Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: The invention provides a process for producing a coil-embedded dust core by embedding a coil in magnetic powders comprising ferromagnetic metal particles coated with an insulating material. At the first compression molding step one portion of magnetic powders is filled in a molding die and then compression molded to form a lower core. At a coil positioning step the coil is positioned on the upper surface of the lower core in the molding die. At a coil embedding step another portion of magnetic powders is again filled in the molding die in such a way that the coil is embedded in these magnetic powders. At the second compression molding step pressure is applied to the lower core and coil in the direction of lamination thereof.

Abstract: An object of the invention is to manufacture sliders having excellent properties with accuracy and to improve the production efficiency and the cleaning property. In a method of the invention to manufacture a bar in which a row of slider sections are aligned, a wafer block is made from a wafer in which rows of slider sections are aligned. The wafer block is bonded to a dummy block on a support plate. Next, a processing step and a cutting step are repeated. The processing step is to perform a specific processing on the medium facing surfaces of a row of slider sections in the medium facing surface of the wafer block bonded to the support plate. The cutting step is to cut the wafer block together with the support plate such that the row of slider sections whose medium facing surfaces have received the specific processing are separated from the wafer block to be the bar. A tape is affixed to the medium facing surfaces to protect the medium facing surfaces in the cutting step.

Abstract: A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions of the substrate between adjacent frame elements. A dielectric layer overlies the intervening regions, as a protective barrier for at least one of the conductors, a component, and a circuit feature of the substrate.

Abstract: In a component placement machine, a placement head (4) is driven by a linear motor (5). The stationary part (7) of the motor is attached to the machine frame (1) on which a PCB (8) is attached. The movable part (6) of the motor is connected to a slide (2) on which the placement head (4) is attached. During driving the placement bead, reactive forces of the motor generate vibrations in the stationary part (7) of the motor and thus in the machine frame (20). This causes inaccuracies during the placement of components (9) on the PCB (8). To diminish this problem, the reactive forces are intercepted in a separate force frame (10) which is dynamically disconnected from the machine frame (1).

Abstract: A method of manufacturing an elongate stack of interlocked laminae in a die assembly. The method includes the steps of stamping a first lamina having generally opposed first and second edges in the strip stock material, stamping at least one first interlock means for engaging another lamina in the first lamina, separating the first lamina from the strip stock material, placing the first lamina into the choke passageway, the first and second edges of the first lamina frictionally engaging the choke passageway, stamping a second lamina having first and second elongate edges in the strip stock material, stamping at least one second interlock means for engaging another lamina in the second lamina, at least partially engaging the first and second interlocking means, separating the second lamina from the strip stock material, placing the second lamina into the choke passageway, and frictionally engaging the choke passageway along the first and second elongate edges of only one of the first and second laminae.

Abstract: A method for attaching an additional object to a resonator body. The method includes the steps of (1) placing the additional object in a recess of a pushing part of an extrusion machine; (2) pressing the pushing part against a bloom of a resonator body; and (3) pulling the pushing part back from the resulting resonator body. The attaching of the additional object occurs in conjunction with the extrusion process.

Abstract: The invention relates to a device for mounting components on a carrier comprising a frame (25) in which a shaft (8) is accommodated, the shaft is provided with a longitudinal bore (16), and means for displacing said hollow shaft (8) in vertical direction through said frame (25), wherein said shaft (8) at one end (8a) facing away from the carrier can be coupled to means (17) for generating an under pressure or vacuum within said bore (16) and wherein the other end (8b) of the shaft facing towards the carrier is provided with means for picking up and mounting a component. According to the invention, the device is characterized in that said shaft (8) is coupled to a yoke (12) which forms part of said displacement means, which coupling can be temporarily disengaged the moment the shaft makes contact with a component or a carrier.

Abstract: A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract: An apparatus is provided that crimps an electrical wire having a water-proof plug onto a connector terminal in a given positional relationship and can be applied to an automatic assembling operation. In the vicinity of upper crimping members and lower crimping members of the apparatus which crimp an electrical wire having a water-proof plug onto the connector terminal, there are provided a water-proof plug positioning member which has a positioning protuberance used for placing a water-proof plug in a given position with respect to the front end of the connector terminal and a terminal positioning member which is vertically movable and engages with a positioning groove of the connector terminal. The front end face of a water-proof plus sealing section is brought into contact with the rear surface of a positioning protuberance, thereby placing the water-proof plug in a predetermined position.

Abstract: An assembling apparatus for assembling rotating electrical machines having permanent magnets and armatures cores. The apparatus holds the armature core while the permanent magnets are assembled on to it thus avoiding hand labor. At all times, the rotor is supported so that it cannot cant relative to the stator and its permanent magnets and thus, no damage to the magnets or any coating thereon or to the armature will occur.

Abstract: The present invention relates to a transfer type circuit board fabricating system including a conveyor device for transferring circuit boards in a predetermined transfer direction through a component placing device for placing electronic components on the circuit boards. The conveyor device includes a pair of conveying surfaces for conveying the circuit boards and a pair of board supports for supporting one of the circuit boards. Each board support extends between and is supported by the pair of conveying surfaces. A table having a surface is situated below both the pair of conveying surfaces and the pair of board supports. A pair of deflection shields extend from and at an acute angle with respect to the surface of the table to terminate at an edge. Each edge is flush with and adjacent to one of the conveying surfaces and is also beneath the pair of board supports.

Abstract: A method of mounting a mechatronics control module (14) includes an electronic control unit (16) having a flex foil circuit (34) with a multiple of mounted electronic components including sensors (24) which sense the hydraulic state of the transmission clutch or other frictional engagement elements within the transmission system. The sensor is mounted to a base plate (82) which is mounted to a fixture (88) which folds the flap (84.) When the base plate (82) and mounted sensor are removed from the fixture (88), the flap (84) unfolds so that the circuit traces of the flex foil (34) are adjacent the contacts (94.) In a final step, the circuit traces (81) are electrically connected to the contacts (94.

Abstract: A mounting system for an electric component operates by transferring the electric component from a component supply device to a suction nozzle of a component-holding head on a circuit substrate. A relative position between a sucking surface of the suction nozzle and an axis of rotation of the component-holding head is obtained. A component-holding head and the component supply device are moved relative to each other on the basis of the obtained relative position, so as to minimize an error of relative positioning between the sucking surface and a predetermined sucking position of the electric component positioned at the component-supply portion. The head and the component supply device are then moved toward each other, for transferring the electronic components from the component supply device to the suction nozzle.

Abstract: A suction head for a mounting apparatus includes: a socket having a first through hole in an inner direction and a fixing member inside the first through hole, one end of the inside of the first through hole being mounted to a hollow shaft by using the fixing member, a nozzle having a second through hole for forming an air passage when sucking parts in the inner direction, a coupling member having a third through hole in the inner direction and plate spring members installed inside the third through hole for supporting the nozzle and for alleviating impact when the nozzle sucks parts, and a holder for fixing the nozzle so that it is not removed from the coupling member.

Abstract: Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of the through-hole upper lands; solder and solder paste are then melted by heating, causing them to flow into the through-holes and to wet and spread out upon the through-hole bottom face lands, thereby effecting a soldered joint with the BGA-side pads and through-hole upper lands securely attached, and forming solder fillets. In this way, the quality of the solder joints can be ascertained by an ordinary external inspection method.