Abstract: In one embodiment of the present invention, an ignition coil assembly includes a primary coil and a secondary coil. A primary connector assembly of the ignition coil assembly includes a conductor which is adapted to electrically connect one terminal of the primary coil with one terminal of the secondary coil. The conductor includes indentations which delimit a portion of the conductor and facilitate the removal of that portion of the conductor. The conductor further includes provisions for electrically connecting an electrical component such as diode in place of the removed portion of the conductor. The present invention thus facilitates inclusion of an electrical component such as a diode in applications which will benefit from the inclusion of the electrical component in place of the conductor.

Abstract: A strap spring mounts a heat sink to an electronic device by snapping holes in the leg over ears of a catch on the socket. Two perpendicularly extending springs have an opening between them so that the springs fit between the fins of a heat sink and are latched in ratched indentations.

Abstract: The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.

Abstract: A heat sink apparatus dissipates heat from an integrated circuit which is connected to a printed circuit board. A support member is connected to the circuit board for supporting the integrated circuit with respect to the circuit board. A metal tab in thermal communication with the integrated circuit extends from the support member in a plane substantially parallel to the circuit board. An electrically insulating thermally conductive compressible pad is positioned in contact with the metal tab for receiving heat from the tab when compressed. A thermally conductive housing is positioned adjacent the pad for compressing the pad against the tab and for receiving heat from the pad when compressed. The housing includes a plurality of fins extending therefrom for heat dissipation. A method for dissipating heat from an integrated circuit which is connected to a printed circuit board is also provided.

Abstract: The arrestors of a compact gas insulated switchgear are to be connected to gas insulated main buses. The arrestors represent three phases, and are arranged in such a manner that the distance from a main bus which is located at the outermost position among a plurality of main buses to at least one arrestor for one phase is differentiated from the distances from the outermost main bus to at least one of the remaining arrestors. As a result, the area or the width required for installing the arrestors is minimized, the length of the main buses is shortened, and the installation area of the gas insulated switchgear as a whole can be reduced.

Abstract: A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink and the chips forms a thermal interface having a low thermal resistance. This cools the chips and ensures reliable operation of the MCM. The trough is filled with a curable adhesive, securing the heat sink to the substrate of the MCM.

Abstract: A pressure responsive sensor 10 for use with a vehicular air bag inflation system is shown having an electric switch 24 actuatable by a snap acting disc 40 when the gas pressure in the gas storage bottle 48 decreases to a selected low level. The snap acting disc 40 is exposed on one side to the gas mixture P1 in bottle 48 and the opposite side to a reference gas mixture P2 in a reference chamber 34. The gas mixture P2 in the reference chamber is filled to a lower pressure level than hat in the bottle in order to provide switch actuation at the desired level and comprises a mixture of gases to enhance leakage testing and tracking of the pressure vs. temperature characteristic curve of the bottle gas mixture.

Abstract: A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.

Abstract: The invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the circuit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.

Abstract: A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

Abstract: A membrane switch wherein the membranes have rupturable bridge members. The bridge members provide an area that is readily rupturable such that they can be appropriately placed in proximity to or adjacent a tear line such as that used in the cover of an airbag module in a motor vehicle. The membrane switch is suitable for use as horn actuation switch mounted on an airbag cover in a motor vehicle driver side airbag module assembly without unduly restricting deployment of an inflatable airbag from the module assembly.

Abstract: A portable electronic apparatus comprising a housing having a bottom, a metal frame provided in the housing, a circuit board supported by the frame, and an IC chip secured to the circuit board. The circuit board has a first surface extending substantially parallel to the bottom of the housing and a second surface opposing the first surface. The IC chip is adhered to the first surface of the circuit board and generating heat while operating. The apparatus further comprises a metal cover arranged on the first surface of the circuit board and covering the IC chip, and a metal shield plate covering the first surface of the circuit board and the metal cover. The frame has a heat-receiving part which contacts the second surface of the circuit board and which is located near the IC chip. A first thermally conductive elastic sheet is interposed between the cover and the IC chip, and a second thermally conductive elastic sheet is interposed between the cover and the shield plate.

Abstract: A method and mount for a high frequency IC that provides a low inductance path for a high frequency current from the IC to the exterior of a package for the IC and the mount. An electrically and thermally conductive metal base for mounting the IC on an upper surface thereof has a lower surface exposed at the exterior of the package that otherwise encloses the base and the IC. The base also has a plurality of solid or hollow columns for increasing a surface area of the mount, thereby decreasing the inductance to a high frequency current in the path between the IC and the lower surface of the base. Each column is electrically connected to a separate ground terminal on the IC. The columns may have narrow necks connecting them to the base to limit common mode inductance between columns, or may be separated from the base to eliminate common mode inductance.

Abstract: A heat operated release mechanism. The release mechanism is controllable to allow a heat exchanger to be firmly held in place over a heat producing element and effortlessly withdrawn when so desired. A spring is disposed above a heat producing element forming a variable-volume cavity between the spring and the heat producing element. The spring applies pressure to a heat exchanger inserted into the cavity. A memory metal plate is disposed between the spring and the heat exchanger. The memory metal plate has a selectable first shape at a low temperature for allowing the spring to apply pressure to the heat exchanger and a selectable second shape at elevated temperatures for displacing the spring to increase the volume of the cavity. Finally, a controllable heater is disposed between the spring and the memory metal plate for applying heat to the memory metal to select the second shape thereby increasing the volume of the cavity to facilitate insertion and withdrawal of the heat exchanger.

Abstract: A side-mountable liquid level sensor utilizes a rubber sealing grommet to temporarily hold the buoyant member within the cylinder of the liquid container opening to facilitate assembly. The buoyant member has an open slot with cooperating limit structure on the buoyant member and sensor rod to facilitate manufacture.

Abstract: A remote control unit for an air conditioner having a controller configured to process multiple temperature inputs, to provide a cycle of operation to provide comfort during sleeping, to provide an automatic cycle of operation wherein a burst of cooling air is provided on demand and/or which is configured to receive and respond to remote signals having different protocols. The remote control unit has a housing with a contoured rib that extends between two support pads so as to provide strength, rigidity and stability to the housing.

Abstract: A plurality of integrated circuit chips (12) are packaged in a stack of chips in which a number of individual chip layers (10,120,130,132,134) are physically and electrically interconnected to one another and are peripherally sealed to one another to form an hermetically sealed package having a number of input/output pads (137a,139a,141a,156,158,160) on the surface of the upper (132) and lower (134) layers. Each chip layer comprises a chip carrier substrate having a chip cavity (22) on a bottom side and having a plurality of electrically conductive vias (40,42,44) extending completely around the chip cavity. Each substrate is formed with a peripheral sealing strip (46,48) on its top and bottom sides and mounts on its top side a chip that has its connecting pads (14) wire bonded to exposed traces (32,34) of a pattern of traces that are formed on the top side of the substrate and on intermediate layers (16,18,20) of this multi-layer substrate.

Abstract: An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface.

Abstract: A heat sink for frictionally engaging an electronic device. The heat sink includes an enclosure which is formed by a pair of oppositely facing vertically side walls which extend upwardly from a flat horizontal base wall. A pair of opposed resilient clamping fingers extend toward each other and downwardly from the upper ends of the vertical side walls. Each of the clamping fingers has a free rounded end for engaging with a downward biasing force the top surface of an electronic device which is placed within the enclosure of the heat sink. A stop is located on the base wall for locating the electronic device relative to the heat sink. The heat sink also has a protuberance on the inside surface of each vertical side wall for engaging the side walls of the electronic device.

Abstract: Resistive ink elements are applied to the exposed surfaces of thin sections or thermal insulation provided to cooled integrated circuit devices within a computer system. The insulation is made thinner than required to prevent the formation of condensation upon the exposed surfaces of the insulation in order to accommodate space limitations within the computer system. The resistive ink elements generate heat upon the application of an electrical current thereto to warm the exposed surfaces of the insulation to a temperature above the dew point of the ambient environment within the computer system, thereby preventing the formation of condensation on the surfaces on the insulation.