Patents Examined by Gerald P. Tolin
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Patent number: 5434752Abstract: A system for controlling staggered connection timing of an adapter module so that live insertion, or "hot swapping", may be performed with the adapter module, has a connector with staggered pins, i.e., some pins being longer than others for initial contact with mating pins of a mating connector. The system further has a latch for controlling the timing of the connection of the staggered pins. As an adapter module is inserted into a housing, the latch allows the adapter module to be in one of three positions: (1) an entirely disconnected position where none of the pins of the adapter module are connected to the pins of the housing connector; (2) a "stopped", or partially connected, position where the longer of the staggered pins are connected between the housing and adapter modules connectors; and (3) a "fully-engaged" position wherein all pins of the connectors are engaged.Type: GrantFiled: October 27, 1993Date of Patent: July 18, 1995Assignee: International Business Machines CorporationInventors: Joseph D. Huth, Robert F. Pan, Frank J. Pita, Bart P. Reier, Victor E. Valle
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Patent number: 5434744Abstract: A method of manufacturing a thermoelectric module is provided. A first electrically conductive pattern is defined on a first substrate and a second electrically conductive pattern is defined on a second substrate. Alternating bars of a first thermoelectric material and a second thermoelectric material are arranged parallel to each other. The bars are fixed into place on the first conductive pattern by an effective thermal and electrical connection with the conductive pattern. One such connection means is soldering. Then the bars are separated into elements. The second substrate is positioned over the elements and fixed to the elements to complete the manufacture of the TEM.Type: GrantFiled: October 22, 1993Date of Patent: July 18, 1995Inventors: Robert E. Fritz, Joseph R. Monkowski
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Patent number: 5432675Abstract: A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor.Type: GrantFiled: November 15, 1993Date of Patent: July 11, 1995Assignee: Fujitsu LimitedInventors: Haruo Sorimachi, Kiyotaka Seyama, Makoto Sumiyoshi, Kazuaki Satoh
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Patent number: 5432677Abstract: A multi-chip integrated circuit module includes a supporting layer of laminate material over which a high-density interconnect structure is formed. The laminate layer includes a first upper laminate layer (10) having a hole (14) disposed therein for receiving an integrated circuit chip die (56). A lower core laminate layer (16) having a conductive layer (18) and conductive layer (20) disposed on opposite sides thereof is laminated to the lower surface of the layer (10). Plated-through holes (36), (38) and (40) are formed through the two layers (10) and (16) to connect the conductive layer (20) with a conductive layer (12) on the upper surface of the layer (10). A high-density interconnect layer includes two laminate layers (126) and (138), each having vias formed therethrough and via interconnect structures disposed on the surfaces thereof. The via interconnect structures in the layer (126) allow for connections from the die (56) to the conductive layer (12).Type: GrantFiled: January 11, 1994Date of Patent: July 11, 1995Assignee: Texas Instruments IncorporatedInventors: Larry J. Mowatt, David Walter
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Patent number: 5430611Abstract: A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A beam spring applies pressure to the back side of the substrate, maintaining a constant force that urges the chips against the heat sink and avoids mechanical stress that would otherwise result from lateral motion of the chips such as from differential expansion. A flat flexible cable connects the module with other circuitry.Type: GrantFiled: July 6, 1993Date of Patent: July 4, 1995Assignee: Hewlett-Packard CompanyInventors: Chandrakant Patel, Hannsjorg Obermaier
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Patent number: 5430251Abstract: An electrical junction box has conductor sections in the form of contact rails inside the box. The box has sides with openings for passing power lines. Replaceable conducting strip holders hold the contact rails within recesses in the base of the box. Covers over the conducting strip holders have openings so that the contact rails are accessible from inside the box.Type: GrantFiled: June 30, 1994Date of Patent: July 4, 1995Assignee: Dorma GmbH +Co. KGInventors: Hasso Freundner, Walter Grabowski
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Patent number: 5430247Abstract: A twisted-pair conductor line structure is formed on a substrate (22) having insulated conductive layers (10, 11). The conductive layers are used to form first, second, third, and fourth conductive planar segments (16). A first conductive link (44) joins the first and second planar conductive segments to provide a first signal path. Similarly, a second conductive link (46) joins the third and fourth planar conductive segments to provide a second signal path. The first and second conductive links are operatively arranged to form a twist (17) in the first and second signal paths, such that the resulting magnetic fields (57, 59) around the twisted conductive segments will be opposite to each other for cancelling each other out, in order to reduce the magnetic field radiation to the surrounding environment. Two such twisted-pair conductor lines are placed such that their twisted portions are off-set from each other.Type: GrantFiled: August 31, 1993Date of Patent: July 4, 1995Assignee: Motorola, Inc.Inventor: David E. Bockelman
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Patent number: 5430426Abstract: A pancake-type transformer particularly suited for connection to an inductor for inductively heating crankshafts is comprised of a single turn secondary defined by a plurality of generally U-shaped tubular conductors interleaved between the turns of a tubular, multiturn primary conductor having opposite ends connectable across a source of power. The conductors of the secondary have opposite ends each interconnected with a corresponding one of a pair of terminal blocks connected to a tubular inductor. The terminal blocks are outwardly adjacent the primary and secondary conductor portions at one end of the transformer and include corresponding current collectors which extend inwardly across the opposite sides of the conductor portions at the one end of the transformer. Coolant for flow through the secondary conductors is communicated with the opposite ends thereof through coolant passageways in the current collectors.Type: GrantFiled: September 13, 1993Date of Patent: July 4, 1995Assignee: Tocco, Inc.Inventor: Arthur H. Griebel
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Patent number: 5428503Abstract: A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device.Type: GrantFiled: September 26, 1994Date of Patent: June 27, 1995Assignee: Hitachi, Ltd.Inventors: Hitoshi Matsushima, Toshihiro Komatu, Yoshihiro Kondou, Toshio Hatada, Susumu Iwai, Tetsuro Honma, Toshiki Iino, Takao Ohba, Akira Yamagiwa
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Patent number: 5428335Abstract: A permanent magnet comprising a shell of magnetic material having a hollow avity and an access port that passes through the shell and communicates with the cavity. The shell is permanently magnetized to produce a magnetic field in the cavity. A magnetic insert is located in the cavity. The insert has a tunnel aligned with the access port and is magnetized in a direction opposite to the direction of the magnetic field. Specifically, a spherical magnetic shell has a concentric cavity in which a spherical magnetic insert is housed. An access port in the form of an axial hole passes through the spherical center of the shell and the insert. The shell ("magic sphere") is magnetized such that it is capable of producing a uniform magnetic field in the cavity. The insert is uniformly magnetized in a direction opposite to that of the cavity field produced by the shell. As such a working field that has a strength greater than that of the cavity field produced by the shell is located in the tunnel.Type: GrantFiled: October 11, 1994Date of Patent: June 27, 1995Assignee: The United States of America as represented by the Secretary of the ArmyInventors: Herbert A. Leupold, Anup Tilak
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Patent number: 5428334Abstract: A permanent magnet comprising a shell of magnetic material having a hollow avity and an access port that passes through the shell and communicates with the cavity. The shell is permanently magnetized to produce a magnetic field in the cavity. A magnetic insert is located in the cavity. The insert has a tunnel aligned with the access port and is magnetized in a direction opposite to the direction of the magnetic field. Specifically, a spherical magnetic shell has a concentric cavity in which a spherical magnetic insert is housed. An access port in the form of an axial hole passes through the spherical center of the shell and the insert. The shell ("magic sphere") is magnetized such that it is capable of producing a uniform magnetic field in the cavity. The insert is uniformly magnetized in a direction opposite to that of the cavity field produced by the shell. As such a working field that has a strength greater than that of the cavity field produced by the shell is located in the tunnel.Type: GrantFiled: October 11, 1994Date of Patent: June 27, 1995Assignee: The United States of America as represented by the Secretary of the ArmyInventors: Herbert A. Leupold, Anup Tilak
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Patent number: 5426408Abstract: A superconducting magnet module comprises an alternate series of abutting and coaxially aligned first and second superconductive magnet modules. The first magnet module includes a first substrate having opposed first and second faces and a bore filled with a superconductive material extending between the first and second faces. The first face is formed of an electrically conductive material and the second face is formed of an electrically insulating material. A first spiral track of the superconductive material is formed on the first face in electrical and thermal contact with the electrically conductive material. The first spiral track is melt fused to the superconductive material in the bore. The second magnet module includes a second substrate having opposed third and fourth faces. The third face is formed of an electrically conductive material and the fourth face is formed of the electrically insulating material.Type: GrantFiled: May 7, 1993Date of Patent: June 20, 1995Assignee: The United States of America as represented by the Secretary of the NavyInventors: Thomas E. Jones, Wayne C. McGinnis, J. Scott Briggs
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Patent number: 5426271Abstract: A liquid level sensor is provided with a single piece pivotable device which is used to move a permanent magnet into and out of the detection zone of a magnetically sensitive component, such as a Hall effect element. The pivotable device comprises a buoyant portion, a magnet holding portion and a pivot portion with arms connecting the pivot portion to the buoyant portion and the magnet holding portion. The pivot portion of the pivotable device is shaped to be received over a fixed post attached to a container. The injection gate of the mold used to form the pivotable device is advantageously located so that the pressures throughout the mold cavity are positive to the action of the foaming agent to result in the buoyant portion of the pivotable device having a significantly lower density than the other portions of the pivotable device. This variable density in a single piece device permits a smaller overall size to be used without sacrificing the sensitivity needed to detect changes in a liquid level.Type: GrantFiled: January 18, 1994Date of Patent: June 20, 1995Assignee: Honeywell Inc.Inventors: Richard A. Clark, Brad L. Cummins, Timothy K. Erickson, Brian D. Mc Bride, Gary R. O'Brien
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Patent number: 5426565Abstract: A clamping arrangement for an electronic package includes a supporting means for supporting an electronic package and a clamping means for clamping the electronic package to the supporting means. The clamping means includes a plurality of springs between a clamping plate and a load distribution plate for evenly applying forces from the clamping plate to the load distribution plate to press the electronic package against the supporting means.Type: GrantFiled: March 26, 1993Date of Patent: June 20, 1995Assignee: Sundstrand CorporationInventor: W. Kyle Anderson
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Patent number: 5426563Abstract: A three dimensional module for housing a plurality of integrated circuit chips is shown. The IC chips are mounted in rows on a plurality of substrates. Parallel to each row are communications bars which provide signal paths allowing chips on one substrate to communicate with those on another substrate. The communications bars also serve as spacers between substrates, thereby forming cooling channels. The IC chips are disposed in the cooling channels so that they come into direct contact with the cooling fluid. Signal lines to and from the IC chips are kept as separated as possible from the power lines so as to minimize noise. To this end, relatively thick power supply straps are mounted to each substrate below each row of IC chips. The power supply straps are, in turn, connected to power feed straps such that a very low impedance power supply path to the IC chips is maintained.Type: GrantFiled: November 22, 1993Date of Patent: June 20, 1995Assignee: Fujitsu LimitedInventors: Larry L. Moresco, David A. Horine, Wen-Chou V. Wang
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Patent number: 5424914Abstract: The present invention relates to an apparatus for providing a cooling system for electrical components mounted to the opposite side of a backplane from that on which the cooling air is dispersed. The invention of the present application accomplishes this cooling by providing for siphoning a portion of the cool air from the air plenum, directing it up a duct, and delivering it through a series of apertures onto the component which requires cooling on the back side of the backplane. The apertures include one through the backplane which is homologously positioned with respect to the electrical component on the back side of the backplane.Type: GrantFiled: November 24, 1993Date of Patent: June 13, 1995Assignee: Unisys CorporationInventors: Grant M. Smith, John A. Helgenberg
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Patent number: 5424902Abstract: A positioning current is supplied to each phase winding of a stator employed in an electric motor, thereby rotating a rotator in the motor to a predetermined reference position with the use of magnetic force created by the positioning current. Thereafter, a polarizing current is supplied to each phase winding of the stator, thereby polarizing permanent magnets incorporated in the rotator.Type: GrantFiled: December 28, 1993Date of Patent: June 13, 1995Assignee: Kabushiki Kaisha ToshibaInventors: Yoshiharu Shida, Akinori Higashide
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Patent number: 5424910Abstract: The present invention provides a lever assembly for reversibly inserting a control device into a cell of a center for controlling electrical service. The center has electrical terminals and a post extending perpendicularly into the cell and the control device has a frame of cross-members. The assembly includes a left hand lever, a right hand lever, and a fastener adapted to secure the levers to one of the cross-members and position the levers to engage the post as the device is inserted into the cell. Each lever includes a pivot hole positioned towards one end of the lever. The pivot holes receive the fastener and allow rotation of each lever about the fastener. Each lever also includes an open-ended slot to engage the post in the control center. Each lever also includes means for manually rotating the lever about the pivot hole. The rotating means connects to the end of each lever opposite the open end of the slot.Type: GrantFiled: June 22, 1993Date of Patent: June 13, 1995Assignee: Square D CompanyInventor: Gerald E. Lees
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Patent number: 5424703Abstract: Disclosed is an apparatus and process for magnetizing permanently magnetizable strip and sheet material to form a pattern of band-like poles on the material. Two parallel stacks of permanent magnets are used, each magnet in each stack having a direction of magnetization which is perpendicular to a slot-like air gap between the stacks. The magnets in each stack are parallel to one another, with unlike poles of adjoining magnets proximate so that they mutually attract one another. Unlike poles of the respective magnets in opposite stacks are positioned diametrically opposite each other across the air gap. The apparatus does not use electromagnetic coils and can form very narrow, contiguous band-like poles on magnetizable sheet or strip material which is passed through the air gap.Type: GrantFiled: May 8, 1992Date of Patent: June 13, 1995Assignee: The Electrodyne Company, Inc.Inventor: Walter S. Blume, Jr.
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Patent number: 5424490Abstract: The invention in its main aspect comprises a printed circuit board having a bus extending along a predetermined length of a portion of said printed circuit board, the bus having a predetermined width and defining a plurality of openings therein following a predetermined regular pattern, the pattern having at least a first pair of openings positioned on a first lateral side of an imaginary line along the bus, and at least a second pair of openings positioned on a second lateral side of the imaginary line along the bus, the first and the second pairs of openings being relatively arranged so that a first lead interconnecting the first pair of openings is in a twisted pair relationship with a second lead interconnecting the second pair of openings.Type: GrantFiled: February 25, 1994Date of Patent: June 13, 1995Assignee: Sony Electronics Inc.Inventors: Joseph J. Dombrowski, Donald E. Davis, Alberto M. Gonzalez, Kevin T. Lobb