Abstract: Heat sensitive substrates, as well as others such as metal or glass, are electrostatically coated with a thermosetting coating powder comprising a melt-mixed, chilled, chipped, and powdered blend of an epoxy resin and a catalyst therefore, and a polyamine as a powdered low temperature curing agent along with a scavenger which will react secondarily with residual polyamine domains that do not contact the base epoxy resin during curing. The coating powder is deposited on the substrate and heated to fuse, flow and cure. The mixture of resin and catalyst does not cure within the extruder but it is made to cure at low temperatures on the desired substrate by the separate addition of the curing agent to the powdered melt-mixed blend.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bonds.

Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract: The combination of powder coatings usable in a coating method comprising mixing two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogeneous hue. A powder coating composition comprising two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogeneous hue. A coating method comprising the steps of (a) applying to a substrate two or more powder coatings, of which each color is different; (b) heating to fuse with each other each of the two or more powder coatings applied in step (a); and (c) curing the resulting fused product in step (b), to give a coating film having a homogeneous hue.

Abstract: A water-dilutable coating after base neutralization comprises a polyhydroxyl-functional resin including a condensation resin such as a polyester or alkyd resin, and/or a polyhydroxyl-functional addition resin such as an acrylate resin or the reaction product of a carboxyl-functional acrylate resin and a hydroxyl-functional acrylate resin, and/or an emulsion copolymer, an at least partially monoalcohol-etherified amino resin, and a strong organic or inorganic acid crosslinking catalyst non-ionically blocked with a monoepoxide, a diepoxide or a lactone.

Abstract: A method of thickening a resin comprises blending (1) a resin containing active hydrogens, such as an unsaturated polyester (2) a polycarbodiimide, and (3) an organic diluent to form a reactive mixture; and reacting the resin containing active hydrogens and the polycarbodiimide such that the resin and polycarbodiimide become chemically bound.

Abstract: An adhesive resin composition for extrusion lamination comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

Abstract: Linear, tertiary carboxyl functional polyester resins are obtained by reaction of (a) at least one 1,4-dicarboxylcyclohexane (A), optionally mixed with a minor weight fraction of an alkane dicarboxylic acid containing in the range of from 8 to 16 carbons atoms (A′), (b) at least one dihydroxymonocarboxylic acid compound (B) containing a tertiary aliphatic carboxyl group and two aliphatic hydroxyl groups, (c) optionally, one diol compound (C) containing two aliphatic hydroxyl groups, each independently being a primary or a secondary hydroxyl group, and (d) optionally, a compound (D′) containing one monofunctional primary or secondary hydroxyl group and/or a compound (D″) containing one primary or secondary hydroxyl group and one tertiary aliphatic carboxyl group, the molar ratio of the compounds (A+A′):B:C:D′:D″ being X+Y+1:Y:X:M:N wherein M+N is in the range of from 0 to 2, wherein X ranges from 2 to 8, and Y ranges from [2−(M+N)&rsq

Abstract: Epoxy resin mixtures suitable for producing halogen-free flame-retardant composites by the injection process comprise the following components: (A) a phosphorus-free aliphatic and/or aromatic and/or heterocyclic epoxy resin; (B) an epoxide group-containing phosphorus compound; (C) a phosphorus-modified epoxy resin with an epoxide value of from 0.02 to 1 mol/100 g, obtained by reacting polyepoxy compounds having at least two epoxide groups per molecule with phosphinic anhydrides and/or phosphonic anhydrides or with phosphonic monoesters, followed by thermal elimination of alcohol; and (D) as hardener, at least one primary or secondary aliphatic polyamine with NH and/or NH2 groups.

Abstract: The invention is directed to a process for preparing a Class-A surface, fiber reinforced molded article. The process broadly requires the use of two separate fiber surfacing veils with a fiber reinforcement sandwiched therebetween. A polyurethane reaction system is injected into the mold. The system requires the presence of specified hindered amines.

Abstract: A method for the preparation of a succinimide copolymer by the catalytic co-polymerization of aspartic acid with a selected polyfunctional monomer in the presence of a cyclic carbonate solvent. Succinimide copolymers of relatively high weight average molecular weight and high purity can be produced in relatively high yields while employing a relatively low catalyst loading.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: An epoxy resin composition comprises (A) a biphenyl epoxy resin, (B) a phenolic resin curing agent having a naphthalene structure, (C) a curing accelerator comprising an addition product of a triphenylphosphine and benzoquinone, and (D) an inorganic filler contained in an amount of 85 to 95% by weight based on the total amount of the composition, and a semiconductor device encapsulated by this resin composition.

Abstract: The present invention relates to thermosetting resin compositions comprising (a) a first vinyl ester resin synthesized from the diglycidyl ether of bisphenol A, bisphenol A and glacial methacrylic acid, in from about 1% to about 95% by weight of the total composition; (b) a resin selected from the group consisting of (1) a second different vinyl ester synthesized from the diglycidyl ether of bisphenol A with glacial methacrylic acid, and (2) an unsaturated polyester, in from about 1% to about 69% by weight of the total composition; and electrical laminates made therefrom which further comprise a catalyst in from about 0.1% to about 2% by weight of the total composition and which may or may not be clad with an electrical conductive layer on at least one side; and a method of producing these.

Abstract: A vinyl ester resin derived from the reaction of about equivalent amounts of an unsaturated monocarboxylic acid and a polyepoxide is stabilized with from 0.01 to 5 weight percent of maleic acid and/or maleic anhydride.

Abstract: A thermosetting powder coating composition according to the present invention comprises as binder a co-reactable particulate mixture of a carboxylic acid-functional polyester component and a curing agent having groups reactive with carboxylic acid groups, characterized in that the carboxylic acid-functional component comprises a semi-crystalline polyester having an acid value of from 10 to 70 mg KOH/g and a hydroxy value of no more than 11 mg KOH/g. Generally the semi-crystalline polyester has one or more Tg values less than 55° C., a sharp melting point of 50 to 200° C. and preferably a number average molecular weight of at least 1600. The composition may, if desired, include an amorphous polyester and the curing agent may be, for example, an epoxy resin or a bis(beta-hydroxyalkylamide).

Abstract: Disclosed are epoxides prepared by reacting a p-hydroxystyrene polymer and epichlorohydrin in the presence of one or more alkali agents. Also disclosed are epoxy agents prepared from reacting a p-hydroxystyrene polymer and one or more di-hydric phenol agents with epichlorohydrin in the presence of alkali. These new epoxide resins have a low melt viscosity and when cured exhibit glass transition temperatures above 300° C.

Abstract: An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.

Abstract: Curable mixtures comprising a) an epoxy resin having more than one 1,2-epoxy group per molecule and b) as curing catalyst, an imidazole compound of formula I wherein R1, R2 and R3 are each independently of the others a hydrogen atom, a halogen atom, alkyl having from 1 to 20 carbon atoms, alkoxy having from 1 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms, or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, and R4 is alkyl having from 1 to 20 carbon atoms, alkenyl having from 2 to 20 carbon atoms, alkynyl having from 2 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, are suitable for the manufacture of moulding compounds and coatings, especially for the manufac

Abstract: A curable composition having an epoxy component and an organosilane component. The epoxy component includes at least one epoxy compound having two or more epoxide functional groups. The organosilane component includes at least one organosilane compound having two or more silyl ether groups. An exemplary organosilane compound is a siloxane-modified polyol.