Abstract: The invention relates to three-layer metal pipe coating compositions based on a powder primer, on a thermoplastic hard adhesive and on a polyolefin cladding. The powder primer contains epoxidized novolak resins, phenolic crosslinking agents and fillers based on crystalline silicic acid modifications. The invention likewise relates to a process for the exterior coating of metal pipes by a three-layer method, in which the powder primer described is applied to the metal pipe, a thermoplastic hard adhesive is applied to the powder primer, and subsequently a polyolefin cladding is applied.

Abstract: Coating compositions comprised of (a) a carboxyl functional adduct which is the reaction product of (i) a compound, polymer or oligomer containing pendant and/or terminal hydroxyl or epoxy functional groups and (ii) tartaric acid, malic acid, adipic acid, succinic acid, or anhydrides of said acids; and an anhydride curing agent are disclosed. The coating compositions have accelerated tack-free times and enhanced adhesion to zinc-coated steel and cold rolled steel without the use of a chrome containing wash primer.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: The present invention relates to a modified crosslinkable resin and a composite coating composition or system employing the resin. More particularly, the resin comprises an ethylenically unsaturated monomer or copolymer and para-hydroxybenzoic acid or substituted para-hydroxybenzoic acid, the reaction product thereof subsequently being reacted with a crosslinking agent gives rise to a composition including an ether linkage with a carbon-carbon site ortho to the phenolic hydroxy group.

Abstract: The invention provides a water-degradable polyolefin-containing film having greater than about 55 weight percent of a polyolefin and less than about 45 weight percent of poly(ethylene oxide) of weight average molecular weight of less than about 100,000. Preferably, the polyolefin is low density polyethylene. The polyolefin-containing film, when immersed in water for about 30 seconds, loses at least 10% in two or more of the tensile properties: percent strain-to-break, peak stress, energy-to-break and modulus when compared to the dry or pre-immersion values.Also provided are flushable personal care articles such as infant diapers, feminine hygiene napkins, and adult incontinence garments having a backing or barrier layer comprising a water degradable polyolefin-containing film of the invention.

Abstract: The present invention related to a process for the treatment of vinyl aromatic/conjugated diene block copolymers. More particularly, the present invention relates to a process for the treatment of such copolymers obtained starting from a (co)polymerization-initiating stage performed by means of alkaline based catalysts (Me), deactivated in such a way that they show a termination of the alkali metal-alcoholate type (--O--Me), and treated with a cyclic anhydride of polycarboxylic acid, and optically a C.sub.2 -C.sub.4 monocarboxylic acid.

Abstract: A composition comprising a water-soluble cationic group-containing high-molecular compound (P1) derived from the reaction of (A) epichlorohydrin and a dialkyl or dialkanol amine, or (B) a glycidyl group-terminated hydrophilic oligomer and a diamine, dialkylamine or dialkanolamine; optionally, a high-molecular compound (P2) having a condensable functional group in a side chain such as alkylolacrylamide-bearing high-molecular compound (E) or hydrolyzable trialkylsilyl group-containing acrylic ester high-molecular compound (F); and a poly(meth)acrylate (P3) is coated onto a substrate and cured by ultraviolet radiation to form a printing medium.

Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates, while the powders from which the coatings are made still exhibit good storage stability and melt-processability.

Abstract: An aqueous epoxy resin system suitable for coatings comprises (a) water, (b) at least one epoxy resin and (c) a curing agent prepared by (i) reacting at least one polyamine having at least 3 active amine hydrogen atoms per molecule and at least one epoxy resin in an epoxy equivalent to to polyamine mole ratio of from 0.9:1 to 1:10 to obtain an amine-terminated intermediate; (ii) reacting the amine-terminated intermediate with from 0.5 to 25 weight percent, based on the amine-terminated intermediate, of an acid-terminated polyalkylene glycol to yield an amine-terminated curing agent. The amine-terminated intermediate can be capped with a monoepoxide in an amine hydrogen to epoxy groups ratio of from about 1.5:1 to 30:1 prior to reaction with the acid-terminated polyalkylene glycol, or the amine-terminated curing agent following step (ii) can be capped with a monoepoxide in an amine hydrogen atoms to epoxy groups ratio of from about 2:1 to 30:1.

Abstract: The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fabrics, rubbers, engineered materials, and concrete, said flexible industrial adhesive composition comprising:(a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule;(b) a liquid amine terminated polyamide prepared by reacting at least one C.sub.18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1;(c) one or more optional polyamine(s); and(d) one or more optional filler(s);wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%.

Abstract: A fiber-forming polyamide composition contains a fiber forming polyamide and a sulfonated polyester concentrate, the concentrate disabling and dye sites in the polyamide so that fibers formed from the composition will have enhanced stain and soil resistance. The sulfonated polyester concentrate contains a reagent, preferably an alkali metal salt of 5-sulfoisophthalic acid, and thermoplastic polyester, preferably one or more of PET, PTT, PBT, PETG and poly(ethylene terephthalate-co-isophthalate).

Abstract: An epoxy coating powder composition and a method for controlling the denseness of cured wrinkle finish patterns are provided by the use of a curing agent mixture comprising a blocked Lewis acid, methylenedisalicylic acid and a ring-substituted homolog thereof having the formula ##STR1## wherein x and y are from 1 to 3, and R.sup.1 and R.sup.2 are, independently, hydrogen, alkyl groups having from 1 to 20 carbon atoms, aryl groups having from 6 to 10 carbon atoms, or aryl-substituted methylene groups; with the proviso that when x=y=3, R.sup.1 and R.sup.2 .noteq.hydrogen;wherein the ratio of methylene disalicylic acid and the ring-substituted homolog is from about 50:50 to about 2:98 by weight.

Abstract: A thermosetting pressure-sensitive adhesive comprising a photopolymerization product of a composition containing a) 100 parts by weight of a (meth) acrylic acid alkyl ester wherein the average carbon atom number of the alkyl group is from 2 to 14 and from 30 to 1% by weight of a monoethylenically unsaturated acid copolymerizable with the ester, b) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 0.01 to 4 parts by weight of a photopolymerization initiator, and d) from 5 to 30 parts by weight of an epoxy resin, and not substantially containing a curing agent for the epoxy resin, and an adhesive sheet using the thermosetting type pressure-sensitive adhesive.

Abstract: An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.

Abstract: A water-compatible curing agent for epoxy resins is prepared by (a) reacting at least one polyamine having at least 3 active amine hydrogen atoms per molecule and at least one epoxy resin in an epoxy equivalent to polyamine mole ratio of from 0.9:1 to 1:10 to obtain an amine-terminated intermediate; (b) reacting the amine-terminated intermediate with from 0.5 to 25 weight percent, based on the amine-terminated intermediate, of an acid-terminated polyalkylene glycol to yield an amine-terminated curing agent. The amine-terminated intermediate can be capped with a monoepoxide in an amine hydrogen atoms to epoxy groups ratio of from about 1.5:1 to 30:1 prior to reaction with the acid-terminated polyalkylene glycol, or the amine-terminated curing agent produced following step (b) can be capped with a monoepoxide.

Abstract: An aromatic polysulfone resin composition contains 100 parts by weight of an aromatic polysulfone resin and 0.001-50 parts by weight of at least one compound selected from oxides, peroxides, double oxides and carbonates of a metal belonging to the Group IA or IIA in the periodic table of elements and having a water absorption of 2% or less.

Abstract: Compositions, prepared by glycidation of at least one (a) carboxy polyfunctional polyester and at least one (b) .alpha.,.alpha.-branched monocarboxylic acid containing a tertiary carbon atom and from 5 to 12 carbon atoms, or a glydicyl ester thereof, and coating and/or casting compositions comprising them.

Abstract: A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.

Abstract: A removable adhesive composition comprising (i) 100 parts by weight of a copolymer (A) which is tacky at ordinary temperature, synthesized of 90 to 99.9% by weight of a nonfunctional vinyl type monomer (a) mainly composed of an acrylate or methacrylate ester having an alkyl group having 2 to 12 carbon atoms and 0.1 to 10% by weight of a functional vinyl type monomer (b) having one or more of a carboxyl group, a hydroxyl group, an amino group or an epoxy group in its molecule; (ii) 20 to 1,000 parts by weight of a copolymer (B) whose glass transition point is 10.degree. C. or less and also having a mean particle diameter of 0.5 to 300 .mu.m, synthesized of 90 to 99.9% by weight of a nonfunctional vinyl type monomer (a) mainly composed of acrylate or methacrylate ester having an alkyl group having 2 to 12 carbon atoms and 0.1 to 10% by weight of an .alpha.-monoolefinic carboxylic acid (c); and (iii) 0.

Abstract: A thermosetting resinous composition which consists essentially of(A) at least one polyepoxide compound having 2 to 6 epoxide groups,(B) at least one polyisocyanate compound having 2 to 6 isocyanate or blocked isocyanate groups, and(C) at least one catalyst selected from the group consisting of complex of organotinhalide with onium salt, complex of organotinhalide with hexamethylphosphoramide, complex of stibonium salt with zinc halide and complex of lithium halide with hexamethylphosphoramide, the equivalent ratio of isocyanate group and epoxide group being 1:2 to 2:1.Such resinous composition is useful for forming a cured coating and also for heat resisting molded products.