Abstract: The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: An isocyanate-modified epoxy-functional polyester is prepared by the reaction of an epihalohydrin in the presence of a base with a carboxyl-functional polyester resin (II) obtained by reacting (a) at least one aromatic or (cyclo)aliphatic dicarboxylic acid A having aromatic or secondary carboxyl groups, or the anhydride thereof, (b) at least one diol B having primary or secondary hydroxyl groups, (c) compound C1 having one monofunctional primary or secondary hydroxyl group and/or at least one compound C2 having one primary or secondary hydroxyl group and one tertiary aliphatic carboxyl group, and, optionally, (d) a dihydroxymonocarboxylic acid having a tertiary aliphatic carboxyl group and two aliphatic hydroxyl groups, and/or (e) a trihydroxyalkane (E1) or tetrahydroxyalkane (E2), to produce an epoxy-functional polyester whose terminal hydroxyl groups are reacted with an isocyanate.

Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent or and an amine promoter.

Abstract: The present invention provides a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 5 to 25 parts by weight of an alkylphenol-formaldehyde resin and 0.1 to 5 parts by weight of a hydrazide compound, or 5 to 25 parts by weight of an alkylphenol-formaldehyde resin, 0.1 to 5 parts by weight of a hydrazide compound and 0.3 to 10 parts by weight of an epoxy compound. According to this method, a crosslinked rubber product of high hardness can be obtained without using any halogen compound or increasing the amount of carbon black used.

Abstract: A catalytic tin carboxylate adduct, which is useful as a catalyst in epoxy-acid coating compositions, is the reaction product of (A) a mono-, di-, or poly-carboxylic acid functional compound and (B) an organotin compound containing one to three aryl groups and at least one halogen or hydroxyl group attached to the tin atom. There is also provided an epoxy-acid coating composition, which incorporates this catalytic tin carboxylate adduct. The epoxy-acid coating composition is advantageous as an automotive topcoat, particularly as a clear coat composition because it exhibits good appearance, durability, stability and generates no, or extremely low levels of benzene during the curing process.

Abstract: A crosslinkble waterborne dispersion useful as a coating on metal substrates of an epoxidized polydiene block polymer composition which comprises: (a) 10 to 65% by weight of a polydiene block polymer containing at least five olefinic epoxy groups per molecule which are sterically hindered, (b) 0.2 to 25% by weight of a compatible aminoplast, (c) 0.1 to 10% by weight of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. A water-continuous process and an inversion process for making a dispersion are also described.

Abstract: Compounds of general formula (1) are described: wherein ═W— is (1) ═C(Y)— where Y is a halogen atom, or an alkyl or —XRa group where X is —O—, —S(O)m— [where m is zero or an integer of value 1 or 2], or —N(Rb)— [where Rb is a hydrogen atom or an optionally substituted alkyl group] and Ra is a hydrogen atom or an optionally substituted alkyl group or, (2) ═N—; L is (1) a —C(R)═C(R1)(R2) or [—CH(R)]nCH(R1)(R2) group; is (2) a —(Xa)nAlk′Ar′, or Alk′XaAr′ group; or is (3) XaR1; Z is a group (A), (B), (C) or (D):  wherein Ar is a monocyclic or bicyclic aryl group optionally containing one or more heteroatoms selected from oxygen, sulphur or nitrogen atoms; Z1is a group —NR12C(O)— [where R12 is a hydrogen atom or an optionally substituted alkyl or (Alk)tAr group], —C(O)NR12—, —NR12

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A shaped article optionally containing a prepreg, or a composite derived from the shaped article with the prepreg, is prepared from a curable composition derived from the reaction in the presence of a catalyst of epoxy resin having at least 0.05% by weight of an epoxy resin oligomer with a solid rubber possessing at least 1% by weight of reactive groups and which is swellable or soluble in the reaction mixture, in a rubber epoxy resin weight ratio between 1:1 to 1:20, wherein said epoxy resin comprises (a) at least one first epoxy resin having an epoxy functionality of greater than three and (b) at least one second epoxy resin having a functionality of greater than one to three.

Abstract: A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones and at least one epoxy resin modified by at least one aromatic polyamine. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition.

Abstract: The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 &mgr;m-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.

Abstract: The invention relates to a process for preparing a binder for electrodeposition coating compositions comprising providing: (A) from 1 to 99.9% by weight of an epoxy resin and (B) from 0.1 to 99.% by weight of a copolymer of vinyl acetate and at least one further component selected from the group vinyl alcohol, alkyl-vinyl acetal and ethylene, characterized in that components (A) and (B) of the binder are mixed intensively in a solvent or in the melt before being used in the coating composition, preferably in the presence of epoxy ring-opening catalysts.

Abstract: Process for the preparation of compounds of the formula wherein Hal represents chlorine, bromine or iodine and preferably chlorine, wherein Ra represents hydrogen or a residue comprising one or more additional groups of the formula, from compounds wherein R2 represents hydrogen or a residue comprising one or more additional groups of the formula by reaction with gaseous hydrogen halide in the presence of a catalytic amount of an organic acid; process for the preparation of epoxy compounds starting from the reaction to produce a compound of formula (III) which is converted to a compound of formula (A) that is dehydrohalogenated to form the epoxy rings of a diepoxy compound.

Abstract: Coating compositions which comprise: (i) a hydroxy-functional compound containing in the molecule an average of at least two hydroxyl groups; (ii) an anhydride-functional compound containing in the molecule an average of at least two cyclic carboxylic acid anhydride groups; and (iii) an epoxy-functional compound containing in the molecule an average of at least two cycloaliphatic epoxy groups, provide low temperature cure response and excellent durability.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, an organobis(N-dialkylurea) hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency errosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.

Abstract: An epoxy compound formula (1), and a hydrogenation process for preparing thereof; wherein R1 to R4 each represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; n represents an integer of 0 to 6; and Z1 and Z2 each represent a phenyl group substituted or unsubstituted by one or more alkyl groups or a cyclohexyl group substituted or unsubstituted by one or more alkyl groups.

Abstract: A curable powder coating composition comprises (a) a copolymer produced from ai) 5 to 10 wt % of a C1 to C4 alkyl diester of an ethylenically unsaturated dicarboxylic acid, aii) 10 to 45 wt % of a glycidylester of an ethylenically unsaturated carboxylic acid, aiii) 10 to 35 wt % of an alkenyl ester of a branched tertiary carboxylic acid wherein the acid moiety contains nine carbon atoms, and aiv) 0 to 45 wt % of a C1 to C12 alkyl ester of an ethylenically unsaturated carboxylic acid having from 3 to 4 carbon atoms in the acid moiety, the percentages of ai) to av) are relative to the total weight of the polymer adding up to 100%; and (b) a blend comprising (bi) C4 to C16 (cyclo)aliphatic dicarboxylic acid and (bii) a polyester resin having an acid value of from 4500 to 4900 mmole/kg produced from a C5 to C12 branched polyhydroxyalkane and a C4 to C16 (cyclo)aliphatic dicarboxylic acid or anhydride in a polyhydroxyalkane:dicarboxylic acid molar ratio of from 0.2:1 to 0.

Abstract: The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.

Abstract: In a process for the production of a flame-resistant, pourable, latently reactive, phenolically curable epoxy resin molding material for the encapsulating of electronic components, a latently reactive prepolymer epoxy resin mixture in powder form which is free of isocyanate groups is produced at reaction temperatures up to 200° C. from a thermally polymerizable, filler-containing reaction resin mixture of polyepoxy resin consisting of a mixture of bi-functional and multi-functional epoxy resins and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of >1:1 with a substituted imidazole as reaction accelerator in a concentration of 0.5 to 2.5% by weight, relative to polyepoxy resin, and the prepolymer epoxy resin mixture is mixed with a powdered filler-containing phenolic resin mixture in a molar ratio of the epoxy groups to the phenolic hydroxyl groups of 1:0.4 to 1:1.1.