Abstract: According to one embodiment, an electronic apparatus includes a connector electrically connecting a sub-board to a main board, a heat producing component mounted on the sub-board, a heat pipe opposed to the heat producing component, a pressing member, and fixing members. The pressing member includes a main part opposed to the heat pipe, and a plurality of fixing parts extending from the main part and being located closer to the connector than the main part is. The plurality of fixing members fix the fixing parts of the pressing member to the sub-board, and fix the sub-board to support members at positions that are closer to the connector than the main part is.

Abstract: This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.

Abstract: A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.

Abstract: A cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.

Abstract: Disclosed is a data center comprising a first row of equipment racks, a second row of equipment racks, a hot aisle defined by a space between the first row of equipment racks and the second row of equipment racks, and a track system above the hot aisle of the data center upon which cooling units may be mounted. Cooling units may be moved along the track system. The track system may include portions of track secured to the top sides of one or more cooling units. Also disclosed is a method for installing a cooling unit above a hot aisle of a data center including a plurality of equipment racks.

Abstract: This invention provides an electrical junction box that can restrain a temperature from increasing in a casing. An electrical junction box comprises a casing made of a synthetic resin material, a circuit board contained in the casing, semiconductor relay mounted on the circuit board, a bus bar. The bus bar is insert-molded in the casing. The bus bar includes an embedment section embedded in the casing, and a connecting section that is not embedded in the casing and thermally connected to the semiconductor relay.

Abstract: An electronic apparatus includes a chassis and a heat sink. The heat sink forms one side wall of the chassis. The heat sink has inner and outer wall surfaces corresponding to inner and outer surfaces of the chassis. The heat sink has a guide portion guiding a drop of water initially adhered to the heat sink along the outer wall surface of the heat sink.

Abstract: A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is superimposed on an outer surface of the first heat transfer plate and that insulates heat dissipation, a second heat transfer plate that continues to the first heat transfer plate and that defines a heat conducting surface and a heat receiver that is received by the heat conducting surface of the second heat transfer plate and that defines a flow path of a coolant.

Abstract: An electronic device includes a circuit board, an extension card, a cooling device, and a connecting member. The extension card is coupled to the circuit board. The cooling device includes an outer casing and an inner casing received in the outer casing. The connecting member includes a fixing end and an engaging end opposite to the fixing end. The fixing end is fixedly mounted on the outer casing. The engaging end is configured for fastening the extension card on the circuit board. The outer casing moves between a first position where the engaging end fastens the extension card and a second position where the engaging end is separated from the extension card to unfasten the extension card.

Abstract: An electronic apparatus including a housing having an air outlet and a heat generating component in the housing, a heat sink in the housing and having heat radiating fins arrayed. The apparatus includes heat radiating fins having air flow paths between adjacent pairs of the heat radiating fins, and a fan in the housing. The fan feeds air to an air inlet of the heat sink to exhaust heat of the heat radiating fins from the air outlet of the housing. The air outlet of the housing has openings arrayed which divide the air flow paths formed between the pairs of heat radiating fins.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Abstract: A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of busbars, a plurality of power semiconductor devices bonded to the plurality of busbars, and an integrated cooling system within one or more of the busbars.

Abstract: A method and associated assembly is provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold plate which will eventually exit it through one or more ports or orifices placed on the sides or both side and bottom of the cold plate. The placement, size and number of port(s) or orifice(s) can be selectively adjusted to control amount of coolant flow. Effluent flow from the cold plate flows over the remaining immersion cooled components and then exits the liquid tight enclosure which houses the electronic components.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.

Abstract: Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.

Abstract: An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion.

Abstract: An electronic apparatus that includes a circuit substrate being installed in a casing. The electronic apparatus has first and second groove portions that are formed on a first surface and a second surface of a heat sink, respectively. The heat sink discharges heat from a heat element on the circuit substrate to the outside of the casing. The electronic apparatus has a through-hole portion that is formed at an intersection point of the first groove portion formed on the first surface of the heat sink and the second groove portion formed on the second surface of the heat sink.

Abstract: An electronic device comprises a printed circuit board, a heat sink and a plurality of locking devices securing the heat sink to the printed circuit board. Each locking device comprises a shaft, a knob and an elastic member. The shaft has a plurality of outer teeth protruding outwardly from an outer surface of a top end thereof. The outer teeth are arranged along an axial direction of the shaft. The knob has an inner tooth meshing with the outer teeth of the shaft. The elastic member is compressed between a bottom of the knob and the heat sink. A length of the elastic changes when the inner tooth of the knob meshes with different outer teeth along the axial direction of the shaft to adjust a pressure of the locking device on the heat sink.

Abstract: A vent for a computer apparatus having first and second groups of components. The vent has an air inlet that receives air from a location adjacent to the first group of components and an air outlet that provides air into a space defined between the first and second components. Air flows from the air inlet to the air outlet through a channel that circumvents the first group of components. The computer apparatus may be a server having a plurality of disk drives disposed in a front section of a cabinet. A fan in the back section of the cabinet draws air through a first airflow path across the disk drives. A snorkel defines a second airflow path that circumvents the disk drives in the front section to provide air to the second group of components in the back section.