Abstract: A method of providing a mask includes providing a first mask layer facing a second mask layer, in the second mask layer, providing a first opening which corresponds to a deposition opening of the mask, providing an auxiliary layer which faces the first mask layer with the second mask layer therebetween and covers the first opening, in the auxiliary layer, providing a second opening which corresponds to the first opening and exposes the first mask layer to outside the auxiliary layer, in the first mask layer, providing a third opening which corresponds to the first opening and the second opening by using the auxiliary layer as a mask and providing the auxiliary layer separated from the first mask layer and the second mask layer to provide the deposition mask having the first mask layer having the third opening and the second mask layer having the first opening.

Abstract: A display apparatus including a substrate; a display area arranged on the substrate and including a plurality of pixels, and a peripheral area arranged outside the display area; a dam surrounding the display area; a crack detector arranged between the dam and an end of the substrate and electrically connected to at least one of the plurality of pixels; a crack prevention dam arranged between the dam and the end of the substrate; and an encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer, each covering the display area and a portion of the peripheral area. The first inorganic layer and the second inorganic layer in the encapsulation layer extend to the end of the substrate.

Abstract: A method of manufacturing a stretchable display according to an embodiment of the present invention includes preparing a process carrier substrate, forming a flexible substrate on the process carrier substrate, forming a light emitting layer and a driving element controlling the light emitting layer on the flexible substrate, and attaching a stretchable film divided into a low stretchable area and a high stretchable area such that at least a part of the low stretchable area covers at least a part of the driving element in a state in which the high stretchable area is stretched.

Abstract: A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

Abstract: A display device includes a first substrate 11, a second substrate 12, and a plurality of light emitting elements 10. Light is emitted via the second substrate 12. Each of the light emitting elements 10 is formed by laminating, from a side of the first substrate, a first electrode 51, an organic layer 70 having a light emitting layer, a second electrode 52, and a sealing layer 15. A light diffusion layer 80 containing fine particles 81 is formed between the sealing layer 15 and the second substrate 12. Orthographic images of the fine particles 81 in the light diffusion layer 80 do not overlap each other on the second substrate 12. Alternatively, the light diffusion layer is formed between the sealing layer and the second substrate, and the light diffusion layer includes a flat portion and a plurality of protruding portions each constituted by a part of a spherical surface protruding from the flat portion.

Abstract: A lamination device includes a first jig in which a window is disposed, where a recessed part is defined in a bottom surface of the first jig, and the window is disposed in the recessed part, and a second jig including a seated part disposed in the recessed part, where a display panel is disposed on the seated part to face the window. A through-hole extending from a side surface of the first jig to the recessed part of the first jig is defined in the first jig.

Abstract: According to an aspect, a display device includes: a substrate; a plurality of pixels provided on the substrate; and a first light emitting element and a second light emitting element that are included in each of the pixels. A light emitting layer of the first light emitting element includes gallium nitride to which europium is added, and a light emitting layer of the second light emitting element includes a multi-quantum well structure in which indium gallium nitride and gallium nitride are layered.

Abstract: A substrate and a display device. The substrate includes: a hole region including a plurality of holes penetrating the substrate; and a non-hole region including a plurality of connection portions and a plurality of pixel regions separated from each other. Each connection portion is between adjacent pixel regions to connect the adjacent pixel regions, wherein a straight line in any direction parallel to the substrate passes through the hole region and the plurality of holes include at least two holes having different deformation degrees.

Abstract: A display device includes a fan-out portion including a first fan-out portion including first conductive lines, and a second fan-out portion including second conductive lines. The first conductive lines are apart from each other by a first pitch in a bending area of a substrate of the display device. The second conductive lines are apart from each other by a second pitch in the bending area.

Abstract: A flexible display module includes a back film, and a flexible display screen and a protective cover plate that are sequentially stacked on a side of the back film. The protective cover plate includes a cover plate body and at least one arc-shaped extension portion. An end of an arc-shaped extension portion is connected to a side face of the cover plate body. An end of the arc-shaped extension portion away from the cover plate body extends beyond an edge of the flexible display screen and an edge of the back film. An arc-shaped concave surface of the arc-shaped extension portion faces a side face of the flexible display screen and a side face of the back film that are proximate to the arc-shaped extension portion.

Abstract: The present application relates to a display device. The display device includes a flexible display panel including display and back surfaces in a thickness direction thereof; a supporting back film located on the back surface, and including a bendable area and fixed areas located at opposite sides of the bendable area in a first direction; and an adhesive part located between the fixed area and the back surface, and adhered to the fixed area and the back surface; and a flexible supporting part located between the bendable area and the back surface, and being in contact with the bendable area and the back surface. The flexible supporting part is in direct contact with the back surface of the flexible display panel.

Abstract: A flexible display panel and a fabricating method thereof are described. The fabricating method has steps of: providing a substrate comprising a hard state and a soft state; forming a thin-film transistor layer on a side of the substrate in the hard state; forming an organic light-emitting layer on a side of the thin-film transistor layer away from the substrate; forming an encapsulation layer on a side of the organic light-emitting layer away from the thin-film transistor; wherein, after laying of each film layer in the flexible display panel, a photoinitiator layer is formed on a side of the substrate away from the thin-film transistor layer, and the substrate and the photoinitiator layer are irradiated with the preset ultraviolet light to change the substrate from the hard state to the soft state to obtain the flexible display panel. The fabricating method avoids problems caused by using laser lift-off technology.

Abstract: An organic light emitting diode (OLED) device structure and a manufacturing method thereof are provided. The OLED device structure includes a base layer, an array segment film layer, an organic light emitting layer, a thin film packing layer, a touch layer, a polarizer, a cover glass, a composite material layer, and a foam copper foil layer. The OLED device structure can solve problems of low penetration rate, poor heat dissipation, buffer layers are easy to peel, and easy breakage in backplane layers of current OLED panels.

Abstract: The present application provides a display panel and a fabrication method thereof. In the display panel, a bonding module covers a display area and an extension area, and a bonding conductive layer of the bonding module is electrically connected to an external driving chip. A display module covers the display area and the extension area, the display module comprises a thin film transistor array structure, and the thin film transistor array structure comprises a source-drain conductive layer. A portion of the source-drain conductive layer in the extension area is electrically connected to the bonding conductive layer by a through hole.

Abstract: The present disclosure discloses an OLED package structure, a display panel and a method for preparing a package structure. The OLED package structure includes a substrate, an OLED disposed on the substrate, and a reinforcement hole disposed on at least one of the substrate and the OLED and extending along a side of the OLED towards the substrate; and an encapsulation layer covering the OLED, and at least a portion of the encapsulation layer extending into the reinforcement hole. Therefore, the reliability of the package structure can be increased, the adhesive strength of the package layer can be increased, peeling or package failure can be prevented, and the service life of the package structure can be improved.

Abstract: A display panel and manufacturing methods thereof are provided. In one example, the display panel includes a flexible substrate having a display area and a non-display area, a dam structure located in the non-display area and disposed around the display area, one or more grooves disposed on the non-display area between the display area and the dam structure, and an organic encapsulation layer. In some examples, the organic encapsulation layer covers each of the display area, at least a portion of the non-display area, and the one or more grooves. Accordingly, a display device comprising the display panel is also provided. Thus, a flatness of the organic encapsulation layer may be improved and peeling may be reduced between the organic encapsulation layer and a substrate on which the organic encapsulation layer is disposed, thereby improving an overall quality of the finished display panel.

Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

Abstract: A semiconductor structure includes a conductive feature, a first metal-based etch-stop layer over the underlying structure, a metal-free etch-stop layer over the first metal-based etch-stop layer, a second metal-based etch-stop layer over the metal-free etch-stop layer, an interlayer dielectric layer over the second metal-based etch-stop layer, and an interconnect structure extending through the first metal-based etch-stop layer, metal-free etch-stop layer, and the second metal-based etch-stop layer, wherein a bottom portion of the conductive interconnect structure directly contacts the conductive feature. The first metal-based etch-stop layer may include a first metallic component having one of aluminum, tantalum, titanium, or hafnium, and the second metal-based etch-stop layer may include a second metallic component the same as or different from the first metallic component. The first metal-based etch-stop layer and the second metal-based etch-stop layer may both be free of silicon.

Abstract: A stretchable device includes a substrate, the substrate including first regions having a first stiffness and a second region between adjacent first regions and having a second stiffness that is lower than the first stiffness, a unit device array including unit devices on separate, respective first regions of the substrate, and an encapsulant covering the unit device array. The unit device array includes pixel electrodes isolated on separate, respective first regions of the substrate, common electrodes isolated on separate, respective first regions and each facing a separate pixel electrode, the stretchable device configured to apply a same voltage to the plurality of common electrodes, and active layers on separate, respective first regions and each between a separate pixel electrode and a separate common electrode.

Abstract: A display motherboard is provided. The display motherboard is provided with barrier walls on at least one of an array substrate or a cover plate in a non-display region, so that stress generated by a cutting will be blocked and released by the barrier walls when the display motherboard is cut. Therefore, the stress will not enter the sealant and the display region, and the stress is released, thereby to prevent microcracks in the sealant and even fractures in films of the display motherboard. Moreover, the stress cannot enter the display region, and the encapsulation of the display region is complete.