Abstract: A three-dimensional memory is formed as an array of memory elements that are formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines acting as local vertical bit lines through the multiple layers of planes which together with arrays of word lines on each plane are used to access the memory elements. The three-dimensional memory is formed over a CMOS substrate with an intermediate pillar select layer. The pillar select layer is formed with a plurality of pillar select devices which are switching transistors formed outside the CMOS and serve to switch selected rows of pillar lines to corresponding metal lines on the substrate.

Abstract: A nonvolatile memory device includes: a plurality of memory cells arranged in a region where word lines and bit lines intersect, a data read/write circuit including a plurality of latches configured to temporarily store data inputted from an external device, and configured to perform a program operation on the memory cells based on data stored in the latches, and a skip data control unit configured to determine whether data to be programmed into the memory cells are available, and to store program-inhibit data in a latch corresponding to a memory cell which is determined to not contain any data.

Abstract: A non-transitory computer readable medium, a flash controller and a method for state responsive encoding and programming; the method may include encoding an information entity by applying a state responsive encoding process to provide at least one codeword; wherein the state responsive encoding process is responsive to a state of flash memory cells; and programming the at least one codeword to at least one group of flash memory cells by applying a state responsive programming process that is responsive to the state, the state being either an estimated state or an actual state.

Abstract: The present disclosure provides a resistive-switching device capable of implementing multiary addition operation and a method for implementing multiary addition operation using the resistive-switching device. The resistive-switching device has a plurality of resistance values each corresponding to a respective data value stored by the resistive-switching device and ranging from a high resistance value to a low resistance value. The data value stored by the resistive-switching device is increased by ‘1’ successively with a series of set pulses having a same pulse width and a same voltage amplitude being applied thereto. The data value stored by the resistive-switching device is set to ‘0’ with a reset pulse being applied thereto, and meanwhile a data value stored by a higher-bit resistive-switching device is increased by ‘1’ with a set pulse being applied thereto. In this way, multiary addition operation is implemented.

Abstract: A microelectronic package includes a microelectronic element having memory storage array function overlying a first surface of a substrate, the microelectronic element having a plurality of contacts aligned with an aperture in the substrate. First terminals which are configured to carry all address signals transferred to the package can be exposed within a first region of a second substrate surface, the first region disposed between the aperture and a peripheral edge of the substrate. The first terminals may be configured to carry all command signals, bank address signals and command signals transferred to the package, the command signals being write enable, row address strobe, and column address strobe.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array including memory cells having a variable resistance element provided at intersections of crossing first and second lines, the memory cell array including third lines, fourth and fifth lines, and first and second diodes; and a control circuit which, when the memory cells include a selected memory cell, a selected first line connected to the selected memory cell and an unselected first line, and a selected second line connected to the selected memory cell and an unselected second line, supplies a first voltage to the selected first line, and supplies a second voltage to the unselected first line, and when the third lines include a selected third line electrically connected to the selected second line via one of the fourth line and a first diode, supplies a third voltage to the selected fourth line.

Abstract: A method of pinning magnetic domain walls in magnetic domain shift registers includes pinning the magnetic domain walls at a plurality of pinning sites in a nanowire, reducing an energy of the pinning of the magnetic domain walls and shifting the magnetic domain walls in the nanowire by applying a shift current in a control wire adjacent the nanowire.

Abstract: A semiconductor package is disclosed. The semiconductor package includes a package interface, a stack of semiconductor chips, a plurality of stacks of through substrate vias, and an interface circuit. The package interface includes at least a first pair of terminals. Each stack of through substrate vias includes plural through substrate vias of respective ones of the semiconductor chips, each through substrate via electrically connected to a through substrate via of an immediately adjacent semiconductor chip. The interface circuit includes an input connected to the first pair of terminals to receive a differential signal providing first information, and includes an output to provide an output signal including the first information in a single-ended signal format to at least one of the plurality of stacks of through substrate vias.

Abstract: An integrated circuit may include lines that traverse a cross-point array, the lines fabricated at a first pitch on a first layer, wherein the first pitch is sub-lithographic, and leads on a second layer, the leads having a second pitch that is twice as large as the first pitch. The lines may be routed outside of the array in alternating groups to opposite sides of the array where the lines couple to the leads.

Abstract: Disclosed is a semiconductor memory apparatus, including: a memory cell array configured to include a plurality of memory cells; a switching unit configured to be coupled to data input and output pads and control a data transfer path of data applied to the data input and output pads in response to a test mode signal; a write driver configured to drive data transferred from the switching unit and write the data in the memory cell array at a normal mode; and a controller configured to transfer the data from the switching unit to the memory cell at a test mode.

Abstract: A pipe latch control circuit and a semiconductor integrated circuit using the same are provided. The pipe latch control circuit includes a read command control unit that receives a first signal and generates a read signal in response to a control signal. In the pipe latch control circuit, the read command control unit selects, in response to the control signal, the first signal or selects a second signal obtained by delaying the first signal according to an internal clock, and generates the selected first or second signal as the read signal.

Abstract: Methods for programming select gates, memory devices, and memory systems are disclosed. In one such method for programming, a program inhibit voltage is transferred from a source to unselected bit lines. Bit line-to-bit line capacitance, between the unselected bit lines and selected bit lines to be program inhibited, boosts the bit line voltage of the selected, inhibited bit lines to a target inhibit voltage. In one embodiment, the voltage on the selected, inhibited bit line can be increased in a plurality of inhibit steps whereby either one, two, or all of the steps can be used during the programming of unprogrammed select gates.

Abstract: A non-volatile memory device includes a non-volatile memory cell array including a plurality of word lines, a voltage generator configured to generate a first high-voltage using a supply voltage and a second high-voltage using an external voltage which is higher than the supply voltage, and a word line selection circuit configured. The word line selection circuit is configured apply, during a program operation of the memory cell array, the first high-voltage to a selected word line among the plurality of word lines, and the second high-voltage to unselected word lines among the plurality of word lines.

Abstract: The present disclosure includes lifetime markers for memory devices. One or more embodiments include determining a read disturb value, a quantity of erase pulses, and/or a quantity of soft program pulses associated with a number of memory cells, and providing an indicator of an advance and/or retreat of the read disturb value, the quantity of erase pulses, and/or the quantity of soft program pulses relative to a lifetime marker associated with the memory cells.

Abstract: A method of programming a nonvolatile memory includes: applying a common program pulse to program cells within each page of a memory region including two or more pages; applying one or more different program pulses to the program cells within each page of the memory region, according to target threshold voltages of the program cells; and programming each page of the memory region such that the program cells have their own target threshold voltages.

Abstract: A method for programming a non-volatile memory cell is described. The memory cell includes a substrate, a gate over the substrate, a charge-trapping structure at least between the substrate and the gate, and first and second S/D regions in the substrate beside the gate. The method includes performing a channel-initiated secondary electron (CHISEL) injection process to inject electrons to the charge-trapping structure.

Abstract: Described herein are embodiments of selectively setting a memory command clock as a memory buffer reference clock. An apparatus configured for setting a memory command clock as a memory buffer reference clock may include a memory buffer configured to interface between a host and memory, and reference clock selection logic configured to selectively set a memory command clock as a memory buffer reference clock. Other embodiments may be described and/or claimed.

Abstract: A storage apparatus writes data to a storage drive or reads data from a storage drive in response to an I/O request sent from a server. The storage apparatus includes a plurality of AC-DC power supplies supplying the storage drive with drive power is provided with a plurality of power supply paths provided for the respective AC-DC power supplies. A plurality of gate units are provided to the respective power supply paths and configured to stop supplying drive power to the storage drive through the corresponding power supply path when detecting voltage abnormality in the drive power supplied from the AC-DC power supply to the storage drive. The power supply paths allow each of the storage drives belonging to a same RAID group to receive the supply of the drive power from the AC-DC power supplies through different power supply paths, respectively.

Abstract: A three-dimensional memory is formed as an array of memory elements that are formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines acting as local vertical bit lines through the multiple layers of planes which together with arrays of word lines on each plane are used to access the memory elements. The three-dimensional memory is formed over a CMOS substrate with an intermediate pillar select layer. The pillar select layer is formed with a plurality of pillar select devices which are switching transistors formed outside the CMOS and serve to switch selected rows of pillar lines to corresponding metal lines on the substrate.

Abstract: A memory system includes: a controller configured to provide a hidden auto refresh command; and a memory configured to perform a refresh operation in response to the hidden auto refresh command. The controller and the memory communicate with each other so that each refresh address of the controller and the memory has the same value as each other.