Abstract: method for making a mount for at least two electronic devices forming a first mounting surface (210) from a material (240), and forming a second mounting surface (220) from the material (240). The first mounting surface (210) is connected to, but spaced from, the second mounting surface (220) by a mounting surface distance (250). The method further comprises reducing the mounting surface distance (250).

Abstract: A device and method including a slot insertion member is to hold a number of card edge slots having a plurality of pins extending from them in alignment for insertion of the plurality of pins into a plurality of holes of a printed circuit board. At least one grip attachment member is connected to the plurality of slot insertion members to hold the plurality of slot insertion members in a fixed position. At least one grip member is connected to at least one grip attachment member to enable the holding and positioning of the slot holder.

Abstract: A method for manufacturing a core of a motor for washing machines. In the manufacturing method, a pair of core bands are formed by punching the electric steel plate so that both core bands are opposite to each other in orientation and the teeth of one core band alternate with the corresponding teeth of the other core band, the core band is wound to a designated height so as to form a ring-shaped core, and securing parts are welded to the inner cylindrical surface of the ring-shaped core so as to be connected to a washing tub by bolts. The manufacturing method of the present invention is simply accomplished, allows the electrical steel plate to be maximally utilized, and improves a degree of strength of the core.

Abstract: Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21?) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21?), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21?) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).

Abstract: A method of manufacturing a measuring tube for an electromagnetic flow sensor includes the steps of filling a material to be sintered into a lumen of a support tube, sintering the material within the lumen to obtain an open-pored reinforcing body of the measuring tube, and impregnating the open-pored reinforcing body obtained by the step of sintering the material within the lumen at least partially with a liquid insulating material and solidifying the insulating material to obtain a liner of the measuring tube.

Abstract: A method of grounding a tube to a chassis wherein a plastic clip made conductive by the incorporation of conductive particles therein, is clamped onto the jacket of metal automotive vehicle tubing so that projections on the clip penetrate through the jacket to engage the outer surface of the metal tube. The clip body is welded to the jacket to hermetically seal the region of contact between the clip and the metal.

Abstract: A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit.

Abstract: A method is provided for processing leadframe items of two or more types to form integrated circuit packages. The leadframe items are delivered along respective input paths and are received into holders, which are moved alternately between a processing region and a respective leadframe item reception position on a respective input path such that each of the holders moves to the processing region at a time when the other of the holders moves to its respective reception position. The leadframe items are delivered from the respective reception position to the processing region, and are then sent for encapsulation.

Abstract: A method for mounting parts may include recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the had unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.

Abstract: The invention provides a mounting apparatus with a beam which is free from adverse effect on its performance due to thermal distortion and misalignment of its guide rails, on which the beam for mounting operation travels. One end of the beam is rotatably supported on a slide, which moves along the guide rails. Another end of the beam is also rotatably supported on another slider through a moving element. The slider and the mounting element move along the guide rail. The moving element moves in a direction perpendicular to the guide rails.

Abstract: A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer termination in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: An interlocked stack of laminations for rotors wherein each lamination includes a centrally located, circular indentation. The indentation provides corresponding projections and depressions in the laminas which may be interlocked by engagement of a projection in one lamina with an adjacent depression in an adjacent lamina.

Abstract: A method for reducing the impedance of a reference path in a printed circuit board includes forming a printed circuit board having a plurality of conductive layers including first, second, third, and fourth layers. The printed circuit board includes two or more vias interconnecting two or more of the conductive layers. A first via is part of a signal path configured to carry a signal from the first layer to the second layer. A second via is part of a reference path configured to carry said signal from a third layer to a fourth conductive layer. The method further includes embedding an electrical component, such as a capacitor, in the second via between two of the conductive layers.

Abstract: A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links. The method includes selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates, stacking the conductive plates, mounting contact pins to selected contact pads, and heating the stacked plates and the mounted contact pins, thereby reflowing the conductive circuit plates and the pins to create solder joints therebetween.

Abstract: The invention is directed toward a method of manufacturing a flexure blank whereby an opening portion is provided in a in a connecting portion of a flexure blank, an opening end portion of an insulating base layer is coated with a conductive member without exposing the opening end portion of the insulating base layer in the connecting portion, and a lower surface of the conductive member of the opening portion in the connecting portion of the flexure blank is structured such as to form the same surface as the lower surface of the insulating base layer.

Abstract: A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

Abstract: A charged species source and a charged species drain are provided. A moveable component is positioned proximate to the charged species source and the charged species drain. A first protrusion and a second protrusion are provided in contact with the moveable component, wherein at least one of the moveable component, the first protrusion and the second protrusion have a size of a micrometer scale or smaller. The moveable component is moved relative to the charged species source and the charged species drain to transfer electrical charge between the source and the drain.

Abstract: A pressing device for thin-film circuits and terminals includes the characteristics of a machine base provided with a bottom panel, and a cutting block and a pressing block capable of intermittent up-and-down displacement at an interior thereof; an inner modular base capable of elastic displacement and flexibly disposed in a projecting column on the bottom panel; and an outer modular base fixed at an outer side of the inner modular base. Wherein, the outer modular base presses onto an upper pressing plane using downward displacement of the pressing block, and a cutting-edge portion slides upward along a rear sliding wall of the inner modular base, thereby accurately puncturing, stamping and connecting a plurality of terminals onto silvered wires of a thin-film circuit at a time.

Abstract: A system is provided for mounting a connecting device to a substrate. A connector housing is located at one side of the substrate, and a threaded fastening nut is engaged on the housing. A threaded fastener is engaged with the opposite side of the substrate and extends therethrough for tightening the nut toward the substrate in response to rotating the fastener. An assembly tool holds the fastening nut against rotation as the fastener is rotated. The tool includes a first portion for engaging at least a part of the housing to properly position the tool. A second portion of the tool engages the fastening nut to prevent rotation thereof. The second portion of the tool is aligned with the fastening nut automatically in response to engaging the first portion with the housing.