Abstract: One or more impingement plates, each of which includes one or more apertures, is located within an card cage running from top to bottom and from back to front of the card cage. Each impingement plate is located adjacent to one or more electronic components to be cooled. Channels formed on either side of the impingement plate allow for the ingress of a cooling fluid, the forcing of the cooling fluid through the one or more apertures within the impingement plate toward the electronics to be cooled, and the egress of the cooling fluid after it's contact with the electronics.

Abstract: A radial base heatsink is provided to dissipate heat from a heat source. Such a heatsink comprises a cylindrical core; and a plurality of cooling fins projecting outwardly from the cylindrical core and defining a series of channels in a substantially radial pattern with a fin orientation relative to a center line of the cylindrical core, for dissipating heat generated from a heat source, via the cylindrical core.

Abstract: A heat sink element in the form of a coil with a high thermal conductivity is formed. One end of the heat sink element is directly connected to a circuit element connection conductor under a high potential in a high-frequency circuit mounted on an electronic circuit substrate, and the other end thereof is directly secured to a metal case having the electronic circuit substrate contained therein. As a result, the heat sink element serves as a heat channel transferring the heat generated due to the temperature increase in the circuit element connection conductor to the metal case by means of thermal conductivity.

Abstract: An apparatus is provided for retaining a threaded fastener in an aperture of a support. The apparatus includes a flange position to limit the insertion of the apparatus within the aperture of the support. The apparatus also includes a body extending axially from the flange and being sized for insertion within the aperture of the support. The body defines an opening extending through proximal and distal sections of the body. The opening in the body is sized to receive a threaded fastener in the proximal section of the body, and the opening in the body is sized for engagement of the threaded fastener in the distal section of the body. The proximal section of the body is configured for radial deformation upon engagement of the threaded fastener in the distal section of the body. Such deformation prevents removal of the body of the apparatus from the aperture of the support. A fastener system and a rack mount computer cabinet including the apparatus are also provided.

Abstract: The present invention provides an assembly frame of computer housing capable of rotating and positioning, which comprises a frame body, a first assembly frame, a second assembly frame, a slide structure, and a retaining device. The first assembly frame is fixedly locked in the frame body. The second assembly frame is pivotally joined on the frame body. Through sliding of the slide structure, the second assembly frame can be turned over outwards to facilitate assembly or disassembly for a computer maintenance man. Contrarily, the second assembly frame can reach a predetermined position to let the second assembly frame be hooked on the first assembly frame through retaining of the retaining device, thereby achieving the object of positioning.

Abstract: A stack assembly comprising a housing into which an alternating sequence of elements such as heat sinks and printed circuit boards (PCBs) carrying press-packaged semiconductor devices may be mounted and placed under pressure by a clamping device for use in a variety of power system applications. The PCBs are mounted to the heat sinks by a bracket which axially aligns the press-packaged devices with a longitudinal axis defined by the clamping device. Heat sink compartments in the housing are sized slightly larger than the heat sinks to allow the heat sinks some horizontal play within the compartment when the clamping device is loosened. This is further achieved by using floating anchors to connect the heat sinks to the housing and a flexible connector to connect the heat sinks to a power source. The heat sinks may thus be easily shifted to remove a malfunctioning PCB whilst the bulk of the stack remains in the assembled state, thereby facilitating the rapid re-assembly of the stack.

Abstract: A heat sink mounting structure is constructed to include a bottom rack fixedly fastened to a motherboard by screws to hold a heat sink, two fasteners adapted for securing the heat sink to the bottom rack keeping the heat sink in contact with the CPU at the motherboard, each fastener having a double-end hook mounted in one locating groove of the heat sink and adapted for hooking in retaining holes in corner uprights of the bottom rack, a holding down plate adapted for holding down the double-end hook, and a locking lever pivoted to the double-end hook and adapted for locking the holding down plate.

Abstract: A gas-insulated switchgear is miniaturized and bus-bars connected to bushings are simplified in configuration. A distance L between outer peripheries of a first vacuum interrupter 12 and a second vacuum interrupter 13 is established to be smaller than an external diameter D of the vacuum interrupters 12 to 14, and insulating barriers 28 to 30 are installed between the first vacuum interrupter 12 and the second vacuum interrupter 13, between the first vacuum interrupter 12 and a hermetically sealed container 11, between the second vacuum interrupter 13 and the hermetically sealed container 11, and between the first and second vacuum interrupters 12 and 13 and the third vacuum interrupter 14.

Abstract: A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. A thickness of a base of the fin is larger than a thickness of the heat sink substrate. Furthermore, an electronic apparatus of this invention has a heat sink unit of this invention disposed within the apparatus.

Abstract: A system for heat dissipation in data processing applications is disclosed, including a heat transfer unit matably engaged with a data processing unit and adapted to transfer heat from the data processing unit to a fluid, a fluidic transport system coupled to the heat transfer unit and adapted to provide cooled fluid to, and retrieve heated fluid from, the heat transfer unit, a fluid reservoir coupled to the fluidic transport system, adapted to store cooled fluid and to deliver cooled fluid to the fluidic transport system, and a heat exchange unit coupled to the fluidic transport system and to the fluid reservoir, adapted to receive heated fluid from the fluidic transport system, to cool the fluid, and to deliver the cooled fluid to the fluid reservoir.

Abstract: The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

Abstract: Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

Abstract: An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.

Abstract: The information processing apparatus comprises a duct that forms a cooling air passage where cooling air flows, and a plurality of heat generating components which are cooled by cooling air that flows in the cooling air passage. The heat generating components are arranged displaced relative to the flowing direction of the cooling air as well as displaced one another in the direction crossing the cooling air flowing direction.

Abstract: An integrated apparatus for thermal dissipation suitable for the thermal dissipation of the display chip and the memory chip on a display card. It comprises a baseboard, which contains the first side and the second side. The sets of first and second fins are located on the first side in which the first set is perpendicular to the first side and the second set forms an angle other than 90 degrees with the first side. The second side is in contact with both the display chip and the memory chip. A board hook is located on one side of baseboard that clamps on the edge of the display card. As well as, a fan is located on the first side between the sets of first and second fins.

Abstract: A power distribution panel with a heat sink integrated as a portion of a surface of the power distribution panel and a heat generating component of an electrical circuit within the power distribution panel being connected to the heat sink to allow heat conduction away from the heat generating component.

Abstract: An electronic system enclosure has a first enclosure portion and a second enclosure portion such that the first enclosure portion is removably attachable to the second enclosure portion. A helical spring is mounted to the first enclosure portion and oriented such that the axis of the helical spring substantially follows and contacts the edge of the first enclosure portion, and such that the axis of the helical spring substantially follows and contacts the edge of the second enclosure when the first and second enclosure portions are attached.

Abstract: A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

Abstract: A switch inlet unit comprising a power switch and an inlet accommodated in a case is provided. The switch and the inlet are provided on the front surface of the case body, the terminals of the switch and the inlet are connected with respect to each other, and the joint is held in the case body.

Abstract: An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside.