Abstract: An improved tomographic technique for determining the power distribution of an electron or ion beam using electron beam profile data acquired by an enhanced modified Faraday cup to create an image of the current density in high and low power ion or electron beams. A refractory metal disk with a number of radially extending slits, one slit being about twice the width of the other slits, is placed above a Faraday cup. The electron or ion beam is swept in a circular pattern so that its path crosses each slit in a perpendicular manner, thus acquiring all the data needed for a reconstruction in one circular sweep. The enlarged slit enables orientation of the beam profile with respect to the coordinates of the welding chamber. A second disk having slits therein is positioned below the first slit disk and inside of the Faraday cup and provides a shield to eliminate the majority of secondary electrons and ions from leaving the Faraday cup.

Abstract: A method for the calibration of a measuring device for the measurement of RF parameters of integrated circuits on semiconductor wafers on which there are a large number of such integrated circuits, which is to be carried out as follows: A calibration semiconductor wafer is produced, containing integrated comparison circuit units which correspond to a plurality of characteristic circuit types, and which may be contacted via measuring points on the surface of the calibration semiconductor wafer. The S two-port parameters of each circuit unit on the calibration semiconductor wafer corresponding to any one circuit type are measured with precision. The measured S two-port parameters are stored. The calibration semiconductor wafer is inserted into the measuring device. The measuring device is then calibrated in such a way as to achieve an optimum impedance match at the measuring probe tips which will be brought into contact with the measuring points of the calibration semiconductor wafer.

Abstract: A method and apparatus for measuring a charge on a surface, such as on a semiconductor wafer, arising during plasma processing is provided. Such a charge may be measured on an insulating film applied to such a wafer. By the present invention, the charge on such an insulator exposed to plasma is measured in-situ using micro-cantilevers. The micro-cantilevers include an insulating base positioned on the substrate and a cantilevered beam extending therefrom to over the substrate. The beam is formed of a conductive material. A charge on the beam causes an opposite charge to form on the substrate. The opposite charges attract to move or deflect the beam towards the substrate. The amount of movement or deflection corresponds to the magnitude of the charge. This movement or deflection of the beam can be measured to determine the charge by bouncing a light source, such as a laser, off of the beam. In another embodiment, the cantilever includes a flexible bridge interconnected between the base and a rigid beam.

Abstract: The present invention provides a method of diagnosing a partial discharge in a gas-insulated apparatus and a partial discharge diagnosing system for carrying out the same to achieve highly accurate diagnosis through the detection of a partial discharge signal and diagnosing the partial discharge signal through multiple conditional branching. The partial discharge diagnosing system of the present invention comprises: a partial discharge signal detector for detecting a partial discharge signal representing a partial discharge produced in the gas-insulated apparatus, a signal analyzer for receiving the partial discharge signal detected by the partial discharge detector and analyzing the partial discharge signal, a diagnostic unit for determining a cause of the partial discharge on the basis of results of analysis made by the signal analyzer, and a display unit for displaying results of diagnosis.

Abstract: A system for testing semiconductor components includes a testing apparatus, such as a test carrier for discrete components, or a wafer prober for wafer sized components The system also includes an interconnect for electrically engaging the components. The interconnect includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The thinned substrate has a thickness that is substantially less than a thickness of the components being tested. The thinned substrate can flex upon application of a biasing force by the testing apparatus, permitting the first contacts to move in the z-direction to accommodate variations in the planarity of the second contacts.

Abstract: A method and a device for testing a brain lesion electrode (1) which is intended for use in treatment of a specified area in the brain, for instance, by controlled coagulation or lessening. The device comprises a transparent container (2) which in adapted to accommodate a solution of coagulatable protein with a predetermined salt content, a seal (6), which the brain lesion electrode (1) can penetrate and which is adapted to seal the container (2) containing the solution, a heating device (3) for heating the solution to a selected temperature, a power unit (23) for supplying, during a selected period, current of a predetermined intensity and frequency between the electrode (1) and a backplate electrode (18) in the container (2) to increase the temperature of the solution in the area at the tip of (21) of the electrode when the electrode (1) is introduced into the solution and positioned therein.

Abstract: A probe card, a test method and a test system for testing semiconductor wafers are provided. The test system includes the probe card, a tester for generating test signals, and a wafer prober for placing the wafers and probe card in physical contact. The probe card includes contacts for electrically engaging die contacts on the wafer. The probe card also includes an on board multiplex circuit adapted to fan out and selectively transmit test signals from the tester to the probe card contacts. The multiplex circuit expands tester resources by allowing test signals to be written to multiple dice in parallel. Reading of the dice can be performed in groups up to the limit of the tester resources. In addition to expanding tester resources, the multiplex circuit maintains the individuality of each die, and permits defective dice to be electrically disconnected.

Abstract: An electromagnetic waveform developing in synchronism with a system power supply by a partial discharge of electric equipment such as a power distribution device is received by an antenna 1. From the electromagnetic waveform of measurement frequency included in the received signal, there are extracted a component changing according to the frequency of the system power supply and a component changing at the frequency twice that of the system power supply. The presence or absence of discharge is determined from the magnitude of each of the extracted components, thereby detecting a partial discharge.

Abstract: Provided are an electric resistance measuring apparatus for circuit boards, and an electric resistance measuring method using the same. An electric resistance measuring apparatus includes a one-side inspection circuit board having a plurality of connecting electrodes, and layer connector members provided on the inspection circuit board and formed of a conductive elastomer. Each of the layer connector members is brought into simultaneous contact with a plurality of connecting electrodes at one side thereof to be electrically connected thereto, and at the other side thereof, brought into simultaneous contact with a plurality of electrodes to be inspected to be electrically connected thereto. In this measurable state, two connecting electrodes are used for current supply and for voltage measurement, thereby performing measurement of electric resistance on a specified electrode to be inspected.

Abstract: A conduit apparatus for an electrical enclosure that allows safe, convenient access for current measurement of circuits therein is provided. The conduit apparatus has one or more non-magnetic conduits extending therethrough. The conduits, in turn, each house a conductor. The conduits are accessible from outside the enclosure. By placing a hook-on type ammeter over the conduit, the current in the conductor may be measured. In one embodiment, the conduit apparatus is a component that mounts within a load center or other electrical enclosure. In another embodiment, the conduit apparatus is an integral portion of such an enclosure.

Abstract: A method and apparatus for measuring the frequency of a desired resonant mode of a crystal arrangement, or other two-port device, during an automated operation. The crystal arrangement, or other two-port device, is placed into a test circuit and subjected to a sinusoidal test signal of known frequency. Based upon the output response of the crystal arrangement to the test signal, the frequency of the test signal is changed such that the test signal rapidly converges on a desired mode of operation of the crystal arrangement. This is accomplished by first noting a desired increase in amplitude of the output response of the crystal arrangement, followed by measuring an error signal related to the desired crystal arrangement mode of operation. When the error equals a predetermined value the frequency of the sinusoidal test signal is the frequency of the desired mode.

Abstract: A method and system for predicting malfunctions in a power inverter having one or more legs connected between first and second voltage buses is provided. Each leg has respective first and second controllable switches coupled in series to one another. The method allows for applying predetermined respective voltages at the first and second buses. The method further allows for selectively actuating the first and second switches between respective conductive or non-conductive states.

Abstract: A phase difference to duty-cycle circuit converts a phase shifted signal and a reference signal into a single signal having a duty cycle that is a function of the phase difference between the two signals. The single signal may be further converted to a single direct current (DC) value before being transmitted to external measurement circuitry. The external measurement circuitry, by simply measuring the magnitude of the DC signal, can determine the phase difference between the phase shifted signal and the reference signal. In an alternate embodiment, the phase shift in the target bit of a bit pattern is determined based on measurements of the DC voltage value of the shifted target bit pattern, the DC voltage value of first bit pattern comprising a non-shifted bit pattern representing a zero phase shift of the target bit, and a DC voltage value of a bit pattern comprising a non-shifted bit pattern representing a 100% phase shift of the target bit.

Abstract: A method for determining the harmonic phase response ∠POx of a device under test (DUT) is performed on a vector network analyzer (VNA). The phase ∠GN1 of the transfer response GN1 of the DUT at the fundamental frequency is determined from VNA measurements after appropriate normalization. The corrected phase ∠GHxC of the harmonic transfer response of the DUT is determined from VNA measurements after appropriate normalization. The corrected phase ∠GHxC of the harmonic transfer coefficient GHx is subtracted from a predetermined phase reference ∠refx to obtain a difference ∠refx−∠GHxC, and the phase ∠GN1 of the transfer coefficient GN1 at the fundamental frequency is added to the difference ∠refx−∠GHxC to obtain the harmonic phase offset ∠POx. For the second and third harmonics using a clipping waveform, the phase reference ∠refx is 180°.

Abstract: There is provided a method and system for evaluating a condition of a surface of a combustion vessel exposed to deposition thereon of a material released during a combustion of a fuel in the combustion vessel during a combustion process. The method preferably comprises the steps of imposing a current on an electrical network arranged relative to the combustion vessel and having at least one electrode and thereafter detecting at least one characteristic of the electrical network during the step of imposing a current on the electrical network. The method further includes the step of evaluating a condition of the deposition exposed surface based upon the at least one detected characteristic of the electrical network.

Abstract: The present invention relates to an electro-optic sampling oscilloscope. This electro-optic sampling oscilloscope carries out measurement of measured signal by using an optical pulse generated based on a timing signal generated from a timing generation circuit synchronous with a trigger signal, providing: a timing generation circuit comprising a fast ramp circuit that outputs a ramp waveform using said trigger signal as a trigger, a slow ramp circuit that increases stepwise and sequentially the output value according to said timing signal; a comparator circuit that compares the output of said fast ramp circuit and the output of said slow ramp circuit and outputs the results of this comparison; and a gate circuit that limits the output of said comparator circuit by closing a gate only when the output of said comparator circuit is unstable based on the input trigger signal and timing signal.

Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.

Abstract: A two-dimensional sensor is described including a substrate having a Si layer, a SiO2 layer and a Si3N4 layer. On the surface of the Si back side, a thin film is formed by vapor deposition for making an effect electrode. On the surface of the Si3N4 front side, a fence is attached for containing a sample cell, culture medium and a reference electrode. This sensor is placed in an incubator and a bias voltage is applied between the effect and reference electrodes. When a high frequency modulated laser beam irradiates a spot on the back side of the sensor substrate, a signal of AC photocurrent is obtained from the effect electrode. This signal corresponds to a potential alteration due to the cell activity substantially at the spot. The signal is processed in a computer. Therefore, the beam spot size and location, corresponding to the size and the location of the measurement electrode, can be adjusted easily by focusing or moving the laser beam.

Abstract: A method and apparatus for measuring the resonance frequency of an electric circuit with low disturbance and high accuracy is disclosed. An electrooptic crystal, whose refractive index changes according to the strength of an applied electric field, is used as a sensor, and a frequency-sweep electromagnetic wave is applied to a resonance section of an electric circuit from an external device. The induced current flowing in the resonance section generates an electric field, which is detected by measuring the refractive index of the electrooptic crystal in the form of the relevant light intensity. The resonance frequency is determined based on the maximum electric field strength.

Abstract: A test system for testing semiconductor components includes an interconnect having contacts for making temporary electrical connections with terminal contacts on the components. The interconnect contacts can be configured to electrically engage planar terminal contacts (e.g., bond pads, test pads) or bumped terminal contacts (e.g., solder bumps, solder balls) on the components. The test system also includes an alignment member for aligning the components to the interconnect. Different embodiments of the alignment member include: a curable polymer material molded in place on the interconnect; an alignment opening formed as an etched pocket in a substrate of the interconnect; and a separate fence attached to the interconnect using an alignment fixture.