Abstract: A magnetic tape cartridge includes an opening 1C through which a magnetic tape is drawn out, and a slide door 6 that slides along a sidewall 1D provided with the opening 1C to open and close the opening 1C. The cartridge having an assembly support device that guides a distal end of a spring support rod onto a support rod receiving block when the slide door is fitted in a lower half of the cartridge case. A proximal end of the spring support rod projects from the slide door, and a compression coil spring is wound around the spring support rod.

Abstract: A chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the ape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized and the center line of the inner lead is recognized. The inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S. the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

Abstract: A method of manufacturing a housing for electronic parts, such as isolators, or the like, with as small non-plated portions as possible, which housing is obtained by separating a housing part from a metallic housing part support with the housing part connected to a frame through connections, the method comprising the steps of cutting off and removing the connections after provisional connections of a resin are formed on the housing part support to connect the frame to the housing part, and obtaining the housing for electronic parts by removing the provisional connections after plating is applied to surfaces of the housing part including cut portions of the connections.

Abstract: A tool head is used for securing a tap connector having a C shaped member and a wedge using a ram tool. The tool head comprises an elongate base member comprising first and second ends. A collar at the first end of the base member has a through opening for receiving a ram tool. A head at the second end of the base member is aligned with the collar through opening to engage a C shaped member. A cable stop plate is mounted to the head for limiting movement of a tap line cable received in a C shaped member when a ram tool is securing a tap connector.

Abstract: A tape head module assembly system is disclosed. A first and second module holder are placed in an initial alignment with module holder ends facing each other, the module ends each holding a tape head module. A tape wrap angle between the first and second module is set by first performing a fringe alignment and then lifting a rear end of the first and second module holder a prescribed amount. A horizontal adjuster produces a rotation for the first module holder so that gaps between the first and second modules are parallel. An alignment along a longitudinal axis for the second module holder is selected and the second module is translated laterally until the second tape head module held by the second module holder is aligned with the first tape head module held by the first module holder to provide reader-opposite-writer track-to-track registration. Then, the first and second tape head modules are joined together using a joining agent in the gap between the first and second tape head modules.

Abstract: A method of manufacturing a plurality of electro-optical sub-assemblies in parallel is provided. A plurality of printed circuit boards (PCBs) are preferably formed in a panel of flex material. Rigid substrates can be arranged along regions of the PCBs. A plurality of electrical components, including electro-optical semiconductor devices, are preferably located on the rigid substrates. Lens arrays are preferably aligned over the electro-optical semiconductor devices, such as through an alignment mechanism. The PCBs can then be singulated into individual electro-optical sub-assemblies. The rigid substrates can be a plurality of leadframes formed on a matrix leadframe. The matrix leadframe is preferably attached to the panel of flex material such that the leadframes are arranged in proximity to leadframe cutout regions of the PCBs. Electrical interconnections are then preferably formed between the electrical components on the leadframe and the PCBs.

Abstract: A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low surface tension on the ball attach area to prevent bridging between the solder balls. Solder balls require a low surface tension soldermask to minimize bridging, while the molding compound requires a high surface tension to provide adequate adhesion to the surface of the soldermask. By exposing selected portions of the soldermask to an activation method, such as ultra-violet radiation, the surface tension of the soldermask can be varied such that different areas of the package exhibit different surface tensions.

Abstract: Methods for aligning a satellite reflector with an antenna that has a feed/LNBF assembly. The feed/LNBF assembly is electronically coupled to a set top box which is electronically coupled to a television that has a television speaker. A transmitter is placed adjacent the television speaker. The speaker transmits the audio tones emitted by the television speaker which are indicative to the alignment of the antenna with a satellite to a speaker located adjacent to or attached to the antenna or antenna support structures.

Abstract: Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming regions separated by at least one opening defined in substrate material between each pair of adjacent circuit forming regions. At least a portion of interconnection regions along singulation axes are removed to singulate the circuit forming regions.

Abstract: Methods of manufacturing an antenna are presented. The antenna is capable of being mounted on a printed circuit board. In accordance with the method, the design dimension of a unitary piece of material are selected according to an operating wavelength. The unitary piece of material is stamped out from a larger section of material according to the design dimensions to form an antenna. The unitary piece of material includes a circular area and a stem area. The circular area has a center and an outer region. The stem area has a first end and a second end. The first end is joined with the outer region. The unitary piece is bendable at the first end and the outer region.

Abstract: A method for fabricating a circuit device includes preparing an insulation resin sheet for which a first conductive layer and a second conductive layer are adhered to each other by insulation resin, forming through holes in the first conductive layer and the insulation resin at appointed points of the insulation resin sheet, and selectively exposing the rear side of the second conductive layer. A multi-layer connecting means is formed in the through holes and the first conductive layer is electrically connected to the second conductive layer. The method includes etching the first conductive layer to an appointed pattern, forming a first conductive path layer, and adhering and fixing semiconductor elements by electrically insulating the same on the first conductive path layer. The first conductive path layer and the semiconductor elements are overcoated with a sealing resin layer.

Abstract: A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending downward from and rigidly coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge and having a plurality of legs extending from the elongated vertical member, each such leg further comprising a flange extending substantially perpendicular to its respective plurality of legs in a direction toward the elongated horizontal assembly's curved edge. Each of said flanges are suitable for attachment to a surface of a circuit board. Further, such stiffener is capable of being moved, oriented, placed and mechanically bonded to the printed circuit board using existing SMT robotic assemblies.

Abstract: Crimp pieces (21) of a metal terminal and a conductor wire placed on an inner side of the crimp pieces are positioned between a crimp indenter (11) and a crimp anvil (18). Then, at least one of the crimp indenter (11) and the crimp anvil (18) is moved toward another one thereof along a direction of a longitudinal center axis (12) to crimp the crimp pieces (21). At least two arch-shaped portions (13) are disposed on an inner surface of the crimp indenter (11), and are adjacent to each other and symmetric with respect to a plane including the longitudinal center axis (12). A sharply pointed portion (14) is defined by curves of the at least two arch-shaped portions (13) intersecting on the longitudinal center axis (12). Curvature of each of the curves is set to be greater toward the sharply pointed portion (14).

Abstract: A tool kit for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. The tool kit includes one or more pin insertion tools for inserting new pins into pin connectors disposed on the backplane. One or more guide shrouds attachable to the backplane which isolate specified portions of the backplane to make pin insertion easier. The head of the pin insertion tool is preferably fittable into the frame of the shroud. Preferably, all of the components of the tool kit are asymmetric so that only one pin insertion tool may be fitted into only one shroud in only one orientation, to insure proper pin placement.

Abstract: A method for connecting a plurality of coaxial cables to a printed circuit board in a compact connector. The method generally comprises the steps of stripping the coaxial cables, bonding the coaxial cable to a flexible carrier, positioning the coaxial cables over traces of a printed circuit board providing pressure such that electrical contact is maintained between the cables and the printed circuit board.

Abstract: A method of making a microelectronic package. The advanced microelectronic component package incorporates a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.

Abstract: A lightweight, portable hand tool is provided for applying an insulation-piercing electrical connector, having insulation displacement conductive elements, to an insulated electrical cable. The tool is made of injection molded, impact resistant plastic and includes a manually grippable frame, with a loading die on the frame for receiving and holding the insulation-piercing electrical connector. A manually actuable, movable portion of the frame moves relative to electrical connector to cause the insulation on the wires to be pierced and thereby electrically connected to the connector. The tool is suitable for use with electrical cable having one or more pairs of wire, such as the typical four pair Ethernet cable.

Abstract: A flexible manufacturing press assembly for the processing of sheet material through punching and forming operations having a plurality of tool assemblies of which each, in turn, group and support a plurality of processing tools. Each tool assembly has a punch magazine, a die block, and a stripper plate for processing the sheet material in the manner of a Class A die. A sheet material positioning assembly clamps the sheet material and positions it within a two-axis plane adjacent the tool assemblies. A punching head assembly, supported by the sheet material positioning assembly, positions a punching head adjacent the grouped tool supports.

Abstract: A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.