Abstract: A process for forming a multilayer composite insulator includes the steps of forming an insulator precursor by orienting an insulation insert in a desired location between a first facing layer and a polymer based blanket layer, applying differential heat to two opposing sides of the insulator precursor and applying pressure to the insulator precursor. Together, the applied differential heat and applied pressure mold the insulator precursor to a desired shape while also providing the polymer based blanket material with a first relatively high density adjacent a warmer of the two opposing sides and a zone of relatively low density adjacent the cooler of the two opposing sides. The process also includes the cooling of a molded precursor to set the insulator in the desired shape.

Abstract: An electrical cable and a method for manufacturing the electrical cable are provided in which a plurality of conductors have an inner protective layer extruded thereabout, a ribbed or finned surface exterior thereto which includes a plurality of longitudinally extending ribs or fins between which exist a plurality of channel regions, an outer insulation layer thereabout, and a material within the channel regions which provides self-sealing properties to the cable, all applied to the conductor as a combined multilayer, the inner layer and outer layer merging to form the fins therebetween.

Abstract: A laminated product is provided including a carrier sheet, a polymeric film ply, a polymeric card ply, and a radiation-curable laminating adhesive. The polymeric film ply is secured to the carrier sheet and extends over a cut-out portion formed in the carrier sheet. The polymeric card ply is positioned within the cut-out portion. Either the film ply, the card ply, or both, are transparent to electromagnetic radiation. The radiation-curable laminating adhesive is positioned to secure the polymeric card ply to the exposed ply portion and comprises a bonding agent, a monomer, an oligomer, a tackifier, and a photocatalyst. The bonding agent is present in a quantity sufficient to improve the bonding characteristics of the adhesive composition. The monomer is present in a quantity sufficient to (i) increase the flexibility of the adhesive composition, and (ii) increase the tendency of the adhesive composition to release substantially cleanly from a surface to which it is bonded.

Abstract: A method for bonding composite wood products comprises using a PMDI adhesive modified with a polar compound such as a lower alkylene carbonate or triacetin with a combination of conductive thermal heat and radio frequency energy. Propylene carbonate is a preferred modifier. Press temperatures and pressing times may be significantly reduced from those using either unmodified PMDI adhesives or the modified adhesives without radio frequency energy. Laminated veneer products 38 mm in thickness can be pressed at 110°-120° C. in as little as 7 minutes using radio frequency energy at a level of about 32 kw/m2.

Abstract: A method of making a pressure sensitive adhesive article includes depositing a layer of liquid adhesive material onto a substrate, and depositing a layer of non-adhesive liquid material onto the liquid adhesive material, wherein the non-adhesive liquid material covers only a portion of the liquid adhesive layer. The liquid layers can be cured which allows winding the article onto a spool. The pressure sensitive adhesive article includes a substrate with a liquid adhesive layer deposited onto the substrate. At least one liquid non-adhesive structure is deposited onto a portion of the liquid adhesive layer, and the structure can have a theoretical angle of contact with the adhesive layer which is greater than 0°.

Abstract: A support-frame bonding apparatus has an upper pressing member to which a semiconductor device is supplied and a lower pressing member to which a support frame is supplied. An elastic member is provided to the lower surface of a pressing tool in the upper pressing member. The elastic member is formed of a conductive silicon rubber having a satin finish on the side facing the semiconductor device. The outline of the area of the elastic member contacting the semiconductor device is substantially identical to the outline of an adhesive layer. The semiconductor device and the support frame are superposed via the adhesive layer and pressed against each other, the support frame being heated by the pressing stage. Thus, the semiconductor device is bonded to the support frame via the adhesive layer. The satin finish on the surface of the elastic member prevents the elastic member from sticking to the semiconductor device.

Abstract: A method of controlling an ultraviolet (UV) glue size for liquid crystal display (LCD) devices includes using a frame seal or a patterned device layer as a size-controlling material. At first, a pixel electrode matrix structure is formed on a substrate. A frame seal material is then provided along the periphery of the pixel electrode matrix structure and a size-controlling material is provided. The size-controlling material is harder than the UV glue. The size-controlling material is formed with a predetermined shape around a predetermined place in which a UV glue is formed using the predetermined place as the center of the size-controlling material. The predetermined shape of the size-controlling material includes a U-shape, an arch-shape, a line-shape or a L-shape. Next, the UV glue is formed in the predetermined place, which is preferably the corners of the pixel electrode matrix structure.

Abstract: The method comprises positioning two components adjacent each other so as to define a space between them, bridging edges of the space with webs and filling the space with flowable material such as adhesive. A fabric is preferably arranged in the space and is impregnated by the flowable material as it is drawn into the space.

Abstract: A process of fabricating an inflatable item includes providing first and second three-dimensional molds, and placing first and second flexible polymer sheets over respective ones of the first and second molds. The polymer sheets are heated until the sheets conformally coat the respective molds. The heated polymer sheets are cooled such that the sheets retain the three-dimensional shapes of the respective molds. Peripheral edges of the first polymer sheet and the second polymer sheet are welded to each other to form a sealed flexible shell having an interior space that can be filled with fluid to inflate the shell such that the shell forms a three-dimensional shape. The sheets may be welded by placing the cooled polymer sheets on respective plates of a welding machine, and moving the plates toward each other until the peripheral edges of the cooled polymer sheets touch each other.

Abstract: A method of manufacturing a guidewire having a discrete length. The method includes the steps of feeding a first end of a corewire into an extrusion device, gripping the first end of the corewire with a gripping apparatus, and extruding a first extrusion material onto an outer surface of the corewire while the gripping apparatus pulls the corewire through the extrusion device to form an extrusion jacket on the outer surface of the corewire. The corewire has a predetermined length corresponding to a length of the guidewire.

Abstract: This invention relates to a UV curable system of the type for continuously applying a UV curable adhesive to labels, at least partially curing the adhesive on the labels to render the adhesive tacky and thereafter applying the labels to discrete containers through the tacky adhesive layer. Most preferably the labels are cut and stack labels retained in a dispensing magazine prior to the application of the UV adhesive to the labels, and most preferably both the labels and the UV curable (and cured) adhesive are clear, and the clear labels with the clear tacky adhesive thereon preferably are adhered to clear glass containers, e.g. soda bottles, beer bottles and the like.

Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Abstract: A flying web splice apparatus and method for splicing a moving web of material to another web of material without tape or adhesives being used at the splice. Two splicer assemblies are provided which each have a rotatable parent roll feeding web material into the splicer apparatus. Each splicer assembly has a series of substantially parallel vacuum belts and a series of vacuum boxes therein. The vacuum boxes for each splicer assembly are evacuated by a vacuum blower, which creates a vacuum causing a suction through holes within a portion of the vacuum belts in order to hold web material to the vacuum belts. The series of belts for each splicer assembly are preferably rotatable about a top pivot to bring a bottom portion of each series of belts together.

Abstract: A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: Die bonding apparatus is provided in which in order to move a target die to a pick-up position, a wafer table is moved by rotation and along one linear axis. This reduces the footprint of the apparatus in comparison to prior art apparatus in which this movement is accomplished by movement along two orthogonal linear axes. In an embodiment of the invention, however, movement along a second orthogonal liner axis may also be provided whereby a user may select the method of moving a target die to the pick-up position.

Abstract: A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.

Abstract: This invention relates to the extrusion coating of polyethylene terephthalate (PET) onto paperboard. Such structures of this type, generally, provide an enhanced film adhesion of the PET onto the paperboard, while reducing the coat weights of the PET.

Abstract: The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.

Abstract: Optical disc manufacturing apparatus of the present invention comprises a nozzle for ejecting TV curable cationic composition, ultraviolet radiation means for radiating ultraviolet rays while the UV curable cationic composition dropping from the nozzle reaches a disc substrate; and superimposing means for superimposing the two disc substrates one upon another by allowing planes onto which the UV curable cationic composition is dropped to be faced. To allow the UV curable cationic composition to spread between the two disc substrates superimposed by the superimposing means: a statically placing plane for placing the disc should be provided. A stacking means for stacking the plurality of discs and rigid disc placing means for placing a rigid disc having a flat plane on the disc in the course of stacking the plurality of discs should be provided.