Patents Examined by Gerald P. Tolin
  • Patent number: 5693926
    Abstract: A double differential pressure indicator has a housing containing two pistons arranged in contiguous bores and biased by a single spring extending between opposed ends of the pistons. The differential pressure is applied across both pistons and as the pressure differential increases to a first predetermined difference one piston moves to operate a first indicator which may, for example, be a reed switch. As the differential pressure further increases, the second piston moves to operate a second indicating device which may be a button. In an alternative arrangement, both indicating devices operate at the same differential pressure.
    Type: Grant
    Filed: January 23, 1996
    Date of Patent: December 2, 1997
    Assignee: Pall Corporation
    Inventor: Ronald F. Cassidy
  • Patent number: 5694288
    Abstract: A circuit breaker (1) mountable on a channel section rail (8) with a pair of elongate flanges (9, 10) and secured in position by a mounting clip (17) mounted in an elongate groove (18). The mounting clip (17) is movable along the groove (18) from a disengaged position to an operating rail engaging position with a release head portion (23) of the mounting clip (17) being within the outer boundary of the circuit breaker housing (2).
    Type: Grant
    Filed: January 31, 1996
    Date of Patent: December 2, 1997
    Assignee: Square D Company
    Inventors: James Joseph Shortt, Shay Joseph Lavelle
  • Patent number: 5691884
    Abstract: A semiconductor device of the invention is formed of an insulative case frame with a frame portion having elongated coupling holes, a radiator base plate covering a first opening of the insulative case frame, a circuit board with semiconductor chips bonded to the radiator base plate, a resin sealant filled in an inner space of the case frame for covering the circuit board, an insulative cover plate closing a second opening of the insulative case frame, and at least one lead frame having elastic coupling protrusions and inner leads. The elastic coupling protrusions are elastically retained in the elongated coupling holes to securely connect the lead frame to the case frame.
    Type: Grant
    Filed: December 4, 1995
    Date of Patent: November 25, 1997
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Shin Soyano, Susumu Toba
  • Patent number: 5691883
    Abstract: An apparatus for cooling the components within an enclosed computer system. The apparatus includes a first compartment containing a power supply and a fan, a second compartment containing a variety of electrical components and an air duct containing the computer system microprocessor. The air duct directs an air flow from the exterior of the computer system enclosure across the microprocessor to an inlet opening of the first compartment. Holes are provided within the air duct at points downstream of the microprocessor to permit an air flow from the second compartment into the air duct. The fan generates an air stream through the cooling system and exhausts to the exterior of the computer system enclosure.
    Type: Grant
    Filed: December 27, 1995
    Date of Patent: November 25, 1997
    Assignee: Intel Corporation
    Inventor: Daryl J. Nelson
  • Patent number: 5691878
    Abstract: A housing for use with a ballast for powering one or more fluorescent lamps. In a preferred embodiment, the housing includes a cover (48) and a base (10). The cover (48) has at least two fingers (80), where each finger (80) includes a mating portion (86). The base (10) has at least two corresponding finger ports (100), each with a guide-lock structure (102) for guiding insertion of the mating portion (86) of the finger (80) into the finger port (100) and for securely locking the finger (80) in place when the mating portion (86) is inserted into the finger port (100).
    Type: Grant
    Filed: February 2, 1996
    Date of Patent: November 25, 1997
    Assignee: Motorola, Inc.
    Inventors: Youngkee Ahn, Jiri Slaby
  • Patent number: 5689404
    Abstract: The heat sink of the present invention applicable to at least two heating elements including two integrated circuit packages includes a base member fixed to the integrated circuit packages and having a plurality of fins, and air cooling means provided at a substantially central position of the base member. This construction allows an improvement in reliability, a reduction in noise, and a reduction in power consumption.
    Type: Grant
    Filed: October 26, 1995
    Date of Patent: November 18, 1997
    Assignee: Fujitsu, Ltd.
    Inventor: Tadashi Katsui
  • Patent number: 5684675
    Abstract: A semiconductor device unit includes a holder having a plurality of holding parts, and a plurality of semiconductor devices held by the holding parts of the holder. Each of the semiconductor devices has a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads which are exposed whereby the semiconductor device unit stands by itself on the leads.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: November 4, 1997
    Assignee: Fujitsu, Ltd.
    Inventors: Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Michio Sono, Masanori Yoshimoto
  • Patent number: 5680295
    Abstract: An improved cooling system for a computer system includes a ventilated backplane for a disk drive cage. The backplane is rigidly secured to the rear of the disk drive cage and includes a plurality of apertures therein to permit convective heat transfer between the inner cavity of the drive cage and the main enclosure of the computer system. A fan assembly is attached to the backplane on the side opposite the drive cage to further enhance heat transfer through the ventilation apertures. In one embodiment, the fan assembly includes a plenum attached to the backplane and a fan attached to the plenum. In another embodiment, a fan housing is attached to the backplane and incorporates one or more fans therein.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: October 21, 1997
    Assignee: AST Research, Inc.
    Inventors: Bao G. Le, Gregory V. Kabenjian
  • Patent number: 5671118
    Abstract: A heat sink and retainer clip for use in conjunction with an electronic integrated circuit, such as a semiconductor device, to provide cooling of the device, the device being mounted on a rectangular socket with opposing sidewalls and at least two of the sidewalls having lugs projecting laterally outward. The heat sink has a flat plate and a plurality of fins projecting upward from the top surface, except over the central portion of the plate. The retainer clip is constructed of two pieces. One piece is an elongated strap having a bent portion that bears down on the heat sink to force it into a heat conducting relationship with the device and also includes an opening that is hooked on the one of the lugs. The strap lies in the central portion of the sink. The second piece is rotatably mounted on the end of the first piece and when forced down and rotated inward, an opening will hook on the other lug.
    Type: Grant
    Filed: August 6, 1996
    Date of Patent: September 23, 1997
    Inventor: Michael L. Blomquist
  • Patent number: 5671121
    Abstract: A printed circuit board assembly that has a first electronic package which is coupled to a printed circuit board and a second electronic package that is plugged into the first electronic package. The first electronic package can be coupled to the printed circuit board by leads, pins that plug into corresponding sockets mounted to the circuit board, or a SMT socket adapter that is mounted to the board. The first package also has a plurality of pins that extend through an opening in the printed circuit board. The second package has a plurality of sockets that can be plugged onto the pins of the first package to couple the second package to the first package.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: September 23, 1997
    Assignee: Intel Corporation
    Inventor: John Francis McMahon
  • Patent number: 5668348
    Abstract: The present invention is to provide a dissipator mounting apparatus having a metal plate and a metal snap ring, where the two sides of the metal plate stretch upward and form an elastic tilt angle, and on one end of the metal plate bends downward and forms an opening to be firmly received in the barb of the ZIF socket, while the other end of the metal plate forms another hole for holding the snap ring whose rods stretch horizontally inward from the gap. Thus the CPU and the dissipator board can be tightly combined together with the help of the mounting apparatus.
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: September 16, 1997
    Inventor: Chun-Sheng Lin
  • Patent number: 5666269
    Abstract: A liquid cooled power dissipation apparatus (10) includes a metal matrix composite heat sink (11) with an insulation layer (17) integral to the apparatus (10). The insulation layer (17) is made integral to the apparatus (10) during infiltration of the metal matrix composite heat sink (11). Electronic components 23 are situated on top of the insulation layer (17).
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: September 9, 1997
    Assignee: Motorola, Inc.
    Inventors: Guillermo L. Romero, Samuel J. Anderson, Brent W. Pinder
  • Patent number: 5666268
    Abstract: An electronic variable speed drive including a cabinet having an opening door, a power system supplied with power from an AC line voltage and delivering a voltage under the control of solid state power switches and an electronic control system controlling the solid state switches. The cabinet contains, behind the door, a protective cover which protects the electronic control system and the power system which are disposed behind it. When the door is open, the protective cover protects users from the control and power systems.
    Type: Grant
    Filed: August 13, 1996
    Date of Patent: September 9, 1997
    Assignee: Schneider Electric S.A.
    Inventors: Philippe Rix, Ghislaine Mercier, Jacques Cerri, Philippe Mansuy
  • Patent number: 5663868
    Abstract: A cabinet for electronic equipment comprises an array of printed circuit boards stacked in horizontal planes. The circuit boards are interconnected by a vertically extending rear mother board, and the cabinet includes a plenum chamber defined by a partition having a plurality of vertically arrayed ventilation openings through which air can be drawn from the lateral spaces between the circuit boards and exhausted from the rear of the cabinet by a blower.
    Type: Grant
    Filed: September 14, 1995
    Date of Patent: September 2, 1997
    Assignee: Questech Limited
    Inventor: Anthony Donald Stalley
  • Patent number: 5661278
    Abstract: A miniature pneumatic switch apparatus has a diameter of three-eights inches and a height of five sixteenths inches and operates from minimal pressure to 100 psi. A pressure responsive unit includes outer spaced guide walls extending from a pressure movable wall. A switch unit is secured to the guide walls in spaced aligned relation to the movable wall and forms an operating chamber. A spring carrier is mounted within the chamber. The carrier includes a plate having a lateral opening with a beam spring extending therethrough, with the spring ends supported in openings aligned with the plate. An elastic band encircles the support walls and holds the beam spring in place. The opening in the plate facing the switch unit is a flat face, and the opposite face facing the movable wall is curved for line contact with the spring.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: August 26, 1997
    Assignee: Airtrol Components Inc.
    Inventors: Louis D. Atkinson, Kevin M. Rave
  • Patent number: 5661277
    Abstract: A differential pressure flow sensor for use in a flow passageway of very low pressure flow lines and utilizing at least first and second conductive membranes in superimposed relationship having center portions constructed to create a discontinuity to allow a predetermined flow rate therethrough. A conductive strip is in juxtaposed relationship with the superimposed membranes and has a normally closed switch position. When the flow in the flow passageway exceeds the predetermined flow rate, the pressure against the flexible membranes opens the switch of the conductive strip and provides an electrical indication of the open switch.
    Type: Grant
    Filed: December 1, 1995
    Date of Patent: August 26, 1997
    Assignee: Oklahoma Safety Equipment Co.
    Inventor: James R. Graham, II
  • Patent number: 5657205
    Abstract: A mounting structure of the vibration-generating-motor comprises a vibration-generating-motor and a holder for holding the vibration-generating-motor. A holding section of the holder contacts faced inner surfaces of a case and is held by the inner surfaces. Vibrations of the vibration-generating-motor are directly conveyed to the case through the holding section. For assembling, the holder holding the motor passes through a circuit board and is fixed by a hole formed on the circuit board. Then, the both ends of the holder are brought into contact with faced inner surfaces of the case so that the holder is held by the inner surfaces. The above structure enables vibrations of a vibration-generating-motor to be efficiently conveyed to the surface of the case and reduces undesirable sounds due to resonance of a circuit board.
    Type: Grant
    Filed: August 4, 1995
    Date of Patent: August 12, 1997
    Assignee: NEC Corporation
    Inventors: Toshiyuki Tamaru, Toshiki Yamanaka
  • Patent number: 5655290
    Abstract: A three dimensional module for housing a plurality of integrated circuit chips is shown. The IC chips are mounted in rows on a plurality of substrates. Parallel to each row are communications bars which provide signal paths allowing chips on one substrate to communicate with those on another substrate. The communications bars also serve as spacers between substrates, thereby forming cooling channels. The IC chips are disposed in the cooling channels so that they come into direct contact with the cooling fluid. Signal lines to and from the IC chips are kept as separated as possible from the power lines so as to minimize noise. To this end, relatively thick power supply straps are mounted to each substrate below each row of IC chips. The power supply straps are, in turn, connected to power feed straps such that a very low impedance power supply path to the IC chips is maintained.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: August 12, 1997
    Assignee: Fujitsu Limited
    Inventors: Larry L. Moresco, David A. Horine, Wen-Chou Vincent Wang
  • Patent number: 5654871
    Abstract: A motor control center of the type including a short circuit protective device such as a circuit breaker or fusible disconnect, and a motor starter for interacting with an electric motor includes a wiring access cabinet at the top of the control center. The multi-phase conductors within the access cabinet are protected by means of a pair of slidably-arranged access doors. The doors are arranged in a different position along the front of the access cabinet to access each of the individual phase conductors.
    Type: Grant
    Filed: December 11, 1995
    Date of Patent: August 5, 1997
    Assignee: General Electric Company
    Inventors: Lloyd E. Wentler, Edgar Yee, Tomas Bienvenido Reyes, Kevin F. Nolan
  • Patent number: 5652698
    Abstract: A plurality of terminal blocks are secured to a molded case circuit breaker by a bracket assembly which includes a mounting bracket placed against a side wall of the circuit breaker molded case. A back-up plate is inserted in a pocket formed between the outer wall and an inner wall of the molded case and electrically isolated from the cavity containing the circuit breaker operating mechanism. Fasteners extend from the mounting bracket through the outer wall and engage the back-up plate. Since the pocket is electrically isolated from the circuit breaker operating mechanism, the back-up plate, and particularly the fasteners, can be made of metal for a solid, durable connection.
    Type: Grant
    Filed: February 1, 1996
    Date of Patent: July 29, 1997
    Assignee: Eaton Corporation
    Inventor: William G. Eberts