Abstract: A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: A device includes a leadframe and an electronic component. The leadframe includes a first leadframe element having a first surface and a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface. A first flange extends from a first outer edge of the first leadframe element and extends away from the first surface of the first leadframe element. A second flange extends from a second outer edge of the second leadframe element and extends away from the second surface of the second leadframe element. The electronic component is coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.

Abstract: A thermal connector comprising an electrically insulating beam having a first end face at a first end and a second end face at a second end is provided. The second end face may be opposite the first end face in an X direction. The beam may have a width in a Y direction perpendicular to the X direction. The beam may also have a top face and a bottom face offset from the top face in a Z direction. The thermal connector may include a first terminal attached to the bottom face and adjacent the first end and a second terminal attached to the top face and adjacent the first end. The connector may have an overall thickness in the Z direction, which includes the first and second terminals and is greater than 1.27 mm and less than 3.81 mm.

Abstract: A flexible and electrically conductive platform liner is provided for lining an aerial work platform. The platform liner is composed of a flexible and electrically conductive material, such that it is foldable for transport and storage. The platform liner is configured to be placed into the aerial work platform and electrically bonded to an energized power line during operation, such that the platform liner is held at a similar electrical potential to the energized power line.

Abstract: A connection assembly is provided and includes a first conductor, a second conductor and a friction stir welded connection connecting the first conductor and the second conductor, with the second conductor having a bundle of conductor wires. The friction stir welded connection is provided by a friction stir welding tool having a pin connecting a front side of the second conductor pressed onto the first conductor along a connecting direction between the first conductor and the second conductor.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.

Abstract: A multilayer ceramic electronic component includes a rectangular parallelepiped laminate body. An external electrode is provided at both end surfaces of the laminate body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The conductive resin layer includes a first layer on the base electrode layer, a second layer on the first layer, and a third layer on the second layer. With respect to porosity which is an area ratio of pores obtained from a binary image within a predetermined field of view, the first layer and the third layer have a porosity of equal to or less than about 5% and the second layer has a porosity equal to or more than about 6%. Thicknesses of the first, second, and third layers satisfy predetermined conditions.

Abstract: Disclosed herein is a thin film capacitor embedded substrate that includes a substrate and a plurality of thin film capacitors including at least first and second thin film capacitors embedded in the substrate. The first and second thin film capacitors are connected in parallel and have mutually different self-resonant frequencies.

Abstract: A binding structure of wire routing materials are formed by: elongated wire routing materials; a binding member for binding the wire routing materials; and an engaging member including a movable body portion including an engaging portion for assembly into a vehicle body, and a bound portion to be bound and held together with the wire routing materials by the binding member. The bound portion includes a main portion facing the wire routing materials, and a leg portion extending from the main portion and being in contact with the wire routing materials. The movable body portion includes a sliding portion disposed such that sliding thereof is allowed on the wire routing materials in a gap.

Abstract: The present disclosure relates to a signalling cable that includes: a cable core, a metallic screen surrounding and in direct contact with the cable core, and at least one flame retardant low smoke zero halogen polymeric sheath surrounding and in radially position with respect to the metallic screen. The cable core includes a plurality of insulated electric conductors and a core wrap. The insulated electric conductors each includes an electric conductor insulated by a fire barrier and a flame retardant low smoke zero halogen polymeric insulating layer.

Abstract: A housing of a wire harness includes a first member and a second member that store therein an object to be stored; a locking mechanism that locks the first member and the second member, when a first locking surface and a second locking surface are locked to each other in a first direction; and a stabilizer mechanism that includes a fitting surface projecting from the first member to outside, and a biasing part that projects from the second member to the outside, that is elastically and deformably provided along the first direction, that is elastically deformed by coming into contact with the fitting surface while the first member and the second member are locked by the locking mechanism, and that generates biasing force for pressing the second locking surface toward the first locking surface side along the first direction.

Abstract: Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ?L*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background.

Abstract: Systems and methods for a wiring racetrack for aircraft are described herein. The wiring racetrack can include a wiring pallet with a plurality of channels. A plurality of different wiring groups can each be disposed within one of the channels. Each of the wiring groups can include wiring of exclusively one category or one category and neutral wires. Connectors can be electrically coupled to the wires of the group. Fabrication of the wiring racetrack can be automatically performed by one or more robots that include an end effector and a robotic transfer unit.

Abstract: A wire harness includes a harness main body including one or a plurality of conductive paths and an exterior member through which the one or a plurality of conductive paths is inserted, a packing bent portion arranged in a middle of the harness main body and used as a bent portion at a position suitable for packing the wire harness, and a routing path regulating portion arranged at the position suitable for packing the wire harness and configured to regulate the wire harness at a desired path when routing the wire harness.

Abstract: A composite cable includes a twisted assembly including a pair of first single core wires and first and second multicore wires that are each arranged in one or the other of regions facing each other across a center plane passing through the central axes of the pair of first single core wires, include an electric wire with a solid (non-hollowed) structure including a first or second twisted pair wire formed by twisting a pair of second or third single core wires with a smaller cross-sectional area than the first single core wire and a first or second inner sheath covering the first or second twisted pair wire so as to fill a space between the pair of second or third single core wires, and have an outer diameter that is not less than 70% and not more than 160% of the outer diameter of the first single core wire.

Abstract: A coaxial cable and method of construction thereof are provided. The coaxial cable includes an elongate central conductive member; a dielectric insulative layer encasing the central conductive member; an outer protective sheath, and a braided EMI shield layer including hybrid yarn sandwiched between the dielectric insulative layer and the outer protective sheath. The hybrid yarn includes an elongate nonconductive filament and an elongate continuous conductive wire filament. The wire filament is interlaced in electrical communication with itself or other wire filaments along a length of the EMI shield layer to provide protection to the central conductive member against at least one of EMI, RFI or ESD. The method includes providing a central conductive member; forming a dielectric insulative layer surrounding the central conductive member; braiding an EMI shield layer including hybrid yarn about the insulative layer, and forming an outer protective sheath about the braided EMI shield layer.

Abstract: A recessed floor fitting includes a poke-through housing, a divider assembly, and a feeder plate. The poke-through housing has a base and an outer wall with an open top that defines an interior chamber. The base includes a central aperture, a first perimeter aperture, and a second perimeter aperture. The divider assembly separates the interior chamber into a center portion, a first portion, and a second portion. The center portion is in communication with the center aperture. The first and second portions are in communication with the respective first and second perimeter apertures. The feeder plate is connected to the base, and has a mounting flange and a conduit extending from the mounting flange.

Abstract: An improved access electrical box for housing electrical connections for integration with an electrical system having a conduit and a plurality of conduit wires, the electrical box comprising a plurality of box panels forming an interior space and a front opening, the electrical box further has a top opening, and a movable access panel which selectively covers and uncovers the top opening and has a wiring aperture which allows the conduit wires to be inserted into the interior space, the electric box further has an installed device having device wires, which is secured within the front opening such that the device wires extend into the interior space, the movable access panel allows a user to splice the device wires and the conduit wires through the top opening to complete the electrical connections, and is further adapted to enclose the electrical connections when the movable panel is a closed position.