Abstract: A crimping tool has a handle lever portion and a crimp portion with a press and a base housing. The base housing has a placement location with a recessed surface for engaging a jack and a recessed region for a cable. The base housing also has lateral regions that have frictionally engaging surface portions for clamping to wire ends. The press has a plunger and a housing with terminating blades for shearing excess wire from the cable when the tool engages a twisted pair cable to a jack. The blades cut the wires and the excess wire is discarded. The press and the base housing then disengage and the jack is removed from the tool with the cable in communication with the electrical contacts of the jack.

Abstract: A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: A method of producing a chip inductor including the steps of inserting a conductive wire made of a metallic wire into a metallic mold, supporting both end portions of the conductive wire on support portions provided on inner surfaces of the metallic mold so as to position the conductive wire in the approximate center portion of the metallic mold, casting magnetic ceramic slurry into the metallic mold, molding the ceramic slurry case in the metallic mold by wet pressing to obtain a molding body having the conductive wire embedded therein, firing the molding body, and forming external electrodes on both end surfaces of the fired magnetic core such that the external electrodes are connected to both end portions of the conductive wire.

Abstract: An apparatus for facilitating the insertion and extraction of a PC board into and from a card cage, comprising a mounting body, an engager, and an actuator. In a preferred embodiment, the apparatus has a ring-shaped mounting body having a clearance hole therethrough. The apparatus is slidably and rotatably mounted on a cylindrical rod through the clearance hole such that the apparatus is slidably rotatable along the length of the cylindrical rod. In operation, the engager is positioned in physical contact with the PC board in a notch in the board such that when a force is applied to the actuator, the engager is effected to urge the board to move in the direction of the force.

Abstract: Methods for aligning a satellite reflector with an antenna that has a feed/LNBF assembly. The feed/LNBF assembly is electronically coupled to a set top box which is electronically coupled to a television that has a television speaker. A transmitter is placed adjacent the television speaker. The speaker transmits the audio tones emitted by the television speaker which are indicative to the alignment of the antenna with a satellite to a speaker located adjacent to or attached to the antenna.

Abstract: An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.

Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

Abstract: According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat spreading plate has a fixed portion fixed to the substrate, a stage portion caved with respect to the fixed potion and connecting portions connecting the fixed portion and the stage portion. The heat spreading plate is fixed by positioning the stage portion at a position opposing the opening, then the heat spreading plate is welded to the substrate and the semiconductor chip is mounted on the stage portion through the opening. Then the semiconductor chip and interconnections formed on the substrate are electrically connected and sealing resin is formed on both sides of the heat spreading plate such that at least the semiconductor chip is sealed.

Abstract: The present invention relates to an apparatus that proactively ensures alignment (parallelism) of the connectors on the circuit board during the solder assembly of the connectors to the circuit board. The apparatus includes an alignment fixture that has been specifically designed to ensure parallelism of straddle-mounted connectors during the solder reflow assembly process. The fixture has connector slots and a circuit board slot. The slots help to detect whether the connectors meet the X- and Y-axis alignment requirements after the insertion process (after the connectors have been placed onto the circuit board). That is, if the X- and Y-axis alignment specifications are met, the circuit board with its attached connectors can be completely fitted into the slots of the alignment fixture.

Abstract: Method for production and application of a heating element for heating in vehicles where the heating element consists of heating wire defining at least one electric heating loop extending in a predetermined pattern including positioning the heating wire onto one side of a carrier; applying adhesive over the carrier, at least over areas where the heating wire is lying and over the heating wire, so the heating wire adheres to the surface of the carrier; transporting the carrier with the heating wire to a substrate, wherein the heating wire is adjacent to the substrate; pressing the heating wire against the substrate; heating and melting the adhesive to separate the heating wire from the carrier leaving the heating wire adhered to the substrate; and, removing the carrier, so the heating wire is released from the carrier and adheres to the substrate, to form the heating element for heating in the vehicle.

Abstract: A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.

Abstract: Methods for aligning a satellite reflector with an antenna that has a feed/LNBF assembly. The feed/LNBF assembly is electronically coupled to a set top box which is electronically coupled to a television that has a television speaker. A transmitter is placed adjacent the television speaker. The speaker transmits the audio tones emitted by the television speaker which are indicative to the alignment of the antenna with a satellite to a speaker located adjacent to or attached to the antenna or antenna support structures.

Abstract: The invention provides an apparatus for manufacturing a magnetic wound core of a toroidal transformer. The apparatus in accordance with a preferred embodiment of the invention comprises a control device for controlling the apparatus based on parameters of the core material and the wound core, a supplying device for providing the core material ribbon, a grinding device for grinding the lateral edges of the core material ribbon under the control of the control device, and a winding device for receiving and winding the core material ribbon into the wound core.

Abstract: A method of manufacturing a multi-layer ceramic electronic part involves the steps of preparing an unbaked laminated body containing a ceramic layer and internal electrodes laminated on one another, applying and drying a conductor, into which is added a material common with a ceramic forming the ceramic layer of the laminated body, on edge portions of the unbaked laminated body, forming external electrodes in contact with the internal electrodes at end surfaces of the laminated body, and baking the laminated body.

Abstract: An armature coil winder for winding coils at high density while restricting coil ends within a restricted space in an armature core assembly having a plurality of slots in an outer circumference thereof and a series of continuous coils, the coil winder including a fixed former for guiding one of the continuous coils into two of the slots, and a movable former for restricting a position of a coil end of one of the continuous coils between the two slots by moving in the fixed former along both end surfaces of the armature core assembly toward a center of the core assembly; a former slider including a flyer for winding one of the continuous coils around the fixed former; and a coil shaping mechanism including coil shaping blades for shaping one of the continuous coils in the slots relative to the armature core assembly. The use of such a winder to form coils of an armature core assembly is also described.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided, and positioned on an associated substrate for positioning adjacent an inside surface of the top wall portion of the closure of the package. In one embodiment, the mounting substrate is provided in the form of a disc-shaped sealing liner for the closure. In an alternate embodiment, the mounting substrate is laminated to an associated sealing liner, with the substrate, and microelectronics assembly positioned thereon, inserted together with the sealing liner into the associated molded closure.

Abstract: The present invention provides an assembly apparatus employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: Substrates are supported by height-adjustable supporting pins in automated equipping units. The supporting pins are composed of a tip and a foot part that is spring-borne relative to the tip. When the supporting pins are placed against an underside of the substrate, the supporting pins individually adapt to the contour of the underside of the substrate. The height position of the supporting pins is subsequently fixed. As a result, substrates having position and surface variations can be protected against sagging upon placement of components on the substrates during an automated equipping process.

Abstract: A method of assembling the annular antenna and transponder tag includes formation of the antenna wire with an insulating cover therearound; cutting the covered antenna to length; stripping antenna wire ends; threading one antenna wire end through the transponder; splicing the antenna wire ends together; and injecting an insulating composition around the transponder tag and spliced antenna ends.

Abstract: An electric-component mounting system including: nozzle holders each carrying suction nozzles and rotatable to bring selected one of the suction nozzles; a turning device to turn the nozzle holders about a common axis of turning, for stopping each nozzle holder at predetermined working positions including nozzle-selecting, component-receiving and component-mounting positions; a holder rotating device which includes an engaging member engageable with and disengageable from an engaging portion of each nozzle holder, and which is disposed at the nozzle-selecting position, to rotate the nozzle holder, with the engaging member engaging the engaging portion; and an engaging-and-disengaging device to move the engaging member for engagement and disengagement with and from the engaging portion, and wherein each nozzle holder receives an electric component at the selected suction nozzle when each nozzle holder is located at the component-receiving position, and mounts the electric-component onto a circuit substrate whi