory device that includes a transmission gate, a cross-coupled inverter circuit operably connected to the transmission gate, and a tri-state inverter operably connected to the cross-coupled inverter circuit. The cross-coupled inverter includes another tri-state inverter cross-coupled to an inverter circuit. Various operations for the 12T memory cell, as well as circuitry to perform the operations, are disclosed.

Abstract: A word line regulator provides a write word line voltage for an asserted word line and includes a write replica circuit, a reference current path, and a regulator circuit. The write replica circuit is a replica of a write path for writing from a low to high resistance value of a resistive memory element of a memory cell. The word line regulator regulates the word line voltage at a value during the write operation of a low to high resistance value such that a select transistor of the memory cell is used as a source follower to regulate a first node of a resistive element of the memory cell being written. The first node is at a higher write voltage than a second node of the resistive element during the write operation, and the first node is located in a write path between the select transistor and the second node.

Abstract: An inspection system includes a display device including a nonvolatile memory, an inspection device configured to generate a writing voltage for application to the nonvolatile memory, and a protection part configured to apply the writing voltage to the nonvolatile memory when the writing voltage is within an allowable voltage range, and not to apply the writing voltage to the nonvolatile memory when the writing voltage is not within the allowable voltage range. The application of the writing voltage to the nonvolatile memory enables a multi-time programming (MTP) operation in which reference data writes to the nonvolatile memory.

Abstract: Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Different calibration algorithms and systems are also disclosed. The system can modify a high voltage signal applied to an array of cells during a programming operation as the number of cells being programmed changes.