Abstract: A method of producing a plane commutator in which it is easy to integrally form carbon and segment, connecting strength between the carbon and mold resin is enhanced, and conductivity is enhanced. The plane carbon commutator comprises a plurality of metal segments fixed to a commutator body made of resin, engaging projections provided on a carbon which was previously burnt at a high temperature, the engaging projections being engaged with engaging holes provided in the segments functioning to allow insertion of the engaging projections into the engaging holes but prevent the engaging projections from being pulled out from the engaging holes are projected from peripheral edges of the engaging holes, and the cut-rising pieces are brought into contact under pressure with peripheral faces of the engaging projections. Peripheral faces of tip end side engaging projections are formed into coarse faces, and conductive paste is interposed between the segments and the carbon.

Abstract: A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A method for manufacturing a tag encompassing an antenna or coil that is capable of at least one of wirelessly transmitting information to remote receivers and receiving information from remote transmitters. The method includes die-cutting a coil or antenna shape from an electrically conductive flat double foil having an upper electrically conductive flat foil layer of a soft, inelastic metal and a lower synthetic film substrate layer, the die-cutting including cutting with a die-cutting tool having a single die-cutting blade which matches the desired antenna or coil shape, the blade completely perforating the upper electrically conductive flat foil and at least partially separating the lower synthetic film substrate so that a gap the distance created in the flat foil by die-cutting remains after the die-cutting tool is removed. Subsequently the cut shape is bonded with additional layers including an electronic chip module.

Abstract: An ink jet recording head and a process for producing the same, and an ink jet recording apparatus are provided that improve the printing performance and also improve the production efficiency. A conjugated body 73 formed by conjugating silicon wafers 50 and 58 is cut, whereby nozzles 22 are opened, and cutting into head chip units is carried out. At this time, deep grooves 84 are formed on the surface of the silicon wafer 58 by anisotropic etching, and they are penetrated by etching on the opposite side. Grooves 90 are formed on the silicon wafer 50 by using the thus penetrated deep grooves 84 as a mask.

Abstract: A method for the automatable insertion or removal of an integrated circuit board is disclosed. One or more linear actuators or similar devices are coupled to one or more cards of an electronic device (e.g., a telecommunications switch or the like) by one or more brackets, to permit substantially automatic card withdrawal/insertion cycles. A controller is operably coupled to the actuators. The controller controls the actuators to operate through a plurality of cycles in a substantially unattended fashion. Measurement and recording or logging systems can measure the occurrence or duration of service disruptions and maintain a log of test results.

Abstract: Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

Abstract: A cable-processing device includes a first drive for swiveling movement and a second drive for linear movement of a swivel-arm. The swivel-arm is held on a bracket for rotation about an axle with a spring force acting counterclockwise on the swivel-arm. A gripper on the end of the swivel-arm holds a cable-end between first and second gripper-jaws. The jaws are arranged rotatably on an axle and are opened and closed by means of gears. To reduce the swivel-arm mass to be moved, the actuator for the gears is arranged on the swivel-arm.

Abstract: A routing method for routing a plurality of signal traces out of a plurality of corresponding bumper pads in a multi-layer circuit board. The multi-layer circuit board includes at least a first layer and a second layer. The method includes arranging the plurality of bumper pads based on a plurality of triangle units, routing a plurality of signal traces out of a plurality of corresponding bumper pads of in the first layer, routing a plurality of signal traces out of a plurality of corresponding bumper pads in the second layer not to be vertically parallel with the plurality of signal traces routed in the first layer, and arranging a plurality of shielding traces among the plurality of signal traces in the first layer and in the second layer.

Abstract: A method of manufacturing an angled conductor electrical connector including extruding a metal member having a channel therein; and bending the metal member such that the channel forms two angled conductor receiving areas. Each conductor receiving area has a channel axis angled relative to each other.

Abstract: A method of terminating at least one conductor of a superconducting cable comprising a plurality of superconducting tapes, comprising the steps of associating an electrically conductive connector radially at the at least one conductor, embedding and end of the superconducting tapes in a thermosetting resin, embedding an end portion of the superconducting tapes in a solder and achieving an electric contact by the solder. Moreover, the invention relates to a terminated conductor of a superconducting cable, a superconducting cable, a joint between conductors of two superconducting cables, a current transmission/distribution network, and a terminator for at least one conductor of a superconducting cable that embody the above method.

Abstract: An apparatus for performing an operation on a circuit substrate, the apparatus including a plurality of operating devices which are provided in a space that is closed and opened by a safety cover and one of which performs the operation on the circuit substrate, a safety-cover switch which is switchable to an ON state thereof corresponding to a closed state of the safety cover, and to an OFF state thereof corresponding to an opened state of the safety cover, a maintenance-related control device which keeps, in a maintenance mode, at least one of the operating devices to a state thereof in which the one operating device is operable, and a maintenance-mode setting switch which cooperates with the safety-cover switch to provide a parallel circuit, and which is selectively operable to an ON state thereof in which the maintenance-mode setting switch allows setting of the maintenance mode, and to an OFF state thereof in which the maintenance-mode setting switch does not allow the setting of the maintenance mode.

Abstract: An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.

Abstract: A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of a winding object by arc welding can be securely carried out. A stripping section strips an insulating coating off from the portions of the wire at the front and rear ends of the coil while the wire is wound around the winding object with the portions of the wire being bound to the terminal. Each portion of the wire, the insulating coating of which is stripped off, bound to the terminal is electrically connected to the terminal by arc welding.

Abstract: A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

Abstract: An apparatus for safe and easy installation of wall-mounted electrical switches utilizing a multi-function tool. The tool is provided, in the form of an insulated handle that is detachably engaged with a wall switch. The wall switch device is temporarily attached to a switch fixture using one or more magnets. The tool further includes built-in electrical wire measuring, stripping and bending structures.

Abstract: A method for conveying printed circuit boards (PCBs) in a system that includes at least two assembly modules, where each assembly module has multiple conveyors for delivering the PCBs so that while processing some PCBs, other PCBs can bypass particular assembly modules.

Abstract: The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array (7) or geometrically identical preforms for interconnecting or shielding and surface-mounted components (2) on the same surface of a substrate (1), thereby enabling said module to be directly connectable by soldering on a printed circuit (3). The balls (7) and the components (2) are transferred in one single step onto the substrate (1) by means of a gripping device adapted to the topography of the module to be produced.

Abstract: A method of installing a socket with a socket contact on an underwater plug with a plug contact is provided so as to establish conductive contact between the socket contact and the plug contact. The socket is disconnectably attached to a recoverable fluid exchange unit and the socket engages with the plug to establish the conductive contact between the socket contact and plug contact. The recoverable fluid exchange unit is then operated to substantially replace a first fluid within the socket with a second fluid from the recoverable fluid exchange unit.

Abstract: A method of sequentially mounting, on a printed-wiring board supported by a board supporting device, a plurality of electric components which are sucked and held by respective ends of a plurality of suction nozzles which are supported by a rotatable body such that the suction nozzles are provided along a circle whose center is located on an axis line of the rotatable body and such that each of the suction nozzles is not rotatable relative to the rotatable body and is movable relative to the body in a direction parallel to the axis line of the body, the rotatable body being attached to a movable member which is movable to an arbitrary position on a movement plane parallel to the printed-wiring board supported by the board supporting device, such that the rotatable body is rotatable about the axis line thereof perpendicular to the movement plane.