Abstract: A portable electronic device includes a main body and a centrifugal fan. The main body includes a bottom wall, an opposite top wall and a side wall connecting the top wall with the bottom wall. The bottom wall, the top wall and the side wall cooperatively define a space in the main body. A groove is defined in the top wall for communicating the space with an outside environment of the main body. The top wall is provided with an active cover plate corresponding to the groove. The cover plate is capable of moving upwardly relative to the top wall to define an air intake between the cover plate and the top wall. A centrifugal fan is received in the space of the main body. The centrifugal fan sucks air into the space from the outside environment via the air intake and the groove.

Abstract: A heat radiation structure of an electronic component of the present invention includes a main board mounted with electronic components, an upper side heat sink disposed opposite to a top face of the main board, a lower side heat sink disposed opposite to a second face of the main board, and a cooling fan connected to the upper side heat sink and the lower side heat sink.

Abstract: A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.

Abstract: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler. Accordingly, the air drawn by the cooling fans is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler, thereby cooling the notebook computer.

Abstract: An enclosure arrangement, with protection against touch, of a power electronics appliance, more particularly of a frequency converter (31, 51) and its additional devices (12, 13), which solution contains an enclosed power electronics appliance and one or more enclosed additional devices installed in connection with it, which enclosed power electronics appliance and additional devices are modules, which can be fitted to be installed in combination one above the other such that the protection against touch of the appliance entity formed is as great as or higher than the protection against touch of the separate appliances.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: In general, in one aspect, the disclosure describes a laptop computer that can allow for enhanced cooling of a passively cooled notebook while maintaining the desired waterproof and dust resistance of the design. This is achieved by creating a separate cooling channel where air can flow through to provide cooling to an electronics enclosure connected thereto. The cooling channel may utilize membranes (e.g., hydrophobic membranes) to protect again water and dust penetration. In some cases, two fans are used in opposite directions in order to automatically clean the membranes from dust accumulation.

Abstract: Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.

Abstract: An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lower levels of radiated emissions and improved resistance to incident external radiation. Electric and magnetic shielding is also provided.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Abstract: To improve coolant sealing or reduce the risks in the event of leakage for an electronic unit, e.g. an engine control unit, containing electric and/or electronic components which are disposed on an upper side of a thermally conductive electronic base plate and thermally coupled to the base plate, the base plate in turn being thermally coupled to a coolant passage, there is provided a particular configuration and arrangement of the components delimiting a coolant passage. Advantageously, the underside of the base plate can come into direct contact with a coolant (“direct cooling”). By making a ridge running in an annularly closed manner and being formed in one-piece with the base plate, coolant escaping from the coolant passage is prevented from passing directly to the underside of the base plate. Accordingly, the coolant passage may be sealed by a “double sealing arrangement” on the underside of the base plate.

Abstract: The invention refers to a high-frequency filter (1), comprising a filter housing (2), the filter housing (2) having at least one cover element (2a) with at least one resonator (5, 6, 7, 8, 9, 10, 11, 12) positioned therein and at least one signal input (3), through which a high frequency signal is coupled to the first resonator (5) and a signal output (4), through which a high frequency signal is coupled from the last resonator (10) to downstream appliances wherein the cover element (2a) is made from a thermally conductive material and the resonator (5, 6, 7, 8, 9, 10, 11, 12) is arranged to be in thermal connection with the cover element (2a). The cover element (2a) has at least one recess (23) arranged therein, along with a liquid coolant is guided in order to absorb thermal energy resulting from feeding the high frequency signal to the resonator (5, 6, 7, 8, 9, 10, 11, 12).

Abstract: A portable heat dissipation device is provided for operation with various devices of different purposes for heat dissipation therefrom and includes an enclosure and an air flow generation device. The air flow generation device is set in a given chamber inside the enclosure to effect flowing of air, causing air to enter through an inlet opening defined in a top of the enclosure and forcing the air flowing out through an outlet opening defined in a front wall of the enclosure. The portable heat dissipation device, when applied to remove heat, provides high performance of heat dissipation and effectively extended time interval of operation to thereby extend the lifespan of the device.

Abstract: The invention proposes a cooling structure of a storage apparatus in which cooling air in a chassis is stirred or evened out without affecting the layout in the chassis. The storage apparatus includes fan devices that introduce outside air to heat areas generated from heat generating members arranged on a logical substrate which constitutes a controller unit section for inputting and outputting a data to and from a hard disk drive in response to a data I/O request from a host system, cool the heat areas by stirring the cooling air therein or by causing the cooling air to blow evenly thereon, and discharge the outside air passed through the heat areas to the outside.

Abstract: A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are then each individually oriented 90 degrees such that the thickness direction of the original pyrolytic graphite sheet becomes the width or length of the cut strip. A face on the side of a first strip adjoins a face on the side of a second strip. Due to the greater thermal conductivity in the xy plane of the strips as compared to in the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips.

Abstract: A cooling system may comprise an array of plates, an array of channels, a conduit system, and a phase change material. The array of channels may have a number of a first type of channels alternating with a number of a second type of channels. The conduit system may be capable of circulating coolant through the number of the first type of channels. The phase change material may be located within the number of the second type of channels.

Abstract: An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.