Patents Examined by Minh Trinh
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Patent number: 6523251Abstract: Insulation removal equipment for exposing conductors of a flat cable, having a vacuum table, a table drive, a milling tool drive and an advancing drive which is arranged on a carriage and which moves the milling tool drive together with the milling tool on the carriage. The carriage is guided by guide rails arranged at a housing table. The housing table is carried by a housing, at which the table drive is also arranged. The advancing drive moves via a pinion along a rack arranged at the housing and executes the movement of the carriage. The height-adjustable vacuum table is controlled in dependence on the advancing drive and in dependence on the direction of a conductor to be exposed.Type: GrantFiled: February 7, 2001Date of Patent: February 25, 2003Assignee: Komax Holding AGInventors: Claudio Meisser, Alois Lustenberger
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Patent number: 6519842Abstract: Semiconductor devices can be mounted by the bump technique using compound metallic ultra-fine particles. Each particle comprises a core portion which is substantially a metallic component, with a coating layer chemically bound to the core portion, the coating layer being an organic substance. One of two bump technologies can be used to mount the semiconductor device, namely, forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals; or using paste balls comprising the compound metallic ultra-fine particles rather than ordinary solder balls.Type: GrantFiled: December 8, 2000Date of Patent: February 18, 2003Assignee: Ebara CorporationInventors: Akira Fukunaga, Hiroshi Nagasawa
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Patent number: 6519835Abstract: A semi-rigid heated element assembly and method of manufacturing semi-rigid heated element assemblies is provided. A heated element assembly includes a first thermoplastic sheet, a second thermoplastic sheet, and a resistance heating element laminated between the first and second thermoplastic sheets. The resistance heating element includes a supporting substrate having a first surface thereon and an electrical resistance heating material forming a predetermined circuit path having a pair of terminal end portions. The circuit path continues onto at least one flap portion that is capable of rotating about a first axis of rotation. The reformable continuous element structure may be formed into a final element assembly configuration whereby at least the flap portion is rotated along its axis of rotation to provide resistance heating in at least two planes. Semi-rigid heating elements may be formed into heated containers, heated bags, and other objects with complex heat planes.Type: GrantFiled: August 18, 2000Date of Patent: February 18, 2003Assignee: Watlow Polymer TechnologiesInventors: Theodore Von Arx, Keith Laken, John W. Schlesselman
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Patent number: 6519838Abstract: A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards.Type: GrantFiled: February 29, 2000Date of Patent: February 18, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Hiroshi Uchiyama, Hiroshi Furuya, Yoshihiro Mimura
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Patent number: 6513228Abstract: A method for forming a perpendicular magnetic read/write head having an air bearing surface and comprising a substantially planar top pole and a shared pole is disclosed. The steps include forming a top pole, a shared pole, and a yoke wherein the top pole and shared pole are connected distally from the air bearing surface by a yoke. A conductive coil is formed that wraps around the top pole and is positioned adjacent to the air bearing surface, with a lower portion of the coils extending between the top pole and the shared pole.Type: GrantFiled: September 21, 2000Date of Patent: February 4, 2003Assignee: Seagate Technology LLCInventors: Sakhrat Khizroev, Dmitri Litvinov, Billy Wayne Crue
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Patent number: 6510607Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: June 27, 2001Date of Patent: January 28, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
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Patent number: 6510603Abstract: A production method of a rotor in which a lower layer slot insulator is held at a slot insulator holding portion of a combining jig, a lower layer coil bar is inserted into a coil inserting path of the combining jig and is combined integrally with the lower layer slot insulator by being pushed by a first coil inserting arrow and thereafter, set to inside of a coil integrating path of a coil holding member. The coil holding member is attached to a coil inserting device along with an armature core. The lower layer slot insulator and a lower layer coil trunk are integrally inserted into a slot of the armature core by pushing the lower layer coil bar set to inside of the coil integrating path. The upper layer coil trunk and the lower layer coil trunk may be formed integrally with respective coil arms as a single coil bar.Type: GrantFiled: August 30, 2000Date of Patent: January 28, 2003Assignee: Denson CorporationInventors: Jiro Ebihara, Masayuki Takiguchi
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Patent number: 6507990Abstract: A system and method for manufacturing a stator is shown. An automated stator press is used to assemble a stator. The automated stator press includes a support frame, a control system, a sensor, and a hydraulic ram. Stator laminations are stacked onto a mandrel. The mandrel is placed in the support frame. A stator housing is placed over the mandrel. The hydraulic ram compresses the stator laminations in the stator housing. The control system receives compression information from the sensor, and operates the hydraulic ram based on stored process information and information received from the sensor. A stop is inserted in the stator housing to hold the stator laminations in a state of compression after removal of the hydraulic ram.Type: GrantFiled: March 31, 2000Date of Patent: January 21, 2003Assignee: Schlumberger Technology CorporationInventors: Richard J. Moreno, Donald C. Watson
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Patent number: 6505397Abstract: A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.Type: GrantFiled: June 19, 2000Date of Patent: January 14, 2003Assignee: Kabushiki Kaisha ShinkawaInventors: Tsutomu Mimata, Osamu Kakutani
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Patent number: 6502302Abstract: A fabrication method of an industrial part having high-aspect-ratio through-hole sections using a punch and a die, includes a first step of drilling a first hole section in a first sheet of sheet material with the above punch; a second step of lifting the above first sheet in tight contact with a stripper; a third step of lifting a tip section of the above punch so as to be slightly drawn in from a bottom section of the above lifted first sheet; a fourth step of drilling a second hole section in a second sheet of sheet material with the above punch; a fifth step of lifting the above second sheet in tight contact with the above first sheet; a sixth step of lifting the tip section of the above punch so as to be slightly drawn in from the bottom section of the above lifted second sheet, and, the subsequent steps of repeating the above fourth to sixth steps for lamination of a plurality of sheets of sheet material.Type: GrantFiled: January 26, 2001Date of Patent: January 7, 2003Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Hiroyuki Tsuji, Kazumasa Kitamura, Yoshinori Yamaguchi
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Patent number: 6502299Abstract: In order to realize thinned armatures, a winder which winds coils at a high density while restricting coil ends within a restricted space is provided. An armature coil winder for winding coils in an armature core assembly having a plurality of slots in an outer circumference thereof comprising a winding former equipped with a fixed former which guides a coil into two slots and a movable former which restricts a position of a coil end between the slots by moving in the fixed former along both end surfaces of an armature core toward a center thereof, a former slider which shifts the movable former to a specified position, and coil shaping mechanism which is disposed at location other than that of the former slider and equipped with coil shaping blades functioning to shape the coil in the slots, thereby making it possible to wind coils at a high density by effectively utilizing winding spaces.Type: GrantFiled: December 13, 1999Date of Patent: January 7, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akihiko Yamazaki, Manabu Okamoto, Kazuo Kimura
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Patent number: 6502298Abstract: Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings.Type: GrantFiled: January 18, 2000Date of Patent: January 7, 2003Assignee: Litton Systems, Inc.Inventors: Barry Kent Witherspoon, Larry Dean Vaught
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Patent number: 6499215Abstract: A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site to form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.Type: GrantFiled: June 29, 2000Date of Patent: December 31, 2002Assignee: International Business Machines CorporationInventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson
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Patent number: 6487771Abstract: Method for manufacturing speaker bottom yoke, including steps of: 1. calculating product weight according to required dimension; 2. cutting off a blank material with the calculated weight from steel bar (material bar), which blank material can be further planed; 3. performing first time forging to forge one end of the blank material into a stem section with reduced diameter, which stem section can be formed with a sink in accordance with the required shape of the bottom yoke; 4. performing second time forging to forge the other end of the blank material into a bottom disc with larger diameter; and 5. performing third time forging to further forge the bottom disc of the blank material into a predetermined dimension. In the above forging procedure, the diameter of the blank material is forged from large dimension into small dimension and the bottom disc is forged at two times into a specific dimension.Type: GrantFiled: May 9, 2000Date of Patent: December 3, 2002Inventor: Hui Chiu Lin
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Patent number: 6484392Abstract: A process of weaaving metal conductor wires to form a metal woven shielding conductor layer over the outer surface of an insulated cable. The insulated cable is accompanied with at least one solder or tin wire. When the at least one solder or tin wire is immersed in a molten metal plating solution, it melts down hence generating a spatial margin between the insulated cable and the metal woven shielding conductor layer. This prevents the insulated cable from biting with its outer surface into the metal woven shielding conductor layer when it is thermally expanded in the molten metal plating solution. As the metal woven shielding conductor layer is impregnated deeply with the molten metal, there are hardly any generated gaps and undulation on the surface of the metal plating layer. Accordingly the suppression of reflection and attenuation of a transmission signal will be improved.Type: GrantFiled: February 28, 2000Date of Patent: November 26, 2002Assignee: Totoku Electric Co., Ltd.Inventors: Yoichi Okada, Yasushi Ooshima
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Patent number: 6484389Abstract: An installation and support apparatus or assembly 18 is provided for use in combination with an electric machine 10, such as a starter-alternator, which is adapted to be operatively installed between the engine block 12 and the transmission assembly 16 of a vehicle. The apparatus 18 includes a stationary support member or member 20, an inner or crankshaft engaging bearing 22, and an outer or rotor engaging bearing 24. Member 20 cooperates with bearings 22 and 24 to automatically create or form a relatively precise and uniform gap 54 between the stator assembly 26 and the rotor assembly 30 of electric machine 10, and further provides independent and additional support to the electric machine 10 and the vehicle's crankshaft 14.Type: GrantFiled: December 20, 1999Date of Patent: November 26, 2002Assignee: Ford Global Technologies, Inc.Inventors: Michael Benjamin Levin, Ross Maxwell Stuntz
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Patent number: 6481073Abstract: In the manufacture of an ink jet print head which ejects ink from ink jet grooves through nozzles by applying voltage to walls of the ink jet grooves that are formed of a piezoelectric material so as to deform the walls, a plurality of ejection factors, such as a groove width, groove depth, width of partition walls, and a piezoelectric constant of the piezoelectric material, which influence ejection of the ink, are selected as a combination and controlled so that the ink is ejected from the print head in a desired ejection state. When the groove depth and groove width of the jet ink grooves, for example, are selected as the combination of the ejection factors, the groove depth is corrected or controlled according to the groove width. Accordingly, the tolerances or allowable ranges of the ejection factors can be increased when manufacturing actuator substrates capable of ejecting ink in a desired ejection state, with a result of an improved yield of print heads.Type: GrantFiled: August 13, 1998Date of Patent: November 19, 2002Assignee: Brother Kogyo Kabushiki KaishaInventor: Hiroto Sugahara
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Patent number: 6481094Abstract: A method of manufacturing a chip PTC thermistor utilizes a piece of conductive polymer having a PTC characteristic and metal foils formed by patterning and provided on the upper and the lower sides of the piece under pressure integrally into a sheet, making a hole part in the sheet, applying a protective coating serving as plating resist to upper and lower sides of the sheet, forming an electrode on the sheet by electroplating, and cutting the sheet into a chip. The protective coating is made of a material applicable at a temperature equal to or lower than the melting point of the conductive polymer. The processing temperatures at the step from the step of making a hole part in the sheet to the pre-processing step of the step of forming an electrode by electroplating on the sheet are not above the melting point of the conductive polymer.Type: GrantFiled: April 21, 2000Date of Patent: November 19, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takashi Ikeda, Kiyoshi Ikeuchi, Koichi Morimoto, Junji Kojima
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Patent number: 6477766Abstract: An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger tape interval and a second kind of the components have a smaller tape interval. The apparatus includes a pair of centering chucks having recesses for contacting both sides of the body of the component, and being movable in a symmetrical manner with respect to the center to adjust the body of the component from both sides of the main body while the recesses come in contact with both sides of the body of the component, thus resulting in centering of the component.Type: GrantFiled: January 31, 2001Date of Patent: November 12, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kiyoshi Imai, Hideaki Watanabe, Hiromi Kinoshita, Dai Yokoyama
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Patent number: 6460234Abstract: A micromachined pressure sensor is formed with a minimum number of masking and processing steps. The structure measures changes in pressure by deflection of structures having capacitive plates external to a sealed cavity so that electrical leads can be readily connected to the plates formed on the structures. The pressure sensor includes a substrate, a base secured to the substrate and a diaphragm secured to the base to define a sealed cavity. A skirt may extend outwardly from the base above the substrate to form one of the plates of the capacitor with another plate formed on the base. Changes in ambient pressure deflect the skirt toward or away from the electrode on the substrate, changing the effective capacitance between the electrodes. Electrical connections may be made to the electrode on the skirt and the electrode on the substrate utilizing electrical connectors which are external to the base and thus external to the sealed cavity.Type: GrantFiled: May 12, 2000Date of Patent: October 8, 2002Assignee: Wisconsin Alumni Research FoundationInventor: Yogesh B. Gianchandani