Abstract: A lithographic exposure system and method for exposing and structuring a substrate coated with a solder resist is provided. The lithographic exposure system having at least one light beam, formed preferably by two or more laser beams of different UV wavelengths, which is deflected relative to the substrate by a variable deflection device, in order to generate structures on the substrate. In particular, the light beam is superimposed, spatially in the image plane and temporally in the exposure, by a spatially limited, high-energy, preferably externally mounted heat source, wherein preferably infrared laser diodes having linear optics are used.

Abstract: A method involves depositing a near-field transducer on a substrate of a slider. The near-field transducer comprises a plate-like enlarged portion and a peg portion. A first hard stop extending from the near field transducer and an air bearing surface is formed. A heat sink is formed on the enlarged portion and the first hard stop. A dielectric material is deposited over the near-field transducer and the heat sink. A second hard stop is deposited on the dielectric material away from the air bearing surface. The second hard stop comprises a recess corresponding in size and location to the heat sink. The method involves milling at an oblique angle to the substrate between the first hard stop and second hard stop to cut through the heat sink at the angle. The recess of the second hard stop increases a milling rate over the heat sink compared to a second milling rate of the dielectric away from the heat sink.

Abstract: A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Abstract: The disclosed system generally comprises a damping module, a pressing module, a placement platform for placement of the multiple stacked planar objects and a compensatory mechanism engaging to the damping module. Particularly, the damping module includes a damper, a resilient component and an elongate support which are all arranged within a holder. Each of the stacked planar objects has a top planar surface and an underside planar surface as well as carries a plurality of corresponding holes, which become aligned accordingly to form a plurality of longitudinal grooves upon placement onto the platform. The head portion of the damper is substantially aligning with the positioned groove and abutting onto the underside surface of the bottommost stacked object. The compensatory mechanism is capable of adaptively adjusting position of the head portion of the damper in relation to the pressing ram at the vertical and/or horizontal plane.

Abstract: Methods for manufacturing a microwave or radio frequency (RF) device include mounting a printed circuit board (PCB) on a flexible PCB having at least one ground plane and a signal terminal. The PCB can include a through-hole the sidewalls of which are coated with a conductive material. The methods can include placing a microwave component within the through-hole. The methods can include disposing a conductive cover on the PCB such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding around the microwave component. The flexible PCB can be folded along a respective bend portion.

Abstract: A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.

Abstract: A component mounting machine includes a head including multiple nozzles; a negative pressure supply device supplying negative pressure from a negative pressure source individually to suction openings of the multiple nozzles; a raising and lowering device to individually raise and lower the multiple nozzles; and a control device performing a first pickup operation of controlling the raising and lowering device to lower one of the nozzles and controlling the negative pressure supply device to supply negative pressure to pick up the component using the suction opening of that nozzle, and a second pickup operation of controlling the raising and lowering device to lower multiple of the nozzles simultaneously and controlling the negative pressure supply device to supply negative pressure to the suction openings of those multiple nozzles to pick up the components simultaneously using the suction openings of those multiple nozzles.

Abstract: The present invention provides a maintenance board that can be used for a maintenance process other than removing static electricity from a component mounting device by being conveyed by a conveyance device of the component mounting device. The maintenance board is conveyed to the conveyance device of the component mounting device. The maintenance board includes at least one of: a brush configured to brush a maintenance target object; a cleaning nozzle configured to be held in an attachable manner to a work head of the component mounting device and to blow air to the maintenance target object; a pressure sensor configured to measure a detachable load of a component to a suction nozzle attached to the work head and a mounting load of a component to a board; and a blower configured to blow air toward the work head.

Abstract: A pick-and-place machine module is provided. The pick-and-place machine module includes a nozzle and a collet disk. The nozzle includes a body, a head and a tubular element extending between the body and the head such that the head is communicative with the body via the tubular element to enable a pick-up of a component by the head. The collet disk is affixed to a surface of the body facing the head about the tubular element and is configured to reflect light incident thereon toward an area of the base surrounding the component.

Abstract: The present invention relates to a method for connecting a strand of a multi-strand cable to an electrode of an implantable medical device. The method includes cutting a strand of the multi-strand cable lifting at least one of the free ends, stripping the end of the lifted strand, placing an electrode around the multi-strand cable to partially cover the end of the lifted and stripped stand, and connecting at least one portion of the stripped end of the strand to the electrode.

Abstract: A wire cutter apparatus includes a first rotatable wire guiding tube for receiving the leading end of a wire. The first tube has a wire entrance and a wire exit and is rotatable around the wire entrance whereby the wire exit is movable between a first wire exit position coinciding with a longitudinal feeding axis and a second wire exit position spaced away from the longitudinal feeding axis. The apparatus includes a similar, second rotatable wire guiding tube. A first crimping press receives the leading end of the wire when the wire exit is in the second wire exit position. The first crimping press and the second crimping press are both at least partially located between the longitudinal feeding axis and a first side wall.

Abstract: A component mounting device includes multiple selector valves corresponding individually to multiple holders disposed on a rotary head and switching between making and breaking communication between a corresponding holder flow path and a negative pressure source, and valve driving devices driving selector valves corresponding to holders, among the multiple holders, located in predetermined revolving positions. The component mounting device executes a negative pressure recovery operation when a suction error has occurred in which the component is not held by suction to the nozzle after suction operation. When a suction error occurs at the nozzle held by the holder, the component mounting device performs the negative pressure recovery operation by waiting for the holder to be rotated to a predetermined revolving position and drives the selector valve corresponding to the holder using the valve driving device to cut off communication between the holder flow path and the negative pressure source.

Abstract: A three-Dimensional Integrated Circuit (3DIC) Chip on Wafer on Substrate (CoWoS) packaging structure or system includes a silicon oxide interposer with no metal ingredients, and with electrically conductive TVs and RDLs. The silicon oxide interposer has a first surface and a second surface opposite to the first surface. The electrically conductive TVs penetrate through the silicon oxide interposer. The electrically interconnected RDLs are disposed over the first surface of the silicon oxide interposer, and are electrically coupled or connected to a number of the conductive TVs.

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.

Abstract: A motor stator assembly, a synchronous motor and a passenger transport device are provided by the present disclosure. The motor stator assembly includes: a stator base disposed axially around a motor drive shaft, the stator base having a receiving space and two stator end faces, and the receiving space being disposed between the two stator end faces and disposed along a circumferential outer side of the stator base; and a plurality of coil assemblies each inserted in the receiving space in a radial direction of the stator base. According to the motor stator assembly, the synchronous motor and the passenger transport device of the present disclosure, by providing a plurality of coil assemblies inserted in the stator base, the maintenance or replacement can be performed as needed, the maintenance is convenient, and less time-consuming, and also has reliable performances.

Abstract: A manufacturing method for a rotary electric machine is equipped with an insertion roller having an outer circumferential surface configured to contact a coil lead line in such a manner that the coil lead line is inserted into accommodating grooves of an insulator, a roller support section that rotatably supports the insertion roller, and a bending unit that performs a bending process to bend the coil lead line by coming into contact with the coil lead line so as to form a terminal part.

Abstract: A device substrate includes a core material. A capacitor sheet can be affixed adjacent to a surface of the core material, where the capacitor sheet covers the surface of the core material. A first opening can extend through both capacitor sheet and the core material, where the first opening are larger than a substrate pass through-hole. An electrically inert material can fill the first opening. A second opening can extend parallel to the first opening through the electrically inert material, where the second opening is at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.

Abstract: A wave winding coil (9) has a first linear part (11a), second linear part (11b), arm part (12) and turn part (13). A retaining apparatus (1) retains the first linear part (11a) along the axis line direction between middle pins (3b, 3b) of a middle body part (3), and retains the second linear part (11b) between upper pins (2b, 2b), middle pins (3b, 3b), and lower pins (4b, 4b), in a state where sections of both ends of the second linear part (11b) in the axis line direction deviate to each other in circumferential opposite sides of the wave winding coil (9) to the axis line direction of the wave winding coil (9) and in a state where a bent angle ?b? between the second linear part (11b) and the connecting part is smaller than a bent angle ?a? between the first linear part (11a) and the connecting part.

Abstract: A component supply device including: a stage configured such that components can be scattered on the stage; a slide device configured to slide the stage; a contacting section configured to contact the component scattered on the stage in accordance with sliding of the stage by the slide device; and a control device configured to control operation of the slide device, wherein the control device includes a determining section configured to determine whether the stage has been slid to a set position when the stage is slid towards the contacting section, and an operation control section configured to control operation of the slide device so as to, in a case in which it is determined by the determining section that the stage has not been slid to the set position, after sliding the stage in a direction away from the contacting section, once again slide the stage towards the contacting section.

Abstract: The invention relates to a crimping pliers network (39) which comprises pressing pliers (2), an electronic control unit (31) (in particular a smartphone or a tablet) as well as a data storage device (37) (in particular a cloud storage (38)). According to the invention, a die (3, 4) of the pressing pliers (2) comprises an identifier (18, 19) which can be captured by a capturing device (21) of the pressing pliers. Data (48) from the data storage device (37) and being specific for the captured identifier (18, 19) is provided to the control unit (31). The data might be a desired pressing force curve (49), a desired pressing displacement curve (50) and/or information concerning a workpiece for which the dies (3, 4) are designated. In this way, it is possible to increase the process safety when using the crimping pliers (2). Furthermore, the invention relates to a method for pressing a workpiece.