Patents Examined by Minh Trinh
  • Method and apparatus for assembling electronics
    Patent number: 6925709
    Abstract: An apparatus for assembling electronics is provided, comprising a support frame, at least one pick-and-place mechanism, at least one device-engaging component, a feed device, and a programmer or tester. The pick-and-place mechanism is secured to the support frame. The device-engaging component is secured to the pick-and-place mechanism. The feed device has a slender body secured to the frame to feed a plurality of electronic devices to a feed location. The programmer or tester has a slender body secured to the support frame in a side-by-side relationship relative to the feed device. The programmer or tester has a socket located at an intermediate location. The devices are movable by the device-engaging component from the feed location to the socket at the intermediate location.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: August 9, 2005
    Assignee: Exatron, Inc.
    Inventor: Robert P. Howell
  • Index head in semiconductor device test handler
    Patent number: 6925706
    Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: August 9, 2005
    Assignee: Mirae Corporation
    Inventor: Hyun Joo Hwang
  • Method for manufacturing microelectromechanical combdrive device
    Patent number: 6925710
    Abstract: Methods of making microelectromechanical combdrive devices are disclosed. The device may optionally be formed using three device layers. A moveable element and flexure may be formed from a first device layer. The second device layer may be attached to the first and a first set of comb teeth are formed from the second device layer. One or more comb teeth in the first set extend from a major surface of the moveable element. A third device layer is attached to the second device layer and a second set of comb teeth are formed from the third device layer. An alignment target is formed in the first device layer. Corresponding alignment holes are formed in the second or third device layers.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: August 9, 2005
    Assignee: Analog Devices, Inc.
    Inventors: Jennifer Scalf, Satinderpal Pannu
  • Electrical assembly for solderless interconnection of circuit boards in a stacked configuration
    Patent number: 6923681
    Abstract: An assembly for providing electrical connection between first and second substrates aligned in a stacked configuration. The inventive assembly includes a conductor assembly having at least one elongate conductor adapted to engage a first electrical contact on the first substrate on one end and a second electrical contact on the second substrate on a second end thereof. The conductor is adapted to provide a spring force. The assembly further includes a mechanism for retaining the conductor in abutting contact with at least one of the first or second contacts and thereby effect an electrical connection between the first contact on the first substrate and the second contact on the second substrate.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: August 2, 2005
    Assignee: Raytheon Company
    Inventors: David M. Creighton, Earnest Y. Masumoto
  • Method of making vacuum microelectronic device
    Patent number: 6920680
    Abstract: A method of forming a vacuum microelectronic device including steps of forming at least one electron emitter on a substrate, applying a first electric field to move a portion of the at least one electron emitter in a direction toward the first electric field, and maintaining the at least one electron emitter in the direction after removing the first electric field.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: July 26, 2005
    Assignee: Motorola, Inc.
    Inventors: Yi Wei, Kenneth Andrew Dean, Chenggang Xie
  • Installation of filter capacitors into feedthroughs for implantable medical devices
    Patent number: 6920673
    Abstract: A feedthrough device and brazing process for joining the constituent parts of the feedthrough while allowing a lead to pass therethrough in a nonconductive manner is described. The feedthrough comprises at least one lead, a ferrule defining a capacitor recess and an insulator recess. An insulator disposed in the insulator recess defines a passageway allowing the lead to pass therethrough. A capacitor disposed in the capacitor recess defines a capacitor passageway allowing the lead to pass therethrough. The capacitor comprises first and second sets of plates, the first set being conductively coupled to the ferrule and the second set being conductively coupled to the lead. The braze joints between the insulator and the lead and between the insulator and ferrule are formed first at a first temperature using an insulator braze material.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: July 26, 2005
    Assignee: Greatbatch-Hittman, Inc.
    Inventors: Kevin M. Allen, Thomas W. Shipman, Allan S. Gelb
  • Component mounting apparatus
    Patent number: 6920686
    Abstract: A component mounting apparatus has an intermittently rotated rotary mounting section which has a driver at an upper part for driving motors of mounting heads arranged on periphery of the rotary mounting section. A controller in a stationary part of the apparatus inputs power and control signals to the rotating driver which is formed in an annular shape, and includes motor driver mounting plates with motor drivers for controlling power supplied to each motor. The motor driver mounting plates are arranged radially around a rotation axis of the rotating driver with planar surfaces in parallel to the rotation axis.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: July 26, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Okamoto, Kazuyuki Nakano, Takeshi Takeda
  • Gaming machine
    Patent number: 6921334
    Abstract: A gaming machine for playing a lotto or bingo type game has display means, and game control means arranged to control images displayed on the display means. The game control means are arranged to play a game in which a player makes a selection, on the machine, of a series of indicia chosen from a larger group of indicia, and the game control means are arranged to generate a series of indicia drawn at random from the larger group of indicia. The display means show, in a predetermined location, those indicia which have been selected for comparison with the players selected indicia. A prize being awarded if more than a predetermined number of matches occur.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: July 26, 2005
    Assignee: Aristocrat Leisure Industries Pty. Ltd.
    Inventor: Nicholas Luke Bennett
  • Supply module for feeding electrical components to an automatic placement device
    Patent number: 6918175
    Abstract: A supply module for feeding electrical components to an automatic component-mounting machine has a locking element which is a piezoceramic bending transducer that extends in the longitudinal direction of the supply module along a supply path for the components. A free end of the locking element projects into a window of the supply module to an extent such that the locking element is located slightly above the component which has been conveyed there and is ready for removal. By applying an operating voltage to the locking element, the locking element can be deflected laterally to an extent such that it is moved out of the coverage region over the component transversely with respect to the component advancing direction.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: July 19, 2005
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Liebeke, Johann Melf
  • Device for the insertion and extraction of a plug-in module
    Patent number: 6915562
    Abstract: A device for the insertion and extraction of a plug-in module into a module frame which has at least one front module bar, contains a swivel-mounted lever which is located in the front area of the plug-in module and whose short lever arm has at least one lever cam and a push-off nose and a pressure piece which is fastened to the module bar. The pressure piece absorbs the forces transferred from the lever, whereby the pressure piece has at least one recess, in which the lever cam of the lever reaches into during the insertion of the plug-in module. Furthermore the pressure piece has at least one push-off shoulder against which the push-off nose of the lever pushes off during the extraction of the plug-in module.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: July 12, 2005
    Assignee: Schroff GmbH
    Inventors: Michael Joist, Volker Haag, Paul Mazura, Klaus-Michael Thalau, Hans-Jorg Weiler
  • Method for fabricating magnetic field sensor
    Patent number: 6912770
    Abstract: To fabricate a magnetic field sensor, a copper barrier film is formed. A magnetic metal film is formed on the barrier film. A plurality of trenches is formed with a desired thickness in the magnetic metal film. A copper film is formed in the plurality of trenches, so that multiple layers of magnetic metal film and copper film are formed. The RF semiconductor device equipped with the magnetic field sensor includes a magnetic field sensor made by the above method. The magnetic field sensor is attached on a semiconductor substrate. Metal wirings are formed at near the both sides of the magnetic field sensor. An insulating film is formed on top. An inductor is formed on the insulating film at predetermined locations.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: July 5, 2005
    Assignee: Hynix Semiconductor Inc.
    Inventors: Dok Won Lee, Dong Joon Kim
  • Assembly device for assembling components
    Patent number: 6912775
    Abstract: An apparatus for assembling components of a data storage system. Assembly components are housed by a component storage member removably coupled to the frame of the apparatus for supporting a plurality of component stacks for automated assembly. The apparatus includes an assembly coupled to the component storage member for sequentially unloading components and assembling the unloaded components in a data storage system. The apparatus is adapted for high capacity, production and speed assembly.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: July 5, 2005
    Assignee: Seagate Technology LLC
    Inventors: Micahel W. Pfeiffer, Eric D. Johnson
  • Air suction component placement nozzle
    Patent number: 6910265
    Abstract: A pick and place system comprises a pick and place nozzle. The nozzle includes a groove comprising tapered sides that feed into a depression at the bottom of the groove, and a plurality of air holes configured to allow air suction to attract a component and hold it in the groove in such a manner as to ensure that the component can be accurately placed. The system also comprises a tray configured to hold a plurality of components to be picked up and placed using the pick and place nozzle. The tray can be configured to hold the components in a precise location within the tray.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: June 28, 2005
    Assignee: Kyocera Wireless Corp.
    Inventor: Miguel A. Nieves
  • Apparatus for telecommunications equipment
    Patent number: 6910267
    Abstract: An apparatus and method for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. A catch basin module is insertable into a slot in the telecommunications device in which at least one of the electronic modules would normally be disposed. The catch basin module includes a rear wall having a window, the window being dimensioned to surround a group of pin connectors disposed on the backplane. The catch basin module also includes a bottom surface disposed below the window which projects out from the catch basin module and abuts the backplane under the pin connectors when the catch basin module is inserted into the slot. When pins in the pin connectors are pushed out of the pin connectors from a rear side of the backplane, the pins fall onto the bottom surface of the catch basin module and do not fall into the chassis of the telecommunications device.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: June 28, 2005
    Assignee: CIENA Corporation
    Inventor: Charles Matthew Erwin
  • Electric-component handling device
    Patent number: 6910262
    Abstract: An electric-component handling device includes a suction nozzle, fiducial mark, an image-taking device, a relative-movement device and an image data processing device. The electric-component handling device is operable to handle an electric component.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: June 28, 2005
    Assignee: Fuji Machine MFG. Co., Ltd.
    Inventor: Koji Shimizu
  • Integrated circuit chip handling apparatus and method
    Patent number: 6904671
    Abstract: The present invention provides for an apparatus and method for handling integrated circuit (IC) chips such as thin small outline package (TSOP) IC chips. Embodiments of the invention are directed toward removal of TSOPs from device under test (DUT) boards. By use of magnetic forces generated by the invention, in combination with physical manipulation of the DUT boards and transfer structures, IC chips are quickly and efficiently transferred.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: June 14, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Oliver Farrens, Roy Cashin
  • Frame jig for a connector
    Patent number: 6904670
    Abstract: A frame jig for a connector is provided in order to be able to easily confirm the kinds of electric wires to be inserted in a connector and the installation locations. The frame jig for a connector includes a holder having a recess and apertures adjacent every location that confronts a respective cavity of the connector retained in the recess. Additionally, at the peripheral rim of the recess at the upper face of the holder, side recesses are provided on the side faces of the holder. First ends of sample electric wires are inserted in the apertures which confront the installation cavities of the corresponding kinds of electric wires to be installed in the connector. The other end of the sample wires inserted into recesses formed in sides of the holder, and locking members are inserted into the side recesses.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: June 14, 2005
    Assignee: Sumitomo Wiring System, Ltd.
    Inventors: Hiroshi Kawamura, Katsunari Tafuku, Kazutaka Nakao
  • Method for mounting an electronic component
    Patent number: 6904672
    Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: June 14, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuyasu Nagafuku, Noboru Nishikawa, Takeshi Kuribayashi
  • Method for making overlay surface mount resistor
    Patent number: 6901655
    Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: June 7, 2005
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Position control apparatus of feeder stage in surface mount device
    Patent number: 6901656
    Abstract: A position control apparatus of a feeder stage is disclosed, at which a tape reel for feeding parts to be mounted on a PCB is mounted in a surface mount device (SMD). The position control apparatus includes a feeder stage disposed inside a base frame of a SMD, a height/rotation power transmission device for controlling a height (Z) and a rotation angle (?) of the feeder stage, a first power transmission device for controlling the X-axis position of the feeder stage, and a second power transmission device for controlling the Y-axis position of the feeder stage. Therefore, the apparatus can be easily controlled the mounting position of the tape reel by controlling the position of the feeder stage at which the tape reel is mounted in the SMD.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: June 7, 2005
    Assignee: Mirae Corporation
    Inventors: Ji Hyun Hwang, Do Hyun Kim