Patents Examined by Robert E. L. Sellers
  • Blends of a poly(amide imide) and a poly(aryl ether ketone)
    Patent number: 5079308
    Abstract: Described are blends of a poly(amide imide) and a poly(aryl ether ketone) and, optionally, a poly(arylene sulfide). Three blends exhibit improved solvent resistance and hydrolytic stability.
    Type: Grant
    Filed: April 27, 1990
    Date of Patent: January 7, 1992
    Assignee: Amoco Corporation
    Inventors: James E. Harris, John P. Gavula
  • Epoxy resin/imidazole/polyphenol adduct as epoxy curing agent
    Patent number: 5077355
    Abstract: A powder coating composition is disclosed which includes an epoxy resin which is solid at room temperature, and a curing agent, characterized in that the curing agent includes an adduct obtained by reaction of (a) a polyfunctional epoxy resin, (b) an imidazole compound having a secondary amino group in the imidazole ring thereof and (c) a polyhydric phenol.
    Type: Grant
    Filed: February 26, 1990
    Date of Patent: December 31, 1991
    Assignee: Somar Corporation
    Inventors: Rihei Nagase, Akira Yasuda, Masao Kawashima
  • Bisphenol and neopentyl glycol diglycidyl ethers with glycidyl methacrylate copolymer
    Patent number: 5075356
    Abstract: A resin composition especially suited to the resin transfer molding and wet filament winding processes is composed of epoxide compounds and one or more aromatic amine hardeners wherein the blend of epoxide compounds is (i) a diglycidyl ether of the reaction product of a bisphenol and a blend of (a) a diglycidyl ether of bisphenol A other than that of (i) and (b) a halohydrin having about two epoxy groups per molecule, (ii) a copolymer of ethyl hexyl acrylate and glycidyl methacrylate and (iii) a neopentyl glycol digylcidyl ether. This composition has a low viscosity, and when cured, exhibits high toughness and mechanical strengths useful in making high performance composites.
    Type: Grant
    Filed: November 15, 1990
    Date of Patent: December 24, 1991
    Assignee: Hercules Incorporated
    Inventors: David A. Crosby, Kenneth A. Lowe
  • Coating of an epoxy resin, fluorocarbon polymer fluorinated curing agent
    Patent number: 5075378
    Abstract: A multifunctional coating composition comprising a fluorocarbon polymer, an epoxy resin and a fluorinated curing agent resulting in a fluorinated epoxy resin network with improved properties of corrosion resistance and hydrophobicity.
    Type: Grant
    Filed: June 24, 1987
    Date of Patent: December 24, 1991
    Assignee: The Standard Oil Company
    Inventors: Richard C. Smierciak, Paul J. Giordano
  • Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether
    Patent number: 5073605
    Abstract: Upstaged compositions are prepared by the reaction in the presence of a triarylphosphine catalyst between at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol. They may be used for the preparation of resinous blends with polyphenylene ethers, which, in combination with further components, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
    Type: Grant
    Filed: February 26, 1990
    Date of Patent: December 17, 1991
    Assignee: General Electric Company
    Inventors: John E. Hallgren, Victoria J. Eddy
  • Modified polypropylene power suspended in film-forming resin
    Patent number: 5073594
    Abstract: Primer compositions are disclosed which are a homogeneous, fluid, uncured suspension of discrete particles of a polar group-containing modified propylene polymer (MPP) in a film forming resin material, the particles having an average particle size of less than about 5 microns, and the primer composition being substantially free, i.e., containing less than about 5%, of a solvent for the MPP based upon the weight of said MPP. The preferred MPP is maleic anhydride polypropylene. The preferred film forming resin material is an epoxy resin. The particles of MPP are present in the primer in an amount of at least about 3%, preferably at least 40%, by weight based on the weight of the nonvolatile content of the primer.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: December 17, 1991
    Assignee: Morton International, Inc.
    Inventor: Richard L. Brook
  • Thermoplastic hot melt adhesive containing epoxy adduct
    Patent number: 5071914
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: August 17, 1989
    Date of Patent: December 10, 1991
    Assignee: H. B. Fuller Company
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson
  • Composition of maleimide and aromatic-double bond epoxy resin
    Patent number: 5070154
    Abstract: A thermosetting resin composition comprising a maleimide compound having in the molecule thereof, at least one N-substituted maleimide group and an epoxy resin having a double bond conjugated with an aromatic ring is easily workable and which yields cured products having improved heat resistance.
    Type: Grant
    Filed: September 11, 1990
    Date of Patent: December 3, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Hisashi Simizu
  • Fluorine-containing epoxy (meth) acrylate resin with photoinitiator
    Patent number: 5068261
    Abstract: The fluorine-containing epoxy(meth)acrylate resin of the invention is represented by the following general formula (I). ##STR1## wherein R.sub.f is selected from the group consisting of --.phi.--C(CF.sub.3).sub.2 --.phi.-- ##STR2## --C(CF.sub.3).sub.2 --.phi.'--C(CF.sub.3).sub.2 -- ##STR3## and --CH.sub.2 (CF.sub.2).sub.6 CH.sub.2 --; n is zero or a positive integer; and X is hydrogen or methyl group.The resin of the invention may be prepared by reacting a diglycidyl ether of a fluorine-containing hydrocarbon (R.sub.f) with acrylic acid or methacrylic acid. Further provided is an adhesive composition comprising the aforementioned fluorine-containing epoxy(meth)acrylate resin and a photo polymerization initiator, which can be cured at room temperature within a short time by irradiation with an UV ray to form a cured product having a refractive index n.sub.d.sup.20 ranging from 1.434 to 1.532.
    Type: Grant
    Filed: April 3, 1989
    Date of Patent: November 26, 1991
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Tohru Maruno, Shigeki Ishibashi, Kouzaburou Nakamura
  • Molding compositions of resole phenolic resin and epoxy resin
    Patent number: 5066693
    Abstract: Phenolic molding compositions, particularly useful as sheet molding compositions comprise: 1) a resole phenole resin, 2) a thickening agent selected from the group consisting of alkaline earth metal oxides or hydroxides and silanes, 3) a filler selected from the group consisting of clay, talc, and mixtures thereof, and 4) an epoxy resin.
    Type: Grant
    Filed: February 12, 1990
    Date of Patent: November 19, 1991
    Assignee: Occidental Chemical Corporation
    Inventor: Manoj K. Gupta
  • Cationic diphenol advanced epoxy resins with diglycidylether of aliphatic diol
    Patent number: 5064880
    Abstract: A method for preparing an advanced epoxy cationic resin from an epoxy-based resin containing oxirane groups by converting at least some of the oxirane groups to cationic groups is improved by using as the epoxy-based resin a blend of (I) an epoxy-based resin obtained by reacting in the presence of a suitable catalyst (1) a diglycidylether of an aliphatic diol which diol is essentially free of ether oxygen atoms, such as a condensation product of 1,4-butanediol and epichlorohydrin, optionally (2) a diglycidylether of a dihydric phenol, for example a diglycidyl ether of bisphenol A, (3) a dihydric phenol such as bisphenol A, and optionally (4) a capping agent such as p-nonylphenol and (II) a different cationic epoxy-based resin. Such resin blends can be utilized in cathodic electrodeposition coating systems.
    Type: Grant
    Filed: September 8, 1989
    Date of Patent: November 12, 1991
    Assignee: The Dow Chemical Company
    Inventors: Nancy A. Rao, Richard A. Hickner
  • Hot melt adhesive of hydroxyl-functional ethylene-vinyl acetate and blocked polyisocyanate
    Patent number: 5064902
    Abstract: A composition for a cross-linkable hot melt adhesive is provided and is formed by an ethylene-vinyl acetate copolymer containing primary hydroxyl functions and a blocked polyisocyanate. This composition when associated with a tackifying resin which can also serve as blocking agent of the polyisocyanate, is a cross-linkable hot melt adhesive. The adhesive is used at a temperature at least equal to splitting temperature of the isocyanate functions of the polyisocyanate. The temperature at which such adhesives retain adherence can reach about 200.degree.-220.degree. C.
    Type: Grant
    Filed: December 22, 1989
    Date of Patent: November 12, 1991
    Assignee: Atochem
    Inventors: Jacques Boutillier, Noelle Forichon, Yves Lermat
  • Oxygen-permeable article of fluorinated hydrocarbon group-grafted (meth)acrylate polymers
    Patent number: 5057585
    Abstract: Hydrophilic gelled crosslinked polymers comprising as an essential constituent monomer component a (meth)acrylate ester monomer having a fluorine-substituted hydrocarbon group containing at least three fluorine atoms grafted thereto. The fluorine-containing polymers have excellent oxygen permeability, water swellability, wearing comfort and contamination resistance.
    Type: Grant
    Filed: July 19, 1990
    Date of Patent: October 15, 1991
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Tokinori Agou, Takeshi Sakashita, Tomoaki Shimoda, Masaru Sudo, Masahiro Kuwabara, Masahide Tanaka
  • Epoxy resin-modified polyamide resin
    Patent number: 5055530
    Abstract: The present invention discloses a curable coating composition characterized in that the composition comprises as a vehicle component a nitrogen-containing resin modified with an epoxy resin and obtained by subjecting to a condensation reaction a polybasic acid compound and an amine compound having at least two active hydrogen atoms in the molecule on the average which atoms are reactive with the carboxyl group of the polybasic acid compound, without or along with a polyhydric alcohol and/or a fatty acid, and modifying the resulting nitrogen-containing resin with the epoxy resin.
    Type: Grant
    Filed: July 12, 1989
    Date of Patent: October 8, 1991
    Assignee: Kansai Paint Company Limited
    Inventor: Hiroshi Inoue
  • Polymer-modified vinylized epoxy resins
    Patent number: 5055532
    Abstract: Vinylized epoxy resins, such as vinyl ester resins, comprise polymerizable ethylenic unsaturation and an in situ polymerized polymer, such as a polyalkyl acrylate. The vinylized epoxy resins can form stable dispersions and are useful in thermoset applications.
    Type: Grant
    Filed: July 6, 1987
    Date of Patent: October 8, 1991
    Assignee: The Dow Chemical Company
    Inventors: Dwight K. Hoffman, Virginia B. Messick, Michael G. Stevens
  • Polyol-modified polyanhydride curing agent for polyepoxide powder coatings
    Patent number: 5055524
    Abstract: There is disclosed herein an improved thermosetting powder coating composition comprising an epoxy resin and a curing agent, the improvement comprising the curing agent which is a polyol-modified polymeric polyanhydride containing anhydride linkages in the polymeric backbone.
    Type: Grant
    Filed: July 16, 1987
    Date of Patent: October 8, 1991
    Assignee: PPG Industries, Inc.
    Inventors: Paul H. Pettit, Jr., Debra L. Singer, William S. Ewing
  • Epoxy polyurethane polyureas from epoxy resin, blocked isocyanate prepolymer and polyetherpolyamine
    Patent number: 5053465
    Abstract: An epoxy polyurethane.polyurea product having improved impact properties is formed by reacting a curing amount of a polyetherpolyamine such as, for example, an amine terminated ethylene glycol with blends of epoxy resins combined with small amounts of blocked polyoxypropylene polyol/isocyanate.prepolymer. The products of the instant invention exhibit improvements over similar blends cured with other amine curing agents which result in brittle products.
    Type: Grant
    Filed: May 12, 1989
    Date of Patent: October 1, 1991
    Assignee: Texaco Chemical Company
    Inventor: Harold G. Waddill
  • Epoxy-acrylic graft polymers
    Patent number: 5051470
    Abstract: Phenoxy terminated epoxy resins are grafted by carbon-carbon graft with ethylenic monomers, including alkylol acrylamide monomer, by in-situ polymerization to produce grafted epoxy-acrylic copolymers useful as binders in protective coatings. The cured paint films exhibit superior resistance to pine oil and limonene derivatives.
    Type: Grant
    Filed: October 5, 1987
    Date of Patent: September 24, 1991
    Assignee: The Glidden Company
    Inventors: James T. K. Woo, Richard M. Marcinko
  • Substrate coated with a basecoat and/or a clearcoat of an acid-functional compound, an anhydride-functional compound, an epoxy-functional compound and a hydroxy-functional compound
    Patent number: 5043220
    Abstract: A substrate coated with a basecoat of a pigmented film-forming polymer and a clearcoat applied to the basecoat of a film-forming polymer wherein the clearcoat and/or the basecoat is a curable composition comprising(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhydride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; and(iv) a hydroxy-functional compound having an average of at least two hydroxyl groups per molecule;wherein at least one of the compounds (i), (ii), (iii) or (iv) comprises a film forming polymer.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: August 27, 1991
    Assignee: The Sherwin-Williams Company
    Inventors: Mohamad D. Shalati, James A. Marquart, Sandra H. Angelo, Rodney M. Harris
  • Epoxy resin reacted with primary amine, active hydrogen compound and esterifying agent to yield polyol resin
    Patent number: 5043387
    Abstract: There is provided a process for preparing a novel polyol resin which does not substantially contain epoxy group wherein a bisphenol type epoxy resin (a) is subjected to the following steps (i), (ii) or (i), (iii) and (ii) in an optional sequence:(i) the step wherein epoxy group is reacted with a compound having one active hydrogen in its molecule (c), and(ii) the step wherein secondary hydroxyl group is at least partly esterified.(iii) the step wherein epoxy group is reacted with primary amine (b).
    Type: Grant
    Filed: April 4, 1989
    Date of Patent: August 27, 1991
    Assignees: Mitsui Petrochemical Industries, Ltd., Ricoh Company, Ltd.
    Inventors: Hideo Nakamura, Masaru Wakizaka, Yohzoh Yamamoto