Abstract: Provided are a substrate for an OED, a method of manufacturing the same, and a use thereof. The substrate includes a flexible base film and an inorganic material layer, and the inorganic material layer includes a multilayer structure of at least two thin layers. Such an inorganic material layer may have an excellent physical property, for example, a barrier property, by inhibiting crystallinity. In addition, by employing the multilayer structure, an inorganic material layer having a physical property which is difficult to be realized by a conventional inorganic material layer, for example, a high refractive index, in addition to the barrier property may be formed.

Abstract: A display device can include a lower substrate; a light-emitting structure including a lower electrode, a light-emitting layer, and an upper electrode, in which the lower electrode, the light-emitting layer and the upper electrode are sequentially stacked; a color filter disposed between the lower substrate and the light-emitting structure; and an over-coat layer surrounding a side surface of the color filter, in which an upper surface of the color filter facing the light-emitting structure is coplanar with an upper surface of the over-coat layer.

Abstract: The invention describes a device for emitting or detecting electromagnetic radiation. The device has a first and a second electrode which are connected to each other via an electrically conductive nanostructure. The electrically conductive nanostructure is configured to receive electrons and holes from the first and second electrode or transport same to the first and second electrode. In addition, the device has a radiation molecule arranged at a circumferential surface of the electrically conductive nanostructure. The radiation molecule is configured to absorb electrons and holes or electromagnetic radiation and emit the electromagnetic radiation with recombination of electrons absorbed and holes absorbed, or emit electrons and holes based on the electromagnetic radiation absorbed.

Abstract: The disclosed embodiments include a computer implemented method, apparatus, and computer program product that includes executable instructions that when executed performs operations for determining flow control device properties for an injection well that would yield to a prescribed uniform or non-uniform accumulated injection profile along a production well.

Abstract: A system including a controller, an interface, and a calibration controller. The controller is configured to (i) select a set of fields, and (ii) based on the set of fields, supply control effort to first actuators in zones of a chamber. The interface is configured to receive feedback signals from sensors. The feedback signals are indicative of fields respectively of the zones. The controller is configured to adjust an amount of control effort supplied to the actuators based on the fields. The calibration controller is configured to, based on the fields, generate calibration values for each of the sensors. The calibration values for each of the sensors are indicative of field contributions corresponding respectively to the actuators.

Abstract: For peak A detected on a chromatogram created based on data obtained by a product ion scan measurement of one characteristic ion species originating from a target compound, a mass spectrum is extracted, and this mass spectrum is subjected to a database search to extract candidates of the compound as a primary search result. Subsequently, for peak B detected on a chromatogram created based on data obtained by a product ion scan measurement of another characteristic ion species originating from the same target compound, a mass spectrum is extracted, and this mass spectrum is subjected to a database search, with the search range limited to the candidates extracted in the search result based on peak A, to further reduce the number of candidates. The result which has been narrowed in this manner is displayed, whereby the amount of labor for the compound identification by analysis operators is reduced.

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.

Abstract: A three-dimensional (3D) transistor includes a ferroelectric film between the gate and the channel. The 3D transistor can be characterized as a 3D Negative Capacitance (NC) transistor due to the negative capacitance resulting from the ferroelectric film. Performance of the transistor is optimized by manipulating the structure and/or by the selection of materials. In one example, the capacitance of the ferroelectric film (CFE) is matched to the sum of the gate capacitance (CMOS) and the gate edge capacitance (CEDGE), wherein the gate edge capacitance (CEDGE) is the capacitance at the edge of the gate and between the gate and the source and its extension, and the gate and the drain and its extension.

Abstract: Power systems having a DC content, such as photovoltaic (solar) panels present a problem if an arc fault appears because of a small break in a cable. The present disclosure describes an arc fault detection system that captures data in segments, examines the frequency spectrum to remove ‘false arc’ signatures and interference from a power converter of the power system, and then examines the cleaned frequency spectrum for arc events.

Abstract: Disclosed are various embodiments for determining whether food in a refrigerator has spoiled. An application executing on a computing device receives an identification of a food item located in a compartment of the refrigerator. The application then receives a chemical sensor reading from the refrigerator, wherein the chemical sensor reading represents a measured amount of a chemical associated with spoilage of the food item. Subsequently, the application determines that the measured amount of the chemical associated with spoilage of the food item exceeds a threshold amount of the chemical associated with spoilage of the food item. Finally, the application sends a notification to the client device, the notification comprising an indication that the food item is spoiled.

Abstract: System and methods for processing a substrate using a reactor with multiple heating zones and control of said heating zones using a common terminal shared between two power supplies are provided. The reactor includes a heater assembly for supporting the substrate and a showerhead for supplying process gases into the reactor. An inner heater and an outer heater are integrated in the heater assembly. An inner power supply has a positive terminal connected to a first end of the inner heater and a negative terminal is connected to a second end of the inner heater that is coupled to a common terminal. An outer power supply has a positive terminal connected to a first end of the outer heater and a negative terminal connected to a second end of the outer heater that is coupled to the common terminal. A common-terminal heater module is configured to receive a measured temperature that is proximate to the inner heater.

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.

Abstract: There is provided a semiconductor film, including: an aggregate of oxide microparticles including at least one type of metal selected from the group consisting of In, Zn, and Sn; and at least one type of a ligand which is selected from the group consisting of a ligand expressed by General Formula (A) below, a ligand expressed by General Formula (B) below, and a ligand expressed by General Formula (C) below and which is coordinated with the oxide microparticles: in which, in General Formula (A), each of X1 and X2 independently represents —SH, —NH2, —OH, or —COOH, and each of A1 and B1 independently represents a hydrogen atom or a substituent having an atomic number of 1 to 10, in which, in General Formula (B), each of X3 and X4 independently represents —SH, —NH2, —OH, or —COOH and each of A2 and B2 independently represents a hydrogen atom or a substituent having an atomic number of 1 to 10, and in which, in General Formula (C), X5 represents —SH, —NH2, or —OH, and A3 represents a hydrogen atom or a substit

Abstract: This fuel property estimation device is used in an internal combustion engine that uses a mixed fuel of three kinds of fuel and includes a first sensor that outputs a signal responsive to a physical property of the fuel in a fuel route and a second sensor outputs a signal responsive to an oxygen concentration of exhaust gas. This device measures a physical property value of the mixed fuel based on a first sensor signal, and calculates an air-fuel ratio value at stoichiometric combustion state using feedback of a second sensor signal. This device estimates a composition ratio of the mixed fuel based on the measured physical property value and the calculated air-fuel ratio value by referring to a relationship between the composition ratio of the mixed fuel and the physical property value and a relationship between the composition ratio of the mixed fuel and a theoretical air-fuel ratio value.

Abstract: An array substrate includes a substrate, first signal lines, sub-pixels, reference potential lines, first bonding pads, second bonding pads, first fan-out lines, second fan-out lines, first connection lines, second connection lines, and a first reference potential line. An accommodation space exists between a first connection line closest to the second bonding pads and a second connection line closest to the first bonding pads. The first reference potential line is disposed in the accommodation space and electrically connected with the reference potential lines.

Abstract: A package includes a corner, a device die, a molding material molding the device die therein, and a plurality of bonding features. The plurality of bonding features includes a corner bonding feature at the corner, wherein the corner bonding feature is elongated. The plurality of bonding features further includes an additional bonding feature, which is non-elongated.

Abstract: A frequency-sweep experimental method for predicting noise of a power capacitor, comprises steps of: (1) loading the capacitor with a sine voltage excitation with a loading frequency value of ½ to 50 times of a power frequency in sequence, at an increase of half of the power frequency for each time, and measuring vibration velocity at various points on a case of the capacitor; (2) under each loading frequency, dividing vibration velocity by a square of each voltage applied; (3) calculating frequency spectrum of a square of the voltage of the capacitor according to the voltage and a current of the capacitor; (4) multiplying the frequency spectrum of the square of the voltage of the capacitor by the electromechanical vibration frequency response function value of the capacitor to obtain a vibration velocity spectrum of the case of the capacitor; (5) calculating acoustical power of the noise.

Abstract: A thin film transistor array includes a substrate, a gate electrode formed on the substrate, a gate insulation film covering the gate electrode, a source electrode formed on the gate insulation film, a drain electrode formed on the gate insulation film, a semiconductor layer connected to the source electrode and the drain electrode, an interlayer insulation film formed on the drain electrode and the semiconductor layer, and a pixel electrode formed on the interlayer insulation film. The interlayer insulation film has a via hole that reaches a portion of the drain electrode, and the drain electrode has a liquid repellent coating on the portion positioned in the via hole.

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: Processes and apparatuses for the treatment of semiconductor workpieces are provided. In some embodiments, a method can include placing the workpiece in a processing chamber. The processing chamber can be separated from a plasma chamber by a separation grid assembly. The method can include forming a passivation layer on the workpiece in the processing chamber using radicals generated in a first plasma in the plasma chamber. The method can include performing a surface treatment process on the workpiece in the processing chamber using a second plasma generated in the plasma chamber.