Patents Examined by Michael V. Datskovskiy
  • Patent number: 7855872
    Abstract: Systems and method for installing computer equipment and power distribution equipment in facilities is provided. In one aspect, the present invention provides a power distribution rack, and uninterruptible power supply rack and a plurality of equipment racks. A plurality of power cables are run from the power distribution rack to each of the plurality of equipment racks using power cable tracks located on the roofs of the equipment racks. A plurality of data cables run between the plurality of equipment racks using data cable tracks located on the roofs of the equipment racks. The power cable tracks and data cable tracks are designed to be installed on the roofs of the equipment racks without the need for tools.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: December 21, 2010
    Assignee: American Power Conversion Corporation
    Inventors: Neil Rasmussen, William Ziegler, Peter Francis
  • Patent number: 7855890
    Abstract: In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: December 21, 2010
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Yasuhiro Kashirajima, Hiroshige Kikuchi, Takumi Sugiura, Koji Watanabe, Kenichi Nakashima
  • Patent number: 7848085
    Abstract: A power distribution system is provided that includes an upper panel, a lower panel, a plurality of side panels, and a plurality of guide rails each having at least two insert slots formed therein that extend along a longitudinal axis of the guide rail. Each of the insert slots is configured to receive and fixedly hold an edge of the side panels. The upper panel and lower panel are each fixedly mounted to an opposite edge face of the guide rails thereby securing the side panels and guide rail between the upper panel and lower panel.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: December 7, 2010
    Inventor: Martin Gerber
  • Patent number: 7848106
    Abstract: A disk drive testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling conduits configured to convey a cooling liquid toward the test slots. Each of the test electronics compartments includes test electronics configured to communicate with the test slots for executing a test algorithm, and a heat exchanger in fluid communication with the one or more cooling conduits. The heat exchanger is configured to cool an air flow directed toward the test electronics.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: December 7, 2010
    Assignee: Teradyne, Inc.
    Inventor: Brian S. Merrow
  • Patent number: 7843684
    Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: November 30, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Yi-Jen Lu, Shu-Hsien Lin
  • Patent number: 7843692
    Abstract: A mobile, modular communications device, featuring a multiple-slot base chassis designed to support a plurality of individual user-configurable and interchangeable personality modules, capable of providing the ability to accept secure/classified user communications, including voice, data and video, the means to encrypt or secure such user communications through either internal or external encryption capabilities, the means to optimize the secure voice, data and video communications for transmission across a remote reachback communications link and the ability to provide multiple network/uplink reachback transmission alternatives, such as local area networks, satellites, cellular, ISDN or other forms of fixed or wireless communications. The invention is intended to provide a standardized, structured and modular approach to the provisioning of different technologies within the overall system and to be capable of being deployed as a man-carry or rack-embedded unit.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: November 30, 2010
    Assignee: Dtech Labs, Inc.
    Inventors: Brian K. Everhart, Jessica A. Denson, Melvin W. Clarke
  • Patent number: 7843689
    Abstract: A fire resistant and water resistant enclosure for an operable computer digital data storage device is provided. The enclosure has walls made of gypsum or concrete and, in one embodiment, has two small ventilation openings which remain open during normal operation of the digital data storage device and during the presence of fire. This embodiment has no moving parts. In the presence of fire, air and superheated steam from inside the enclosure expand and flow outwardly through the ventilation passageways. As those gases flow outwardly, they simultaneously block or prevent the transfer of heat from the exterior fire inwardly through those passageways. A water resistant pouch or coating surrounding the storage device prevents damage from flood, water, steam generated by the insulation or smoke from passing through said passageways and damaging the storage device.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: November 30, 2010
    Inventors: Robby Jay Moore, Brooks Ira Davis
  • Patent number: 7843683
    Abstract: Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: November 30, 2010
    Assignee: International Business Machines Corporation
    Inventors: Edward S. Suffern, Takeshi Wagatsuma, Kenji Hidaka, Michihiro Okamoto
  • Patent number: 7839634
    Abstract: One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: November 23, 2010
    Inventor: Chien Ouyang
  • Patent number: 7835151
    Abstract: A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: November 16, 2010
    Assignee: Danfoss Silicon Power GmbH
    Inventor: Klaus Kristen Olesen
  • Patent number: 7830663
    Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: November 9, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takashi Iikubo
  • Patent number: 7830658
    Abstract: A housing for electronic equipment comprises a heat exchanger for exchanging heat between a liquid-containing medium and a gas. This heat exchanger comprises a medium inlet and a medium outlet and a flat heat exchanger mat. The mat comprises a number of parallel, equidistant capillaries of heat-conducting material and wires of heat-conducting material which are attached in heat-conducting contact to the capillaries, extend in transverse direction relative thereto and have a mutual distance in the order of magnitude of the diameter of the wires, wherein air can flow along the wires for heat exchange between this air and the medium flowing through the capillaries. The heat exchanger is embodied such that the air flows along the mat and at least a substantial part of the air is prevented from flowing through the mat, and that it is ensured that the air flows along the wires in longitudinal direction of these wires.
    Type: Grant
    Filed: June 18, 2006
    Date of Patent: November 9, 2010
    Assignee: Fiwihex B.V.
    Inventor: Eleonoor Europeo Van Andel
  • Patent number: 7830648
    Abstract: A system includes an electrical busway, an electrical enclosure enclosing an electrical apparatus, the electrical enclosure including an interior and a mounting portion with an opening therethrough; and a tap apparatus electrically interconnecting the electrical busway and the electrical apparatus. The tap apparatus includes a first portion electrically interconnected with the electrical busway through the opening of the mounting portion, a second portion removeably coupled to the mounting portion of the electrical enclosure from the interior of the electrical enclosure, and a third portion including a flexible electrical connection electrically interconnected with the electrical apparatus.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: November 9, 2010
    Assignee: Eaton Corporation
    Inventors: Ryan J. Strong, Mark T. Teaken
  • Patent number: 7826201
    Abstract: A control box arrangement including at least one control box which is sub-divided, or which can be sub-divided, into a plurality of cuboid compartments, including functional compartments, by wall sections, where vertical wall sections with a horizontal sub-division are provided. A collecting bar arrangement including a distributing bus bar arrangement guides the current, in order to supply electrical energy to appliance components which are arranged in the functional compartments accessible from the front side. An advantageous arrangement of functional compartments and the energy supply of components received therein is achieved by the distribution buses of the distributing bus bar arrangement are guided through a plurality of vertical functional compartments arranged one above the other and separated by horizontal partition bottoms, are mounted inside the compartments, and covered in a protected manner.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: November 2, 2010
    Assignee: Rittal GmbH & Co. KG
    Inventors: Michael Schell, Tobias Becker
  • Patent number: 7826202
    Abstract: A universal power distribution system is provided for routing electrical circuits within a building structure to comprehensively provide electrical power to the building in ceiling configurations, wall-mounted configurations, raised floor configurations and in office furniture configurations. The system components for all of these configurations have common plug connectors that are engagable with each other so as to be readily usable in a wide variety of applications. The system is readily adaptable to form virtually any conventional circuit configuration found within conventional hard-wired systems yet is formed simply through the routing of the cables through the building cavities and interconnection is accomplished merely by plugging components together rather than through labor-intensive manual wiring.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: November 2, 2010
    Assignee: Haworth, Inc.
    Inventors: Ross Johnson, Harold Wilson
  • Patent number: 7826224
    Abstract: A fan for easily being attached to a fixing device and includes a fan body and a frame for holding the fan body therein. The frame includes two parallel first sidewalls, and two parallel second sidewalls perpendicular to the first sidewalls. Two pairs of rims symmetrically extend from the first sidewalls and the second sidewalls. Ends of the rims on the first sidewalls toward one same second sidewall each include a latch flange. Ends of the rims on the second sidewalls toward one same first sidewall each includes a latch flange. Each of the latch flanges includes a guiding edge slantingly extending from the corresponding rim, and a latch edge perpendicular to the corresponding rim. Each of the latch flanges includes a guiding edge slantingly extending from the corresponding rim, and a latch edge perpendicular to the corresponding rim.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: November 2, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zheng-Heng Sun
  • Patent number: 7826217
    Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: November 2, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiro Kondo, Akio Idei, Shigeyasu Tsubaki, Hitoshi Matsushima, Tadakatsu Nakajima, Hiroyuki Toyoda, Tomoo Hayashi, Tatsuya Saito, Takeshi Kato, Kenji Ogiro
  • Patent number: 7821776
    Abstract: An electrical meter is provided that includes a cover configured for securement onto a base. The meter includes features that resist meter tampering, and features that provide evidence of meter tampering.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: October 26, 2010
    Assignee: Elster Electricity, LLC
    Inventors: Garry M. Loy, Rodney C. Hemminger
  • Patent number: 7821785
    Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: October 26, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Matthew D. Neumann
  • Patent number: 7817416
    Abstract: A mounting apparatus is provided for mounting a fan in a chassis defining an exhaust opening in an end wall thereof. The mounting apparatus includes a frame adapted to receive the fan, and be inserted into or drawn out of the chassis via the exhaust opening. The frame includes at least one resilient lock plate. The at least one resilient lock plate releasably abuts against the end wall of the chassis to prevent the frame sliding out of the chassis.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: October 19, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xiao-Zhu Chen