Abstract: A power receiving unit is arranged in one side of an instrument potential/current unit transformer. A transformer-side unit is arranged in the other side of the instrument potential/current transformer units. A bypass bus connecting the power receiving unit and the transformer-side unit is arranged in parallel to the row of cubicles. The gas insulated switchgear can be made small in size and the work for adding a bank can be performed with substantially small man-power. The size of the gas insulated switchgear can be also prevented from increasing due to the addition of a bank.

Abstract: A semiconductor device is formed of an insulative case frame having a frame portion; a lead pin block having a base and a plurality of lead pins with inner leads formed in the base, the lead pin block being installed inside the frame portion; a base plate attached to the frame portion for covering a first opening; a circuit board bonded to an inner face of the base plate and having semiconductor chips thereon connected to ends of the inner leads; a gel resin sealant filling an inner space of the insulative case frame over the circuit board and the semiconductor chips; and an insulative cover plate placed on the insulative case frame for closing a second opening of the insulative case frame. A sealing agent is disposed between the lead pin block and the frame portion to seal a gap therebetween, and an air vent is formed in the base of the lead pin block to communicate between the inner space and atmosphere.

Abstract: The apparatus of the present invention comprises a housing defining a closed interior volume of a size sufficient to accommodate the appliance, a first heat sink located within the housing, a second heat sink located outside the housing, a reversible heat pump disposed between and in heat conductive engagement with each of the first and second heat sinks, a temperature sensor located within the housing, and electronic circuitry to actuate the heat pump in either of a first cooling mode or a second heating mode in response to predetermined temperature set points sensed by the temperature sensor within the housing. The apparatus also includes an appliance support tray and a holding bracket that engages and maintains the tray in spaced relation within the housing. A pressure equalizing diaphragm is also employed to accommodate pressure changes within the housing.

Abstract: Apparatus for housing circuit cards that comprises a cylindrical housing having an internal wall having a single diameter. First and second cylindrical heat sinks are provided that each comprise a sloped outer surface. The heat sinks are disposed such that the sloped outer surfaces face each other. First and second circuit cards are secured to distal edges of respective heat sinks, or pairs of circuit cards are secured to both edges of respective heat sinks. Each circuit card comprises at least one internal interface connector that is designed to mate with an internal interface connector of an adjacent circuit card. A cylindrical card lock is provided that has an outer surface that is designed to contact the internal wall of the housing and an inner surface that has a V-shaped cross section having oppositely sloped surfaces. The respective sloped surfaces of the card lock are designed to mate with the sloped outer surfaces of the respective heat sinks.

Abstract: A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allowing pivotal motion along an axis substantially parallel to the first edge. A first embodiment has a spiraled heat transfer element with a inner edge thermally coupled to a heat conductive mounting element mounted along the first edge of the first computer housing member. The spiraled heat transfer element forms at least one turn around the heat conductive mounting element and has outer edge affixed to the second computer housing member. A second embodiment provides heat transfer between the first and second computer housing members through the gudgeon and the pintle of the hinge.

Abstract: A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means.Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator.According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.

Abstract: An apparatus for removing heat from an integrated circuit package. In one embodiment, the present invention includes a heat slug that is capable of being installed within an opening in a printed circuit board using a standard pick-and-place machine. The surface mountable heat slug includes a top portion and a bottom portion, wherein the bottom portion is formed to fit within the printed circuit board opening. The top portion of the heat slug is attached to the top surface of the printed circuit board. The integrated circuit package is attached to the bottom portion of the heat slug which is exposed along the bottom surface of the printed circuit board.

Abstract: Apparatus for cooling a plurality of electrical components mounted to a circuit board includes a base plate mounted in proximate relation to component sites on the circuit board at which electrical components are mounted. The base plate includes alignment elements that engage a alignment plate. The electrical components are carried by the alignment plate so that when the alignment plate is installed on the base plate, engaging the alignment elements, the electrical components are registered to and installed at corresponding component sites in a manner that aligns electrical leads of the components to printed circuit pads at the component sites. The base plate and alignment plate are sealed, and a coolant circulated therethrough.

Abstract: A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.

Abstract: A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.

Abstract: An electronic device using an operation battery and a memory backup battery includes a device body and a memory backup battery removal preventing mechanism. The device body includes a first accommodating portion for accommodating therein the operation battery and a second accommodating portion for accommodating therein the memory backup battery. The preventing mechanism prevents the memory backup battery accommodated in the second accommodating portion from being removed from the second accommodating portion based on whether or not the operation battery is accommodated in the first accommodating portion.

Abstract: An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components.

Abstract: A temperature compensating low pressure sensor for verifying loss of gas from an inflator of a vehicle restraint safety system. The sensor includes a housing and a pressure diaphragm in communication with the fluid in the inflator. A temperature sensitive bimetallic thermostat is disposed within the housing. The thermostat expands with relation to a change in temperature of the fluid at the same rate as the pressure diaphragm. A retainer in communication with the pressure diaphragm is movably disposed in the housing. A stack of spring washers is disposed between the retainer and the thermostat for counteracting the pressure of the fluid acting upon the diaphragm. A contact arm in contact with the thermostat moves with the retainer.

Abstract: A structure for mounting a switch to a front panel of an electric apparatus. Supporting members are arranged on the front panel to support an elastic member which can hold the switch under the elastic deformation of the elastic member. One support member is arranged one side of the opening in the front panel and another support member is arranged on the opposite side of the opening. The elastic member includes a pair of longitudinal webs adapted to engage with the lateral flap portions of the switch and at least one transverse web connecting the longitudinal webs together. The elastic member has tongues for engaging with the support member.

Abstract: A differential pressure switch particularly suitable for monitoring dirt accumulation on a filter element of an oil-separating air filter comprising a piston which is movable in response to a relative change in pressure between two pressure zones and is biased in one direction by a restoring spring, and a rolling membrane which separates the pressure zones.

Abstract: The purpose of the present invention is to obtain a low-cost and easy-to-produce ignition coil for an internal combustion engine.A lead wire 13a of an electronic part 13 is connected to a terminal 12a and a terminal 7a of an intermediate conductor 12 by means of caulking or press fitting. Since the end cut face of the lead wire 13a of the electronic part 13 is sharp, a wall material 71 and a cover 81 as crack spread preventing materials are arranged so as to encircle that end cut face. Further, an opening portion 92 is closed by the intermediate conductor 12, and high voltage is output via a spring 11 directly contacted to the intermediate conductor 12.The number of components may thus be reduced, and cracks generating in an insulating resin may be prevented from spreading.

Abstract: A 3-D integrated circuit (IC) chip stack employs a plurality of discrete chip carriers that are formed from dielectric tape layers such as fused low temperature cofired ceramic (LTCC) tape. The chips are lodged in cavities within the tape layers, and are either flip-chip or wire bond connected to electrical routings that extend along one or more tape layers toward the periphery of the carrier. Intercarrier interconnects are provided between the routings for adjacent carriers, either through the carrier side walls or externally. The carriers are mechanically secured to each other within the stack either by connectors that also provide an I/O signal capability, or by an adhesive if external electrical connectors are used. The structure is strong, compact, inexpensive, compatible with conventional IC chips and capable of disassembly and reassembly to replace a bad chip.

Abstract: A means and method for rigidly elevating a structure includes a base member securable in the ground and which has a portion extending above the ground. A pole section, having a bore inside a lower end, and an upper end, can be stacked upon the base means upwardly by slip fitting the pole section onto the base end and securing it in place. A flexible, easily transportable and durable system is thereby created for elevating structures.An integrated pole for elevating light fixtures and all other necessary components such as electrical components, can be predesigned, shipped, and easily installed at a desired location. Pole top member, including rigidly secured cross arms, can be inserted on the top of a pole. All wiring for both the pole top cross arms, and the pole itself can be preconfigured and require simple connection of plugs between wiring segments.

Abstract: A heat sink and retainer clip for use in conjunction with an electronic integrated circuit, such as a semiconductor device, to provide cooling of the device, the device being mounted on a rectangular socket with opposing sidewalls and at least two of the sidewalls having lugs projecting laterally outward. The heat sink has a flat plate and a plurality of fins projecting upward from the top surface, except over the central portion of the plate. The retainer clip is constructed of two pieces. One piece is an elongated strap having a bent portion that bears down on the heat sink to force it into a heat conducting relationship with the device and also includes an opening that is hooked on the one of the lugs. The strap lies in the central portion of the sink. The second piece is rotatably mounted on the end of the first piece and when forced down and rotated inward, an opening will hook on the other lug.

Abstract: A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.