Abstract: The present invention is related to an apparatus for cutting webs of material, including a first revolving member and a second revolving member having cutting elements integrated therein. Said revolving members, respectively, define a cutting region therebetween and supporting elements, respectively, assigned to said revolving elements within said cutting region. Said second revolving member comprises a belt assembly having a layered structure, said cutting elements mounted within said layered structure.

Abstract: A method for making a high current, low profile inductor includes a wire coil having an inter coil end and an outer coil end. A magnetic material completely surrounds the wire coil to form an inductor body. First and second leads connected to the inner coil end and the outer coil end respectively extend through the magnetic material to the exterior of the inductor body. The method of operation involves pressure molding the magnetic material around the wire coil.

Abstract: An automatic rear combination lamp removal system includes a base, a plurality of sliding blocks slidably mounted on the base for moving in four ways on the base, a plurality of fastener removers mounted on the sliding blocks for removing nuts fixing rear combination lamps to a vehicle, and a plurality of lamp holders pivotally mounted to the fastener removers for holding the rear combination lamps.

Abstract: A module is placed inside a chamber that can be sealed hermetically. The module includes a substrate incorporating a plurality of electronic circuit parts, a frame connected to the substrate so as to enclose the plurality of electronic circuit parts, and a cover placed facing the substrate and connected to the frame so as to cover an opening portion of the frame. The pressure in the chamber is reduced to a first pressure P1, and then the pressure is increased from the first pressure P1 to a second pressure P2. A liquid is filled into the module through a hole formed in the cover within the chamber, and the pressure inside the chamber is increased from the second pressure P2 to a third pressure P3. Then, the hole of the cover in the chamber is closed to seal the module hermetically, thereby sealing the liquid in the module. Thereafter, the pressure in the chamber is increased from the third pressure P3 to an atmospheric pressure P0, and the module is taken out of the chamber.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A hoop material cutter, which comprises a movable blade secured to a bottom surface of a ram movable reciprocally while rocking, a fixed blade secured to a top surface of a base plate, and a hopper for guiding a hoop material between the movable blade and the fixed blade, cuts the hoop material while allowing the movable blade to move toward and away from the fixed blade in accordance with an action of the ram. In this hoop material cutter, cylindrical guide pins are rotatably fitted in the base plate via blocks which are detachable in a horizontal direction from the base plate and each having both ends chamfered, and a part of the cylindrical surface of each guide pin protrudes sideways of the associated block so that the end faces of the movable blade are guided by the protruding portions.

Abstract: method for making a high current, low profile inductor includes taking an elongated plate, cutting a plurality of slots in the sides of the plate so as to form a plurality of cross segments extending transversely with respect to the length of the plate and a plurality of connecting segments extending approximately axially with respect to the longitudinal axis of the plate. The method further requires bending the segments transversely with respect to the plate axis so as to place the opposite flat surfaces of the cross segments in planes parallel to one another and facing in an axial direction with respect to the longitudinal plate axis.

Abstract: A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.

Abstract: In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

Abstract: A method for making a suspension system comprising a multiple layer flexure, a load beam and an arm. The load beam extends from the tip of the suspension all the way back to the rear of the arm. Datum holes are located in the load beam such that during assembly all reference points are made from the single load beam piece.

Abstract: In the method of manufacturing substrate-use terminals in accordance with the present invention, a rectangular wire 10 is first subjected to cylindrical shaping to form a substrate-side terminal portion 22. Next, a loss portion 14, which is a connecting portion between a tip portion 22a of the substrate-side terminal portion 22 and a tip portion 21a of a connector-side terminal portion 21 and is not used as a portion of a substrate-use terminal 20 after being cut off, is subjected to cutting so as to provide primary machining for the tip portions 21a and 22a. Subsequently, the connector-side terminal portion 21 and the substrate-side terminal portion 22 are subjected to tip crushing to provide secondary machining for the tip portions 21a and 22a. Next, a retaining section 23 for engagement in a connector housing is formed, and the loss portion 14 is finally cut off to form the single-unit substrate-use terminal 20.

Abstract: A saw blade is constituted with a unset tooth, a plurality of left-set teeth and a plurality of right-set teeth. In the construction, the saw blade has the unset tooth, a plurality of left-set teeth and a plurality of right-set teeth as one group. A plurality of set widths of the plurality of set teeth are formed in the saw blade. A relief angle of a tip of the unset tooth is equal to or greater than a relief angle of a tip of the set tooth having the smallest set width. Furthermore, the relief angle of a tip becomes small in accordance that the set width becomes greater.

Abstract: A sealant is applied to electric wires which comprise a wire harness at a location where a portion of this wire harness passes through a narrow diameter cylindrical member 6a of a grommet 6. An outer circumference of this portion to which the sealant has been applied is covered by a sheet 11. Both open ends along a length-wise direction of this sheet are bound by tape 13 and 14, the bound portions of this tape preventing the sealant from escaping to the exterior. In the portion between the tapes, the sealant is forced to permeate into the cross-sectionally central portion of the wire harness. The tapes 13, 14 also act as a positioning aid.

Abstract: A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping old or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

Abstract: In a rotating electric machine including a rotor and a stator surrounding said rotor in substantially concentric relation therewith to establish a gap therebetween, and wherein the stator is formed with a plurality of radially oriented slots, each slot receiving a stator bar held in place by a wedge, an arrangement to minimize rotor windage loss wherein each wedge substantially fills its respective slot such that an end surface of the wedge is substantially flush with adjacent surfaces of the stator.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: Disclosed is a method for assembling a device including a base and a main board assembly in a hard disk drive including an actuator having a magnetic head; a base having a spindle motor mounted thereon, the spindle motor rotating at high speed a disk on which the magnetic head is suspended to conduct data writing and reading; and a main board assembly assembled to a lower surface of the base. The device comprises a guide section for establishing a vertical assembling position of the base and the main board assembly and for allowing the main board assembly to be capable of a sliding movement to a predetermined location on the base; a stopper section for stopping the sliding movement of the main board assembly on the base; and a locker for locking the main board assembly stopped by the stopper section to the base in a vertical direction.

Abstract: A method for protecting magnetic read/write head assembly against electrostatic discharge during disk drive manufacturing are disclosed. The magnetic head assembly is supported on a substrate having a magnetoresistive sensor element disposed in spaced relationship between several magnetic shield elements. Before a focused ion beam fabrication operation, at least a portion of an air bearing surface of the magnetic head assembly is coated with a thin and transparent layer of conductive material. This layer of conductive material is subsequent removed after the focused ion beam fabrication operation.

Abstract: An apparatus for assembling a disc storage system includes a base having a number of subassemblies. A disc pack subassembly is mounted on the base and is configured to support a disc pack and an actuator subassembly is mounted on the base and is configured to support an actuator assembly. A drive mechanism merges the disc pack subassembly together with the actuator subassembly whereby transducer heads in the actuator subassembly are positioned on disc surfaces of the disc pack. At least one of the subassemblies is releasably mounted to the base and the subassembly can be replaced for assembly differing disc storage systems or upon failure of the subassembly.