Abstract: A method for producing contact-free chip card includes embedding metallized bumps of the chip into an antenna as the chip is mounted on the antenna.

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

Abstract: A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.

Abstract: A method for manufacturing electrical connecting elements or semifinished products. Microvias are formed in a dielectric substrate layer by piercing a substrate layer (1) through a first conducting layer (3), which essentially covers an entire side of the substrate. The perforation depth (d) is at least equal to the total thickness of the substrate and the first conducting layer. The conductor material of the first conducting layer (3), during the piercing step, is deformed so that it partially covers the wall of the hole fabricated by the piercing process. Plating the first conducting layer with additional conductor material bridges the little remaining distance between the conductor material and the opposite side of the substrate layer.

Abstract: A wire connection apparatus having a connector holder, a press-contacting device such as a stuffer, and a guide member. The wire connection apparatus has a wire end alignment mechanism which includes a vertical surface of the connector holder, the press-contacting device and the guide member. In operation, the press-contacting device moves along the vertical surfaces of the connector holder and presses wires into the connector while unaligned tips of the wires abut the vertical surface. As the tips of the wires are pressed by the press-contacting device, excess lengths of the wires are moved upstream through the fixed wire guide. When the wires are at an appropriate length, they are press-contacted by the press-contacting device and connected to the connector.

Abstract: An assembly apparatus for a magnet assembly is disclosed. The assembly apparatus includes first and second assembly nests and an assembly slide operable between an advanced position relative to the assembly nests and a retracted position for assembly. As disclosed the assembly apparatus is used to assemble spacer posts between opposed magnet/backiron assemblies. The assembly apparatus includes spacer nests proximate to the assembly nests for assembly of spacers between the opposed magnet/backiron assemblies.

Abstract: In a preferred embodiment, an end connector compression tool, including: a body; supports to support a cable and uncompressed end connector parts; a compression member axially movable with respect to the body to fixedly attach the end connector parts to the cable by compression of the end connector parts; a handle rotatably attached to the compression member at a first pivot point; and a link rotatably attached to the handle at a second pivot point and to the body at a third pivot point, such that rotation of the handle from an open position to a closed position effects compressive fixed attachment of the end connector parts to the cable. The tool may have an integral coaxial cable stripping function included therein.

Abstract: A method of forming a rotor for a positive displacement motor. The method includes forming a liner that includes at least two resilient layers and at least one fiber layer, and the at least two resilient layers are positioned so as to enclose the at least one fiber layer. The liner is positioned on a rotor tube, and the rotor tube includes a shaped outer surface including at least two radially outwardly projecting lobes extending helically along a selected length of the rotor tube. The liner is cured on the rotor tube so that the liner conforms to the radially outwardly projecting lobes formed on the outer surface and to the helical shape of the outer surface. The curing forms a bond between the liner and the outer surface and between the at least two resilient layers and the at least one fiber layer.

Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.

Abstract: The present invention discloses a transfer for a tray feeder comprising: a base frame; a support frame installed at both sides of the base frame; first and second linear motion guiders installed oppositely and longitudinally to the inside of the support frame and having a plurality of first and second linear motion guide rails; first and second plates installed to an upper portion of the first and second linear guides and having a cylinder block capable of supporting a side of the tray received an electronic parts and the like; and a driving unit installed to a side portion of the support frame and for making the movement of the first and second plates; wherein the first and second plates can move along the first and second guide rails, crossing with each other.

Abstract: A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5, and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.

Abstract: The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or greater, as well as distribution of significant amounts of power to router components. The disclosed techniques and features allow relatively thick (e.g., three- or four-ounce copper) power distribution planes to be combined with large numbers of high-speed signaling layers in a common backplane. Using traditional techniques, such a construction would not be possible because of the number of layers required and the thickness of the power distribution layers. The disclosed embodiments use novel layer arrangements, material selection, processing techniques, and panel features to produce the desired high-speed layers and low-noise high-power distribution layers in a single mechanically stable board.

Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.

Abstract: A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.

Abstract: A device for fitting substrates with electric components includes a stationary carrier supporting a positioning device. The carrier is arranged above at least two fitting stations that are located one after the other in a conveying direction. A chassis of the device includes end supports and central supports that are connected to the carrier.

Abstract: A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, external terminal electrodes in a preferable state can be efficiently formed. When a green composite laminate comprising shrinkage suppression layers and a green multilayer mother substrate provided therebetween is formed, through-holes are provided on dividing lines so as to divide conductors, and in addition, cut-in grooves are provided along the dividing lines. After the shrinkage suppression layers are removed from the fired composite laminate, the multilayer ceramic substrates are obtained by dividing the multilayer mother substrate along the through-holes and the cut-in grooves.

Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.

Abstract: This invention is an electrical connection method for connecting multiple conductor cable, ideally flat flexible cable. The method involves using an actuator for pressing the cable against multiple contacts in a base, each of which contacts has a sharp edge for removing insulation from the cable.

Abstract: In an electric-component mounting system including an illuminating device including a light source which emits a light for illuminating an object, a camera which takes an image of the object, and a processing and controlling device which includes a data processing portion that processes image data representing the image of the object taken by the camera, at least one of the camera and the illuminating device includes a brightness controlling device which controls a brightness of an image taken by the camera, and the processing and controlling device includes a brightness detecting portion which detects a brightness of at least a portion of the image of the object taken by the camera, and a control-parameter varying portion which varies, based on the brightness detected by the brightness detecting portion, at least one control parameter of the brightness controlling device so that a brightness of at least a portion of an image taken by the camera is equal to a preset brightness.