Abstract: A method of screen printing a conductive ink onto a substrate to form a pattern of narrow, closely spaced conductive lines. Before screening, the conductive ink is exposed to ambient air until its viscosity is in the range 700,000 to 900,000 centipoise at 70.degree. Fahrenheit.

Abstract: A conical sheath of air emitted from a vortex plenum adjacent the outer edge of a rotating bell spray apparatus is effective to optionally help atomize the coating material, and to carry the atomized material forwardly toward a confluence on the axis of the rotating head where tubulent mixing of the particles occurs, and the particles are sprayed forwardly for deposition in a uniform thickness film of a uniform population mix of particles sizes. Forward air and tangential air components are admitted to the plenum and are independently controlled so that different spray characteristics are obtained, the tangential air providing a swirl moment to the conical air sheath which enlarges the size of the deposited film pattern. The forward velocity determines the atomization ability of the sheath air and the particle velocity in the spray pattern. Electrostatic and non-electrostatic operations are intended.

Abstract: A method is disclosed for the fabrication of an air supported crossover bridge which consists of a polyimide coating being set over the metalized device. Then, supports are defined for the crossover and the crossover is added. Once the crossover has been added the excess is removed and the polyimide layer is removed leaving the air supported bridge.

Abstract: Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.

Abstract: A process of insulatingly coating a front and a back surface of a printed circuit board is disclosed. A vessel has a large top opening for receiving coating liquid therein and has a plurality of small apertures formed in the bottom. The vessel is immersed into a pool of coating liquid contained in a reservoir for injection of coating liquid into the vessel. The vessel is pulled upward from the reservoir before a printed circuit board reaches the location of the vessel, whereby a coating liquid flows down through the plurality of apertures in the vessel as series of continuous thin streams in the form of strings. A printed circuit board disposed at an angle is fed through the shower thus formed. After passing through the shower, the board is pivotally driven to present a surface which has previously been facing downward upward, and the board is again fed in an inclined position through the shower.

Abstract: An apparatus for use in coating a selected area of a surface of a body, such as a flat disc type body, includes a support member having a recess in one side which is adapted to receive the body and an opening through the bottom of the recess which is smaller than the recess. A cup-shaped cover plate is adapted to fit into the recess in the support member. The cover plate has a bottom which is adapted to engage the body and hold it firmly against the bottom of the recess with the surface of the body to be coated being exposed through the opening in the support member. A mask of a magnetic material is adapted to fit in the opening in the support member against the surface of the body. A permanent magnet is adapted to be seated against the bottom of the cover member and attract the mask to hold the mask against the surface of the body.

Abstract: A thin material film for the manufacture of a semiconductor device is inspected in the presence of pinholes therein. This is achieved by forming a reactive material film which can gasify through a chemical reaction with a reactive solution on the surface of a semiconductor substrate and thin material film to be tested which can chemically resist the reactive solution is formed on the surface of the reactive material film, whereby the structure obtained by the above steps is immersed into the reactive solution.

Abstract: The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear from the copper innerlayers, followed by treatment of the hole surfaces with a solvent for the resin, treatment of the hole surfaces with a highly alkaline permanganate solution, and deposition of a conductive metal layer on the hole surfaces.

Abstract: Optical devices which reduce the risk of damage by high energy laser pulses re made by applying particles to the surface of optical components. The particles serve as plasma initiation sites. The particles are made of material capable of producing large numbers of free electrons when illuminated above a preselected power level. Above the preselected power level, transmittance or reflectance of the optical component is limited by the plasma created by the free electrons.

Abstract: Silicon films in integrated circuits are mass produced with reduced structural defects by passing a reactant gas which contains silicon over a batch of wafers in a quartz chamber to deposit a silicon substance on both the wafers in a quartz chamber and the quartz walls of the chamber; repeating the passing step on other batches of wafers until the thickness of the silicon substance on the quartz walls exceeds a predetermined limit; directing a forceful stream of gas against the quartz walls to knock microscopic particles of the silicon substance therefrom; removing the knocked-off microscopic particles from the chamber; and continuing the passing and repeating steps with no intervening acid etch of the silicon substance on the quartz walls.

Abstract: Laser marking of metal surfaces, particularly semiconductor device packages, is accomplished by depositing an electroless nickel layer on the surface, converting the nickel surface to a form in which it is highly absorptive of radiant energy and exposing the converted nickel surface to laser energy through a mask. The resulting mark is highly resistant to abrasion and corrosion. In addition, the method is highly suitable for use with automated laser marking equipment. Furthermore, it appears that the presence of the converted electroless nickel surface in the region of welds increases the hermeticity of the welds. This is particularly useful in packages of the TO-3 type and similar types.

Abstract: A continuous, in-line deposition system is disclosed for coating large substrates. The apparatus includes loadlock chambers for loading and unloading substrates arranged in carriers. The carriers transport through the apparatus a plurality of pairs of substrates with their principal faces, that is faces to be coated, held in a plane that is both parallel to the electric field of the glow discharge reaction and perpendicular to the direction of motion of the substrates through the apparatus.

Abstract: A conventional vapor phase deposition reactor tube typically formed of quartz is provided with a tubular liner supporting one or two crucibles carrying in turn one or two boats for holding constituents used for the deposition process. The liner, crucibles and boats are formed preferably of pyrolytic boron nitride (PBN). Reactant or constituent gas carrying tubes are formed preferably of sapphire. A buffer zone of an inert gas upstream of the liner and between the liner and the tube serves to isolate the liner and reactor tube from contaminating gases.

Abstract: An improved alkaline permanganate composition for etching printed circuit boards is provided by incorporating a secondary oxidant in the solution capable of oxidizing manganate ion to permanganate ion.

Abstract: A door panel having an insulating foam core and a pair of rigid inner and outer skins preferably formed of steel or other metal. The skins have side flanges with hook portions that mechanically interlock. The interlocking flanges provide a method of mechanically attaching the inner and outer skins of the panel to each other by utilizing the compression and spring back of the core during assembly. A resilient thermal barrier element is interposed between the interlocking flanges to prevent them from making direct contact with each other while at the same time sealing the joint, the thermal barrier element also including a cushioning bead engagable with a similar bead of another door panel to provide a weather seal therebetween. The method of making the panel is also disclosed.

Abstract: The invention described avoids all the problems of the above described prior art techniques and is characterized by holding the workpiece in an inverted position, contacting the inverted face of the workpiece with a precisely metered amount of a flowable material and rotating the workpiece in its inverted position after it has contacted the polymer to coat the workpiece with a thin, uniform layer of the flowable material. The present invention is also directed to an apparatus for coating a substrate comprising, a spindle holding the workpiece in an inverted manner so that the face of the workpiece to be coated faces downwardly towards a liquid deposit of the coating material which is supported on a nozzle beneath the spindle, which spindle may be moved to permit the inverted slice to contact the liquid deposit and means for spinning the spindle in the inverted position to spread the coating material uniformly across the face of the spinning workpiece.

Abstract: Pack cementation is used to diffusion bond substantially pore-free nickel to discrete exposed areas of tungsten or molybdenum that are in turn bonded to the surface of a ceramic body, e.g. in the preparation of a ceramic chip carrier.

Abstract: A method of providing through-hole plating between flexible circuit elements and rigid circuit elements is presented wherein a strong and reliable electrical connection is affected without damage to the conductive pattern of the flexible circuit elements. The method includes selectively providing removable masking material to portions of a flexible circuit element followed by nonelectrolytic plating and subsequent removal of the mask. An additional resist layer is also provided to selective areas followed by electrolytic plating and subsequent removal of the resist material.

Abstract: A thin film stripe that includes a conductive metal alloyed with at least one other element capable of chemically bonding with hydrogen and a compound formed by hydrogen chemically bonded with at least one other element in sufficient amounts to increase the stripe's resistance to electromigration failure at normal operating temperatures and pressures.

Abstract: The compounds TiSi.sub.2 and TaSi.sub.2 have been found to be suitable substitutes for polysilicon layers in semiconductor integrated circuits. Suitable conducting properties of the compounds are ensured by providing a relatively thin substrate of polysilicon.