Abstract: A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring can prevent the board from sagging. An exemplary embodiment includes a heat dissipation plate, a protection plate and a thermal interface material to dissipate heat from a time controller, thereby efficiently dissipating heat from the time controller. Another exemplary embodiment includes a spring clip or a hook spring to increase contact forces among a protection plate, a heat dissipation plate and a board, thereby further improving heat dissipation performance.

Abstract: A motor controller capable of relaxing the temperature of a heat source which generates heat by driving the motor controller, and capable of realizing miniaturization and low price is provided. In a motor controller in which a power semiconductor module (2) which closely contact a heat sink (1) is mounted on a substrate (4), and a fan (6) is attached to the heat sink (1) by a fan case (8), portions of fins (1g) of the heat sink (1) are formed with a bell mouth (1c) and a circular-arc-shaped guide (1h), and the radiating capability of the fins (1g) is improved by effectively using the wind of the fan (6).

Abstract: An electrical enclosure for circuit breakers includes a busbar with a plurality of apertures equidistantly positioned along a length of the busbar so that insulating inserts and corresponding busbar connectors can be attached to the busbar to receive variously sized circuit breakers having different widths equal to an integer multiple of the center-to-center distance between the equidistantly positioned apertures.

Abstract: An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.

Abstract: Switchgear having a vacuum-insulated switchgear 2 comprising switches having at least breaking and disconnecting functions, each placed in a unit, and solid-insulated bus bars 12 for electrically connecting the switches in each unit; an air-insulated switchgear 1 comprising switches having at least breaking and disconnecting functions, each placed in a unit, and air-insulated bus bars for electrically connecting the switches in each unit; and_the vacuum-insulated switchgear 2 and the air-insulated switchgear 1 are installed side-by-side, wherein the vacuum-insulated switchgear 2 and the air-insulated switchgear 1 are electrically connected through flexible conductors 17 which are provided between the solid-insulated bus bars 12 and the air-insulated bus bars.

Abstract: A semiconductor module has a housing, including a power semiconductor, a cooler bearing against the latter and serving for dissipating heat loss. In at least one embodiment, a spring element, which is supported between housing and cooler, is arranged on the side of the cooler remote from the power semiconductor and prestresses the cooler against the power semiconductor.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using a hookup clip to secure the top or bottom crossbar of the cold row encapsulation structure with the top or bottom crossbar of the server rack.

Abstract: An air backflow prevention member includes a frame assembly including a plurality of vanes and a plurality of stops. The plurality of vanes are rotatable between an open position, wherein the plurality of vanes are oriented oblique to a direction of airflow and in contact with the plurality of stops, and a closed position, wherein the plurality of vanes are oriented perpendicular to the direction of airflow.

Abstract: A power switchgear includes a circuit breaker including a container filled with an insulating gas, a stationary contact arranged in the container, and a movable contact that makes a movement to make contact with the stationary contact; an operation unit including a biasing member, and opens and closes the circuit breaker; and a linkage unit that transmits an biasing force of the biasing member to the circuit breaker. The linkage unit includes a rotary shaft, a lever including an engaging hole to be engaged with an outer periphery of the rotary shaft, and a pressing member that presses the rotary shaft onto an inner periphery of the engaging hole.

Abstract: Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

Abstract: The present application relates to apparatus (100) for cooling a light valve device (103), the apparatus comprising an array of elongate members (119), the elongate members (119) each having a tip (131) for contacting the light valve device (103). The apparatus (100) is suitable for cooling a digital micro-mirror device (103). A duct (117) may be provided for directing a flow of air from a fan to the light valve device (103).

Abstract: An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanically incorporated in a stable manner and with little technical complexity. An electrical circuit carrier having at least one rivet is also specified.

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably secured to the second side of the fan.

Abstract: A mobile workstation for use with a computer network. The mobile workstation may include a medical monitoring device, a radio transceiver in communication with the medical monitoring device operable for receiving and sending data to the computer network, a display screen, and a wheeled chassis for mounting the medical monitoring device, the radio transceiver and the display screen.

Abstract: The invention relates to an electric switching system which comprises a housing and components which are arranged therein and which are embodied as a control and/or measuring unit. Said components are arranged in modular-type drawers. At least one base module comprises at least one module support profile, in addition to lateral walls and front-sided insertion elements. One front wall of the base module, preferably the front side thereof, is formed by a control unit and the opposite front wall thereof of the measuring unit, and the dimensions of the control and measuring unit are adapted to the size of the module.

Abstract: An air cooled switching unit for a motor drive includes a plurality electrical switches and a plurality of heat pipe assemblies. Each heat pipe assembly includes a thermally and electrically conductive evaporator, a condenser, and at least one heat pipe extending between the evaporator and condenser. Each of the switches is abutted with an evaporator of at least one of the heat pipe assemblies for conduction of both electrical power and heat between the switch and the evaporator. Each heat pipe assembly further includes an electrically conductive base abutted with the evaporator, and the air cooled switching unit further includes a plurality of power lugs each connected to a base of a respective one of the heat pipe assemblies for input or output of electrical power to the base and the evaporator plate abutted with the base. Each heat pipe assembly includes at least one evaporator defined by a metallic plate. The condenser of each heat pipe assembly includes a plurality of parallel spaced-apart cooling fins.

Abstract: A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.

Abstract: A handheld computer system includes a housing, a processor coupled to the housing, a stylus coupled to the housing, and a light source coupled to the housing. The light source lights up the stylus.