Abstract: The present invention provides an apparatus for use in arcing fault detection systems within circuit breakers and which is adapted for automated production by top-down assembly. In one embodiment, the apparatus includes a circuit board and a two-piece sensing coil within a two piece housing with its center oriented horizontally relative to the circuit board. In other embodiments the sensing coil is one-piece and is either preassembled with a sensing bus and oriented horizontally or oriented vertically relative to the circuit board. The invention also includes several methods for making electrical connections to the circuit breakers.

Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves placing a bonding composition on opposing surfaces of a substrate. First and second complementary coil patterns are formed, and are aligned and bonded to respective clamp plate fixtures. The first complementary coil pattern is bonded to one surface of the opposing surfaces of the substrate via the bonding composition, and the second complementary coil pattern is bonded to the other surface of the opposing surfaces of the substrate via the bonding composition. The bonding composition is cured, and the clamp plates are removed from the first and second complementary coil patterns.

Abstract: A method for constructing thermally and dimensionally stable traveling wave tube circuits having high dimensional stability, narrow tolerances, and very small size by providing a small hollow preform constructed of a desired material which is coated with a layer of photoresist material then exposed to a UV laser to form a desired pattern mask in the photoresist layer. The pattern masked preform is then etched to create a preform having a desired shape. After shaping, the photoresist coating is stripped from said shaped preform to form a traveling wave tube circuit. Optionally the travel wave tube circuit may be polished.

Abstract: A method for finishing a pole tip trimmed read/write heat that includes a substrate with a pole tip structure having a shield, a shield/pole, and an outer pole. A gap region separates the pole and the shield/pole. First, pole tip trimming is performed to the read/write head to remove matter from the shield/pole, the pole, and the gap region. This defines a bridge composed of inward-facing extensions of the pole and shield/pole interconnected by an intervening region. This bridge separates recessed “trenches,” each formed by removing a contiguous mass from the shield/pole, the gap region, and the pole. Next, an overlayer is applied over the pole tip structure, filling the recessed trenches. The coated structure is then trimmed to remove all coating material overlying the shield/pole and pole. Trimming is continued to additionally remove a top layer of the protrusions of the pole and shield/pole to remove any rounded edges created by pole tip patterning, resulting in a more distinct write head.

Abstract: A substrate carrier which is used through beginning assembly operations such as solder reflow for attaching ball grid array devices to flexible substrates. The carrier includes a main structural support for centerly placing the substrate. The support member include two pairs of pins protruding from the support member to engage with a matching pair of datum apertures disposed inboard of the side edges of the substrate. A plurality of high temperature magnetic inserts are affixed into holes of the support member disposed parallel and outboard of the pins. The cover has two rows of apertures for engagement with the pins of the support member is attracted by the magnetic inserts forcing the outer periphery of the cover against the top surface of the substrate.

Abstract: A dispenser for sheet material such as paper towels. The paper towels are provided in a continuous roll. The roll is mounted within an enclosure above a drum. The drum contains a cutting assembly that moves between a retracted position and a cutting position. The cutting assembly cuts the sheet material when in the cutting position. The sheet material frictionally engages the drum such that pulling the sheet material out of the enclosure causes the drum to turn. The turning of the drum causes the cutting assembly to move between the retracted and cutting positions once every revolution of the drum. More specifically, a guide projection is formed on the cutting assembly, and a track assembly is formed on the enclosure. The guide projection engages the track assembly to cause the cutting assembly to move between the retracted and cutting positions.

Abstract: Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated with a plurality of conducting tracks formed on a second substrate. The conducting tracks on the second substrate are associated with contact pads of the components in the first substrate. Each conducting track on the second substrate includes a connection strip arranged to coincide with associated depressions in the first substrate when the first and second substrates are mated. After mating, the components are separated into individualized electronic modules by forming proximal trenches in the first substrate and distal trenches in the second substrate. The proximal trenches are formed around the components in the first substrate to open up into the depressions in the first substrate.

Abstract: A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.

Abstract: The present invention is a chip scale package handling part and process manufacturing method that uses existing automated equipment to economically mass produce chip scale packages. The present invention includes a unitary substrate panel having a plurality of die attach areas thereon for forming chip scale packages. The substrate panel has indexing holes formed therein so that the substrate panel is capable of being indexed by lead frame handling equipment. The lead frame handling equipment indexes the substrate panel through chip scale package fabrication machinery, where the chip scale package fabrication machinery is compatible for indexing lead frames therethrough. Examples of the chip scale package fabrication machinery include die attach machinery and wire-bonders. Conductive contacts are attached to the bottom portion of the substrate panel and the substrate panel is singulated to form a plurality of separated chip scale packages. The chip scale packages are preferably encapsulated for protection.

Abstract: The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is_embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern. The present invention also provides the wiring board for electrical tests so fabricated.

Abstract: A method makes a magnetic head with a zero throat height (ZTH) comprising the steps of forming a first pole piece layer, forming the ZTH defining insulation layer on a first portion of the first pole piece layer, forming an insulation layer on the ZTH defining insulation layer and a first insulation layer on a second portion of the first pole piece layer, forming a coil layer on the first insulation layer so that the ZTH defining insulation layer is located entirely between the coil layer and the ABS, forming at least a second insulation layer on the coil layer, forming the second pole piece over a front portion of a top surface of the ZTH defining insulation layer and on the second insulation layer so that the ZTH defining insulation layer causes the second pole piece to separate from the first pole piece layer and forming the first insulation layer with a thickness that is less than a thickness of the ZTH defining insulation layer so that a pole tip portion of the second pole piece can be frame plated with

Abstract: A method makes a merged magnetic head that has an air bearing surface and read and write head portions wherein the write head portion has a pole tip, yoke and back gap regions. A method of making the write head comprises steps of forming first and second pole pieces wherein the first pole piece has a first pole tip and the second pole piece has a second pole tip, forming a gap layer which separates the pole tips in the pole tip region and connecting the first and second pole pieces in the back gap region, forming an insulation stack with a write coil embedded therein between the first and second pole pieces in the yoke region and forming the first pole tip with a width at the air bearing surface that defines a track width of the write head portion. The read head portion is formed on the write head portion with a first shield layer which is a common layer with the second pole piece.

Abstract: An adhesive tape dispenser for dispensing and cutting a length of an adhesive tape. The adhesive tape dispenser comprises an adhesive tape cutting device. The adhesive tape cutting device comprises a) a resting surface to which a tacky side of said adhesive tape can be adhered while the adhesive tape is being cut, b) two lateral webs extending in the same direction from both edges of the resting surface to serve as guides for the adhesive tape, and c) a cutting blade having a blade edge and positioned on an inner side of one or both lateral webs in such a way that the blade edge is inclined at an angle which is oblique relative to the resting surface. The lateral webs have a height from the resting surface which is the same or is higher than each cutting blade. The adhesive tape dispenser is useful to dispense and cut adhesive tapes comprising a backing of biaxially oriented or highly stretched film, such as polyolefin.

Abstract: A method of manufacturing a surface acoustic wave apparatus includes the steps of bump-bonding a surface acoustic wave element and a base member together through metal bumps having a melting point of about 450° C. or higher such that the surface acoustic wave apparatus is fixed in a face down configuration to a bottom surface of a recess of the base member; and bonding a cap member and the base member with a wax material by heating the cap member and the base member uniformly at a temperature higher than a melting point of the wax material to melt the wax material.

Abstract: A method of forming trimmable resistors, resistor ray be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: An inventive method of manufacturing precisely-compressed multi-layer stacks is presented. Two stacks are assembled. One stack, having a compression sensor between two layers, is then compressed with an initial compression force, and the signal from the sensor is measured. The other stack is then compressed with a force derived from the measurement.

Abstract: A process for the production of a device for measuring or detecting, particularly a probe or a detector, includes the steps of pre-mounting the different active components of the device, of which certain are ultimately gathered in functional subassemblies on and/or in a support body, then potting the pre-mounted resulting assembly, as well as its connection regions with a connection and/or supply cable, to form a substantially monoblock member and, finally, overmolding under pressure the potted member, as well as the proximal portion of the cable, with a thermoplastic material compatible with the resin used, to obtain an apparatus or instrument having the desired shape.

Abstract: An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.

Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length.

Abstract: The invention relates to a method for producing a microwave filter (700), comprising making at least one through-cutout (750) in a first electrically conductive plate (740) shaped as a rectangle, with a short side and a long side, inserting the first plate (740) between a second (710) and a third (730) electrically conductive plate (710), the first plate being arranged parallel to the second and the third plate, making electrical connections (794, 795) between said three plates for interconnecting those edge surfaces on the plates which coincide with the direction of propagation of the electrical signals, as a result of which a space comprising one or more cavities is formed. The first plate (740) is arranged so that the extent of its short side coincides with the E-field of the microwave signals when they propagate in the filter (700), and the extent of its long side coincides with the direction of propagation of the electrical signals.