Patents Examined by Gerald P. Tolin
  • Patent number: 5550707
    Abstract: There is described a novel arc extinction method for use in switchgear, and improved, low cost power switchgear incorporating the novel arc quenching method. By physically severing the arc and the substantially simultaneous interposition of a high dielectric strength insulating barrier between the fixed contact and the moving contact, substantially consistent and predictable arc extinguishing characteristics are obtained. When the dielectric strength of the barrier exceeds the applied voltage, the arc cannot maintain itself nor can it reignite. Upon detection of a fault, moving contact 16 disengages from fixed contact 12 and retreats 28 from contact 12 creating arc 30. Insulating guillotine 24, in intimate sliding contact with the surface of insulating partition 18 moves 26 toward aperture 20 in partition 18. When edge 31 of guillotine 24 reaches aperture edge 33 of partition 18, arc 30 is severed and extinguished.
    Type: Grant
    Filed: February 13, 1995
    Date of Patent: August 27, 1996
    Inventor: Arthur H. Iversen
  • Patent number: 5548485
    Abstract: A cover assembly for an IC card includes top and bottom covers (52, 54) with overlapping side rails (70, 80). At each side of the card, a downwardly-extending top side rail (70) lies facewise adjacent to an upwardly extending bottom side rail (80), and a layer (90) of solder is sandwiched between the rails and is bonded to each of them. The solder layer extends along most of the height of each cover side, so the two rails and the solder layer between them serve as a single rigid beam. The cover assembly can be, instead, spot welded at a plurality of locations at each side of the card, to weld the two rails facewise together.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: August 20, 1996
    Assignee: ITT Corporation
    Inventors: Gary C. Bethurum, Anthony J. Knights
  • Patent number: 5548488
    Abstract: An electrical component mounting system includes a substantially rigid substrate supporting a flexible circuit having a contact terminal with at least one aperture to receive a connecting pin from an electrical component. The aperture has a diameter slightly smaller than the diameter of the component conductor pin, such that extending the pin through the aperture in the flexible circuit deforms the contact terminal into an aligned larger diameter aperture in the substrate to provide a secure electrical connection between the pin and the terminal of the flexible circuit. In one embodiment of the invention, the conductive pin includes a locking groove for lockably engaging the rigid substrate.
    Type: Grant
    Filed: April 3, 1995
    Date of Patent: August 20, 1996
    Assignee: Prince Corporation
    Inventor: Scott A. Hansen
  • Patent number: 5548484
    Abstract: A card-receiving host having a simple push latch/unlatch mechanism to aid in withdrawal of an inserted IC card. The host (24, FIG. 2) has dual push latch/unlatch mechanisms (54) which allows the card (16) to be fully inserted and latched when first pushed forward, and, after a second push on the card, unlatches the mechanisms and moves the card rearward by an amount predetermined by the latch implementation to facilitate grasping it to pull it out of the host. In one arrangement the host connector has a male pin assembly that is free to move in and out to accommodate the latch lost motion and to provide the means to transfer the latch spring pressure and motion to the IC card for its rearward travel. The host connector male pins are, in this implementation, terminated to the electronic device frame via a flexible cable (94), in another system (FIG.
    Type: Grant
    Filed: August 16, 1995
    Date of Patent: August 20, 1996
    Assignee: ITT Corporation
    Inventor: Edward A. Kantner
  • Patent number: 5548481
    Abstract: An electronic module containing a heat sink member, a flexible printed circuit board with electrical components mounted on both sides, and a protective cover. The heat sink member has an external surface containing a plurality of protruding fins. Its internal surface contains a raised grid of ribs with cavities present between the ribs. The cavities contain ceramic-filled silicone for improved heat transfer between the electrical components present on the circuit board, and the heat sink member. High heat-producing components are mounted on one side of the circuit board and are thermally coupled with the heat sink member by means of copper-plated through-holes in the circuit board. The protective cover is mounted to the internal surface of the heat sink and encloses the printed circuit board. A connector assembly serves to connect the electronic module to external circuitry.
    Type: Grant
    Filed: September 19, 1994
    Date of Patent: August 20, 1996
    Assignee: Ford Motor Company
    Inventors: Kenneth A. Salisbury, Pawel Kalinowski, Jay D. Baker
  • Patent number: 5546269
    Abstract: A housing includes a base with blade terminals insertable into jaw contacts in an electrical watthour meter socket. First and second watthour meter receiving shells are mounted on the housing, each having a pair of line jaw contacts connected in parallel to each other and to line blade terminals in the base. Electrical conductors extend from the load jaw contacts in one of the shells to a junction box mounted on the housing to provide a connection to an external electrical conductor. An electrical power disconnect device is mounted in one of the shells, and is connected in series by conductors between the line jaw contacts in both shells. The power disconnect device includes a movable external member having an end portion which slidably extends through the side wall of one of the shells. In one embodiment, the end portion is a separate rod which is biased into contact with the movable member.
    Type: Grant
    Filed: July 13, 1994
    Date of Patent: August 13, 1996
    Assignee: Ekstrom Industries, Inc.
    Inventors: Darrell Robinson, Allen V. Pruehs, John Williams
  • Patent number: 5546273
    Abstract: A modular automotive audio system includes a controller housing and an amplifier housing to be mounted within the vehicle trunk and a remote control for use within the passenger compartment. Modular signal processing components are received within the controller housing, and modular amplifier components are received within the amplifier housing. A controller module within the controller housing provides control for all signal processing components. The controller module polls all positions within the controller housing to determine which components are installed, and then the controller module configures itself via software to provide the control functions. Optionally, non-audio electronic components can also be received within the controller housing for common control by the system.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: August 13, 1996
    Assignee: Rockford Corporation
    Inventor: Wayne Harris
  • Patent number: 5546274
    Abstract: A three-dimensional compact array of electronic circuitry includes a plurality of stacked modular compact arrays of electronic circuitry. Each modular compact array of electronic circuitry includes a substrate-less multi-chip module supporting a number of integrated circuits and interconnect which electrically connects the integrated circuits. Each modular compact array of electronic circuitry further includes an integrated heat exchanger and stacking connector supporting the substrate-less multi-chip module. The integrated heat exchanger and stacking connector includes a transverse connector region including a plurality of connector vias for connection to the interconnect of the substrate-less multi-chip module, and a transverse flow region including channels for circulating a coolant to remove heat from the substrate-less multi-chip module.
    Type: Grant
    Filed: March 10, 1995
    Date of Patent: August 13, 1996
    Assignee: Sun Microsystems, Inc.
    Inventor: Howard L. Davidson
  • Patent number: 5544017
    Abstract: A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid support base. Apertures are formed in the support base exposing the underside of the thin film structure, thereby allowing high density connectors to be mounted on both surfaces of the thin film structure, greatly enhancing the ability to communicate signals between adjacent substrates in the chip module. This avoids the need to route the signals either through the rigid support base or to the edges of the thin film structure. Power and ground, which do not require a high connection density, are routed in low impedance paths through the support base. Preferably, the thin film structure is made of alternating layers of patterned metal, such as copper, and a low dielectric organic polymer, such as a polyimide.
    Type: Grant
    Filed: July 19, 1994
    Date of Patent: August 6, 1996
    Assignee: Fujitsu Limited
    Inventors: Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase, Michael G. Peters, James J. Roman, Som S. Swamy, Wen-chou V. Wang
  • Patent number: 5544003
    Abstract: A portable power distribution panel for disposition in a sealed, isolated space to receive primary power input from an external source and to distribute reduced or secondary voltage operating power to each of a plurality of output power receptacles while including a circuit breaker with ground fault indicator in each respective power output circuit.
    Type: Grant
    Filed: March 6, 1995
    Date of Patent: August 6, 1996
    Inventor: Joe L. Vaughan
  • Patent number: 5544012
    Abstract: A cover is provided on at least one of the faces of a box body. A plurality of elements to be cooled are arranged in tiers within the box body so as to be opposed to one face of the box body. A horizontal duct is provided at a lower part within the box body. A vertical duct is provided between the elements and the cover. Guide members are situated within the vertical duct and the box body. The guide members guide the air stream, sucked into the elements, and the air stream exhausted from the elements along predetermined passages.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: August 6, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Norihiro Koike
  • Patent number: 5544013
    Abstract: A CPU radiating flange mounting device including two hangers respectively made from a springy wire rod and pivotably connected to two opposite sides of a radiating flange for hanging on projecting rods on two opposite sides of a CPU holder to secure the radiating flange to the CPU holder above a CPU, which is mounted within the CPU holder.
    Type: Grant
    Filed: September 13, 1994
    Date of Patent: August 6, 1996
    Inventor: Ming D. Chiou
  • Patent number: 5541809
    Abstract: An electronic equipment, such as a recording and/or reproducing apparatus for recording and/or reproducing an information signal in and/or from a recording medium. The electronic equipment includes a drive mechanism portion, a chassis, an upper lid, a lower lid, a panel frame and a battery compartment portion. The chassis is a frame substantially square in shape and is formed by bending a band-shaped piece of sheet metal. The chassis supports therein the drive mechanism portion through a damping mechanism. The upper lid is made of a metal material and attached to one surface side of the chassis so as to open and close the drive mechanism portion. The lower lid is made of a metal material and attached to the chassis so as to close the other surface of the chassis. The panel frame is substantially U-letter in shape and made of a synthetic resin. The panel frame has a plurality of operation buttons provided thereon and is attached to the outside of the chassis.
    Type: Grant
    Filed: September 15, 1994
    Date of Patent: July 30, 1996
    Assignee: Sony Corporation
    Inventors: Masahiko Kakizaki, Takashi Hishinuma, Toshihide Oba
  • Patent number: 5539614
    Abstract: A control unit forms a control center serving as one type of a control panel in an electric power system control system. The control unit accommodates equipments such as a circuit breaker, an electromagnetic switch, a zero-phase current transformer, and an operating transformer, and includes a substantially Z-shaped equipment mounting plate mounted between side plates of the unit to have an intermediate bent portion. The circuit breaker is disposed on a front face of a front mounting portion of the equipment mounting plate, and the current transformer is disposed on a back face thereof. The electromagnetic switch is disposed on a front face of a back mounting portion of the equipment mounting plate, and the thin operating transformer is isolated from other equipments and disposed on a back face thereof.
    Type: Grant
    Filed: June 27, 1994
    Date of Patent: July 23, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masahiro Ishikawa, Osamu Hasegawa
  • Patent number: 5535100
    Abstract: A fastening assembly for mounting a main circuit card a fixedly spaced distance from a mounting wall, and for aligning a subsidiary connector of a subsidiary circuit card to a main connector mounted on a top surface of the main circuit card is provided. The fastening assemby comprises a pin and a support button. The pin has a bottom portion that passes through mounting apertures within a main connector mounted to a top surface of a main circuit card that extend from the center axis at most a first distance, and wherein the bottom portion extends from the center axis at least a second distance.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 9, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ken E. Lubahn, Jim A. Melville
  • Patent number: 5535094
    Abstract: A module which has an integral blower that cools an integrated circuit package. The blower is attached to a heat sink that is mounted to the integrated circuit package. Heat generated by the integrated circuit conducts to the heat sink. The blower generates a stream of air that flows across the heat sink and removes heat from the package. The module may have a manifold and duct that direct the airstream across the heat sink.
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: July 9, 1996
    Assignee: Intel Corporation
    Inventors: Daryl J. Nelson, Muralidhar Tirumala, Peter Butler, Gerald A. Budelman
  • Patent number: 5535096
    Abstract: A safety lock-out device prevents the insertion of an electrical power cord into an electrical power cord receptacle of an electrical appliance. The devise comprises a mounting plate fastened to the appliance and a cover plate hingedly attached to the appliance. The cover plate is movable between a first position and a second position such that, in the first position, the cover plate covers and prevents insertion of a power cord into the appliance receptacle. In said second position, the appliance receptacle is uncovered to permit insertion of a power cord into the receptacle. Extending a lock shank through aligned openings formed in flange members extending from the mounting plate and the cover plate locks the cover plate in the first position.
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: July 9, 1996
    Assignee: Universities Research Association, Inc.
    Inventor: Paul L. Cliff, Jr.
  • Patent number: 5535099
    Abstract: A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: July 9, 1996
    Assignee: Digital Equipment Corporation
    Inventors: William F. McCarthy, Colin E. Brench, Daniel M. Snow
  • Patent number: 5535095
    Abstract: An adjustable housing or chassis for electronic devices specifically intended for mounting in panels of unknown and variable thickness, for example, in the panels of aircraft. The chassis includes base and cover members that telescopingly mate to form a complete enclosure for electronic printed circuits therein. The chassis members include plural flanges and/or sidewalls to create a self-interlocking chassis in which the cover is restrained from lateral and vertical movement on the base. The cover is axially adjustable on the base to thereby expose more or less of the electronic controls as dictated by the thickness of aircraft panel.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: July 9, 1996
    Inventors: R. Winston Slater, Carl C. Sorensen
  • Patent number: 5535102
    Abstract: A power distribution switchboard assembly is provided which is adapted to accept plug-in outgoer mechanical base fixing/location arrangements or units having different physical size and format. The switchboard assembly includes at least two rear mounting plates each formed with interspersed different format apertures in a longitudinal direction. The two rear mounting plates are located in juxtaposed relationship and are adjustable in a lateral direction so as to be spaced apart by different specified distances and together be capable of accepting different sized plug-in outgoer arrangements.
    Type: Grant
    Filed: February 24, 1995
    Date of Patent: July 9, 1996
    Assignee: Square D Company
    Inventors: Kenneth Neill, Keith W. Ball