Abstract: An ultrasonic welding assembly is disclosed. The assembly includes a vibratory horn and at least one mount securing the horn. The horn has a resonant frequency and the mount has a resonant frequency about the same as the horn. The mount includes an inner portion that holds the horn at a nodal region. The mount also includes an outer surface that is coupled to a support member, for example, a bearing. The mount vibrates in resonance with the horn at the resonant frequency, wherein the vibration amplitude of the outer surface of the mount is generally up to about 15 percent of the vibration amplitude of the inner portion.

Abstract: A rotary tool (200) having on the end surface of a large-diameter portion (210) facing a small-diameter portion (220) grooves (213) formed in arc-like shapes, and performing friction stir weld by inserting the end surface of the large-diameter portion (210) and the small-diameter portion to members and rotating the tool (200). By the rotation, the metal of the members moves along the grooves (213) to the center axis direction of the rotary tool (200). The arc-shaped grooves (213)are formed to curve toward the direction of rotation. Since the metal material of the members is moved toward the center, a good weld is realized even when only one of the members to be welded has a projection, or when a large gap is formed therebetween.

Abstract: Fluoride-based flux is uniformly dispersed in and mixed with synthetic resin, which has fluidity at room temperature and sublimes at a temperature lower than a brazing temperature, so as to constitute 40 to 70 wt. % of the mixture, thereby producing coating material. This coating material is applied to coating belts which undergo rotation and is transferred from the coating belts to the surface of the aluminum material. The coating material has high viscosity and stably adheres to the transferred areas.

Abstract: A method for joining metal parts in which an aluminum rich surface is produced on a first metal part by selective removal of the beryllium component of a beryllium-aluminum alloy, as by said etching. The aluminum rich surface may then be joined to another aluminum rich surface by a brazing.

Abstract: A method for producing a heat-conducting connection between two work pieces (1, 2) includes the steps of first producing a porous sintered layer (3), interposed between the two work pieces (1, 2) and sintered onto every work piece (1, 2) across a certain area, and subsequently compacting the porous sintered layer (3) sintered onto the two work pieces (1, 2) by pressing the two work pieces (1, 2) against each other.

Abstract: A dot mark forming method for obtaining a dot mark includes a liquid crystal mask in which the maximum length of each pixel is 50 to 2,000 &mgr;m and is irradiated with a homogenized laser beam. The energy density of a split laser beam passed through the liquid crystal mask is set to 1.0 to 15.0 J/cm2 and is condensed after the mask by a lens unit so that the maximum length of each dot becomes 1 to 15 &mgr;m. A single dot mask is formed on each laser irradiated point. The dot mark has a protrusion in the center which protrudes upward from the surface of the article to be marked. The length along the surface of the article is 1 to 15 &mgr;m and the height of the protrusion is 0.01 to 5 &mgr;m.

Abstract: By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material

Abstract: A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil (3) comprising surface layers (4, 6) and an intermediate layer (5) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.

Abstract: A method of joining a pair of metal components with a rivet having a hardness that is substantially similar to at least one of the metal components. The metal components are stack upon each other and the rivet is rotated and simultaneously plunged in the metal components under pressure to friction weld and metallurgically bond the rivet to the metal components.

Abstract: An ultrasonic rotary horn is repaired by removal of deteriorated metal condition from the horn energy transfer surface, and application and consolidation of metal powder to the horn radial surface. An ultrasonic rotary horn having a repaired radial energy transfer surface.

Abstract: A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.

Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.

Abstract: A method and module for securing a conductive interconnect (30) through a metallic substrate (36). The method includes the steps of: forming a hole (34) in the metallic substrate (36), the hole (34) defined by an internal surface (46) of the metallic substrate (36); applying an electrically insulating layer (48) to the metallic substrate (36) including the internal surface (46); applying a solderable coating (50) to at least a portion of the electrically insulating layer (48) around the hole (34); applying a solder (52) to at least a portion of the solderable coating (50) at and above the hole (34); inserting the conductive interconnect (30) through the hole (34); and solder bonding the conductive interconnect (30) within the hole (34).

Abstract: To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser chip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser chip. Therefor, when the mounting plate is overlaid to the laser chip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film.

Abstract: A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers constructed by brazing with the alloy, are such that the phosphorus-copper brazing material includes a phosphorus-copper brazing alloy containing Cu as a major component and phosphorus of not less than about 2.0 mass % to not more than about 3.2 mass %. The brazing sheet includes a metal sheet, and a brazing material layer that is integral with the metal sheet on at least one side of the metal sheet, the brazing material layer being formed of the phosphorus-copper brazing alloy. The metal sheet may be formed of copper or a copper alloy containing Cu as a major component.

Abstract: A transducer for, for instance, a flip-chip bonding apparatus. The transducer has a passage that communicates between a piping attachment and a suction holding port that suction-holds an object to be processed (bonded); and in this transducer, an air pressure piping used for the suction is fastened to the piping attachment with a connecting member in between, and this connecting member made of foam styrol suppresses effects of reaction force of the air pressure piping.

Abstract: A method of joining a ceramic matrix composite rocket nozzle to a metal manifold is provided, wherein a silicon nitride insert is disposed inside the ceramic matrix composite rocket nozzle and the metal manifold to provide a joint therebetween. The silicon nitride insert is preferably co-processed with the ceramic matrix composite rocket nozzle such that the ceramic matrix provides a bond between the rocket nozzle and the insert. The metal manifold is then secured to the silicon nitride insert, preferably using brazing, to form a joint assembly.

Abstract: The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient amount of solder to a difficult to solder material without using flux. An electroplated coating is applied to a portion to be soldered of a difficult to solder material, the difficult to solder material is then passed through molten solder to which ultrasonic waves are applied, and a large amount of solder is adhered only to solder plated portions.

Abstract: An apparatus for performing a pull test to determine the resistance of a bonded-wire loop extending between two bond contacts on a substrate to tensile force. The apparatus includes a traction hook controllably inserted under the bonded-wire loop, a drive device connected to the hook and generating a tensile force directed substantially perpendicular to the substrate surface, a force-measurement device associated with the hook to detect the tensile force at each moment, and a recording device connected to the force-measurement device in order to record a breaking force value for the bonded-wire connection. The force-measurement device is disposed substantially coaxially with the vector of the tensile force. The apparatus also includes a detector to detect the highest point of bonded-wire loop and a position controller for the automatic positioning of the traction hook and thus the tensile force vector origin substantially adjacent the highest point of the bonded-wire loop.

Abstract: A laser process in which stripe formation due to laser annealing is prevented and uniform laser annealing is made over the whole surface of a substrate. A laser beam having an energy distribution with an edge which has a nearly vertical shape l used, and when scanning of the laser beam is carried out, the scanning is carried out while the edge having the nearly vertical shape is made the front of the scanning.