Abstract: Various embodiments of the present application are directed towards a resistive random-access memory (RRAM) cell including a top-electrode barrier layer configured to block the movement of nitrogen or some other suitable non-metal element from a top electrode of the RRAM cell to an active metal layer of the RRAM cell. Blocking the movement of non-metal element may be prevent formation of an undesired switching layer between the active metal layer and the top electrode. The undesired switching layer would increase parasitic resistance of the RRAM cell, such that top-electrode barrier layer may reduce parasitic resistance by preventing formation of the undesired switching layer.

Abstract: A display device and a method of manufacturing a display device are provided. A manufacturing method of a display device includes: forming a display module including a first area defined therein, the display module including a display panel including a lower surface and an upper surface opposite the lower surface, a first film under the lower surface of the display panel, a second film on the upper surface of the display panel, and an adhesive layer between the lower surface of the display panel and the first film; and irradiating a laser beam in an upper direction extending from the lower surface of the display panel to the upper surface of the display panel to cut the first film and the adhesive layer along an edge of the first area, the laser beam provided to the display panel having a laser power equal to or less than about 1 W.

Abstract: A display apparatus includes a display panel including pixels and a cover window disposed on the display panel. The cover window includes a flat portion having a first thickness, and a folding portion having a second thickness that is less than the first thickness of the flat portion, the folding portion being adjacent to the flat portion. A first stress profile of the flat portion of the cover window that is a stress change along a depth direction from a surface of the flat portion of the cover window is different from a second stress profile of the folding portion of the cover window that is a stress change along a depth direction from a surface of the folding portion of the cover window.

Abstract: A flexible display device that can conform to complex curved surfaces, and methods for manufacturing said display device, are disclosed herein. The display device utilizes a Miura-ori origami structure that, in a folded or at least partially folded configuration, is able to conform to complex curved surfaces. The Miura-ori structure involves folding a two-dimensional substrate in accordance with crease lines comprising a tessellation of parallelograms. Each cell of the tessellation pattern can include one or more luminous elements (LEDs, OLEDs, etc.) bonded to circuit elements embedded within the flexible substrate (e.g., Parylene-C).

Abstract: A normally-off HEMT transistor includes a heterostructure including a channel layer and a barrier layer on the channel layer; a 2DEG layer in the heterostructure; an insulation layer in contact with a first region of the barrier layer; and a gate electrode through the whole thickness of the insulation layer, terminating in contact with a second region of the barrier layer. The barrier layer and the insulation layer have a mismatch of the lattice constant (“lattice mismatch”), which generates a mechanical stress solely in the first region of the barrier layer, giving rise to a first concentration of electrons in a first portion of the two-dimensional conduction channel which is under the first region of the barrier layer which is greater than a second concentration of electrons in a second portion of the two-dimensional conduction channel which is under the second region of the barrier layer.

Abstract: Disclosed are a display panel, a manufacturing method and a stretchable display device. The display panel includes a rigid substrate; a flexible substrate and an encapsulation layer. The flexible substrate includes a plurality of through-groove structures and at least one through-groove structure includes a non-fixed region and a fixed region surrounding the non-fixed region. A portion of the encapsulation layer located in the at least one through-groove structure includes a first sub-portion located in the fixed region and attached to the rigid substrate and a second sub-portion located in the non-fixed region and attached to the rigid substrate by an organic separation layer, the second sub-portion is configured to be separated from the rigid substrate in a case of gasification of the organic separation layer, and the first sub-portion is configured to be lifted off from the flexible substrate together with the rigid substrate under an external force.

Abstract: A display substrate includes pixel-defining layer and sub-pixels of three colors. The pixel-defining layer defines a plurality of sub-pixel areas having the sub-pixels arranged in therein; the pixel-defining layer includes a first pixel-defining layer and a second pixel-defining layer; a height of the second pixel-defining layer is smaller than a height of the first pixel-defining layer; and the first pixel-defining layer is configured to separate adjacent sub-pixels of different colors; the second pixel-defining layer is configured to separate adjacent sub-pixels of the same color; and the sub-pixels of three colors include red sub-pixels, blue sub-pixels, and green sub-pixels; the display substrate includes at least one column of sub-pixels, and in the at least one column of sub-pixels, sub-pixels belonging to a same column have a same color; and in a column of sub-pixels of the same color, corresponding light-emitting layers of at least two adjacent sub-pixels are connected.

Abstract: Structures and methods for reducing process charging damages are disclosed. In one example, a silicon-on-insulator (SOI) structure is disclosed. The SOI structure includes: a substrate, a polysilicon region and an etch stop layer. The substrate includes: a handle layer, an insulation layer arranged over the handle layer, and a buried layer arranged over the insulation layer. The polysilicon region extends downward from an upper surface of the buried layer and terminates in the handle layer. The etch stop layer is located on the substrate. The etch stop layer is in contact with both the substrate and the polysilicon region.

Abstract: A semiconductor device includes: a resin substrate; a display element configured to generate an image; and a circuit layer including a thin film transistor configured to control the display element. The resin substrate has a main body made of resin and a surface layer made of the resin laminated on the main body. The surface layer has a lower electrification property than the main body or the surface layer has a lower film density than the main body. Each of the display element and the circuit layer is on the surface layer.

Abstract: A display device including a light emitting diode chip, including: a light emitting structure which includes a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers; a second electrode which is electrically connected to the second conductive semiconductor layer; an insulation unit which is disposed to cover a part of the top surface of the second electrode and side surfaces of the light emitting structure; and a second fixed part which covers the top surface of the insulation unit and is electrically connected to the second electrode, and at least a part of which extends to the side surfaces of the light emitting structure.

Abstract: The present disclosure provides an organic light emitting diode (OLED) display panel and a display panel which include a display region, a binding region, and a bending region. A metal trace inside the bending regions generates a tensile stress region and a compressive stress region. A plurality of through holes are disposed on the metal trace. A distribution density of the through holes corresponding to the tensile stress region is different from distribution density of the through holes corresponding to the compressive stress region. It may relieve the stress, reduce the problems such as failure and bad products, reduce the bending angle to be smaller, and achieve narrower borders.

Abstract: Implementations of a method for aligning a semiconductor wafer for singulation may include: providing a semiconductor wafer having a first side and a second side. The first side of the wafer may include a plurality of die and the plurality of die may be separated by streets. The semiconductor wafer may include an edge ring around a perimeter of the wafer on the second side of the wafer. The wafer may also include a metal layer on the second side of the wafer. The metal layer may substantially cover the edge ring. The method may include grinding the edge ring to create an edge exclusion area and aligning the semiconductor wafer with a saw using a camera positioned in the edge exclusion area on the second side of the wafer. Aligning the wafer may include using three or more alignment features included in the edge exclusion area.

Abstract: A method of manufacturing a display apparatus includes forming a first substrate on a support substrate; forming a first barrier layer on the first substrate; and forming a conductive layer by implanting n-type impurities or p-type impurities in the first barrier layer and at least a portion of the first substrate. A display apparatus includes a conductive layer arranged on a substrate and a barrier layer arranged on the conductive layer. The conductive layer is doped with n-type impurities when the first barrier layer is doped with n-type impurities, and the conductive layer is doped with p-type impurities when the first barrier layer is doped with p-type impurities.

Abstract: A flexible display panel, a manufacturing method for the flexible display panel, and a display device are provided. The flexible display panel includes a packaging layer, a driving circuit layer and an insulation layer. The insulation layer serves as a base of the flexible display panel and is located at a side of the driving circuit layer distal to the packaging layer, each of a CTE and a light transmittance of the insulation layer is within a respective predetermined range, the CTE of the insulation layer is smaller than a first threshold, the light transmittance of the insulation layer is greater than a second threshold, the first threshold is within a range of 5 to 15, and the second threshold is within a range of 90% to 99%.

Abstract: Capacitor structures with low capacitances are disclosed. In one example, a capacitor structure is disclosed. The capacitor structure includes a first electrode and a second electrode. The first electrode comprises a first metal finger. The second electrode comprises a second metal finger and a third metal finger that are parallel to each other and to the first metal finger. The first metal finger is formed between the second metal finger and the third metal finger. The capacitor structure further includes: a fourth metal finger formed as a dummy metal finger between the first metal finger and the second metal finger, and a fifth metal finger formed as a dummy metal finger between the first metal finger and the third metal finger. The fourth metal finger and the fifth metal finger are parallel to the first metal finger.

Abstract: Provided are a display substrate, a preparation method thereof, a method for bonding a display panel, and a display apparatus. The display substrate includes a display region and a bezel region, the display region includes multiple corner regions and the corner regions include a corner display region and a blank corner cutting region which are alternately disposed. The corner display region includes a composite wiring layer disposed on a base substrate, a drive structure layer disposed on the composite wiring layer and light-emitting elements disposed on the drive structure layer. The composite wiring layer includes a first wiring layer, a second wiring layer and a first insulating layer disposed between the first wiring layer and the second wiring layer. The drive structure layer includes a pixel drive circuit and multiple connection electrodes. The first wiring layer includes a gate line, and the second wiring layer includes a data line.

Abstract: A flexible display apparatus includes: a flexible display panel including a first area, a second area, and a bending area between the first area and the second area; a first protection layer including a first surface facing the flexible display panel and a second surface opposite to the first surface; and a driving unit electrically connected to the flexible display panel. The first protection layer is disposed continuously over the first area, the second area, and the bending area to be adhered to the flexible display panel.

Abstract: Provided is a display apparatus. The display apparatus may include a monolithic device in which a light emitting element array, a transistor array, and a color control member are monolithically provided on one substrate. The display apparatus may include a first layered structure including the light emitting element array, a second layered structure including the transistor array, and a third layered structure including the color control member, wherein the second layered structure may be between the first layered structure and the third layered structure. The light emitting element array may include a plurality of light emitting elements comprising an inorganic material. The plurality of light emitting elements may have a vertical nanostructure.

Abstract: A flexible display panel includes: a stretchable base film; an adhesive layer disposed on a surface of the stretchable base film; a flexible substrate including a plurality of display units and a plurality of connection units, every two adjacent display units being connected by at least one connection unit; and a plurality of first release agent films disposed between the plurality of connection units and the adhesive layer, the plurality of first release agent films and the plurality of connection units being in one-to-one correspondence. An orthographic projection of each connection unit on the stretchable base film is within an orthographic projection of a corresponding first release agent film on the stretchable base film. The plurality of display units are bonded to the adhesive layer.

Abstract: In a display region, each first power-source line and each second power-source line intersecting with the first power-source line are electrically connected together via a contact hole in a second inorganic insulating film. In addition, each source line and each second power-source line intersect with each other via the second inorganic insulating film and a first organic insulating film.