Patents Examined by Robert E. L. Sellers
  • Epoxy-acrylic graft copolymers with phosphonium cocatalysts carbon-graft
    Patent number: 5116888
    Abstract: A process for non-aqueous copolymerization of ethylenically unsaturated monomers including carboxyl functional monomers in the presence of epoxy resin by in-situ copolymerization is improved by utilizing a catalyst (initiator) combination of less than 2% peroxide and between 0.05% and 0.1% phosphonium catalyst. The carboxyl functional polymer can be aminated and dispersed into water to produce a protective coating composition useful for interior surfaces of beer and beverage cans.
    Type: Grant
    Filed: October 4, 1990
    Date of Patent: May 26, 1992
    Assignee: The Glidden Company
    Inventors: James T. K. Woo, Gary C. Pompignano
  • Carboxy-functional hydrogenated block copolymer dispersed in epoxy resin
    Patent number: 5115019
    Abstract: A method for dispersing and stabilizing a carboxy-functionalized butadiene-styrene block copolymer in an epoxy resin is provided comprising the steps of: (a) dispersing from about 5 to about 30 weight percent of a carboxy-functionalized hydrogenated butadiene-styrene block copolymer in a liquid epoxy resin to produce an elastomer-dispersed epoxy resin composition; (b) contacting the elastomer-dispersed epoxy resin composition and from about 15 to about 30 weight percent, based on the weight of the elastomer-modified epoxy resin composition, of a polyhydric phenolic compound in the presence of an advancement catalyst at a temperature within the range of about 40.degree. C. to about 200.degree. C. for time effective for producing a solid elastomer-modified epoxy resin having an epoxy equivalent weight in the range of about 500 to about 1,500; and (c) recovering said solid elastomer-modified epoxy resin.
    Type: Grant
    Filed: March 30, 1990
    Date of Patent: May 19, 1992
    Assignee: Shell Oil Company
    Inventors: Edward J. Marx, Michael J. Watkins
  • Interpenetrating polymer network of epoxy resin, polyallyl polymer and anhydride
    Patent number: 5110867
    Abstract: Polymeric materials comprising an interpenetrating network (IPN) prepared from allyl polymers and epoxy resins. The allyl polymers are crosslinked under the influence of a radical initiator, the epoxy resin is crosslinked by a curing agent. The curing agent is a cyclic anhydride containing a polymerizable double bond. The two networks are interlinked as a result of the double bond being involved in the curing reaction of the allyl polymers. The cyclic anhydride preferably is maleic anhydride. Preferred IPN's are prepared form triallylcyanurate or triallylisocyanurate-based allyl polymers and phenol-type epoxy resin.
    Type: Grant
    Filed: September 12, 1990
    Date of Patent: May 5, 1992
    Assignee: Akzo NV
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slots
  • .beta.-(keto or sulfonyl)esters from reaction of silyketene acetal and acyl or sulfonyl compound
    Patent number: 5110869
    Abstract: Silylketene acetals, including "living" GTP polymers, are acylated or sulfonylated in the presence of GTP-effective catalysts with acyl or sulfonyl compounds to produce .beta.-ketoesters or .beta.-sulfonylesters; polymeric products, including capped, coupled and chain-extended polymers and block copolymers can be prepared.
    Type: Grant
    Filed: August 21, 1990
    Date of Patent: May 5, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Gordon M. Cohen, Hans J. Reich
  • Organomineral products from aqueous alkali metal silicate, polyisocyanate and epoxy resin
    Patent number: 5107928
    Abstract: In the production of organomineral products which are used, in particular, within the scope of the process for stratum consolidation, it is a disadvantage that foams are, as a rule used which have inadequate strength and that, in addition, the hard polymer segments which are responsible for the strength of the organomineral products, do not contribute to the adhesion of the organomineral products, if they are used in situ for stratum consolidation. A process is disclosed for reacting organic polyisocyanates with epoxy resins in the presence of aqueous alkali-metal silicate solutions, the coreactants being used in an amount of substance ratio corresponding to the relationship ##STR1## so that foaming of the reaction mixture is prevented and an organic polymer structure containing oxazolidinone ring structures is formed which bears adhesion-improving OH groups.
    Type: Grant
    Filed: August 22, 1989
    Date of Patent: April 28, 1992
    Inventor: Karl-Heinz Hilterhaus
  • Maleic anhydride-epoxy resin prepolymer, (vinyl or isopropenyl)phenyl glycidyl ether and anhydride
    Patent number: 5106924
    Abstract: An epoxy resinous composition suitable for impregnating windings of turbine generators comprises a reaction product of an epoxy resin and maleic anhydride combined with a vinyl monomer, a (vinyl or isopropenyl)phenyl glycidyl ether which co-reacts with the epoxy diester prepolymer formed from said reaction product, and the polymerized vinyl monomer, and an anhydride.
    Type: Grant
    Filed: February 5, 1990
    Date of Patent: April 21, 1992
    Assignee: Westinghouse Electric Corp.
    Inventors: James D. B. Smith, Donald D. Jerson
  • Powder coating composition low Tg and high Tg polymers with acid groups
    Patent number: 5098955
    Abstract: A thermosetting powder coating composition which has good stability, pigment dispersion and impact characteristics is disclosed. The composition comprises a co-reactable particle mixture of an acid group-containing acrylic polymer having a Tg in the range of -20.degree. C. to 30.degree. C., an acid group-containing acrylic polymer having a Tg in the range of 40.degree. C. to 100.degree. C. and a curing agent, therefor.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: March 24, 1992
    Assignee: PPG Industries, Inc.
    Inventor: Paul H. Pettit, Jr.
  • Polyurethane adhesive of epoxy resin, polyisocyanate, phosphorus oxy acid, and carboxylic acid
    Patent number: 5096980
    Abstract: A polyurethane adhesive composition containing an oxy acid of phosphorus or a derivative thereof, a carboxylic acid or an anhydride thereof and an epoxy resin can serve as an adhesive for manufacturing food packaging materials, for instance, giving bonds having very good bond strength, heat resistance and hot water resistance between a metal foil and a plastic film.
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: March 17, 1992
    Assignee: Takeda Chemical Industries, ltd.
    Inventors: Kyuya Yamazaki, Hiroto Ryoshi, Teruo Hori
  • Cationic and hydroxyl group-containing resin with alicyclic epoxy resin
    Patent number: 5096984
    Abstract: A cationically electrodepositable paint composition comprises (A) a resin having hydroxyl groups and cationic groups, (B) an epoxy resin having at least two epoxy groups, each directly bound to a (bridged) alicyclic ring, and (C) lead hydroxide and/or lead maleate as curing catalyst(s).
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: March 17, 1992
    Assignee: Kansai Paint Company, Limited
    Inventors: Reiziro Nishida, Akira Tominaga
  • Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether
    Patent number: 5096771
    Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
    Type: Grant
    Filed: August 10, 1990
    Date of Patent: March 17, 1992
    Assignee: General Electric Company
    Inventors: Erik W. Walles, John H. Lupinski, Mark Markovitz, Robert E. Colborn, James R. Presley, Michael J. Davis, Michael G. Minnick, Steven J. Kubisen, Jr., John E. Hallgren, Donald A. Bolon, Victoria J. Eddy, Patricia C. Irwin
  • Hot melt adhesive of ethylene/unsaturated acid copolymer and epoxy crosslinker
    Patent number: 5095046
    Abstract: A heat curable hot melt adhesive system is disclosed. The system uses an epoxy-crosslinking ethylene polymer component, a tackifier compatible therewith and an epoxy crosslinking agent having an epoxide functionality of at least 2. The ethylene polymer component may be either an ethylene copolymer of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, or an ethylene copolymer of an ethylenically unsaturated alcohol used in combination with a dicarboxylic acid anhydride. The dicarboxylic acid anhydride and/or the epoxy can be encapsulated to inhibit premature crosslinking. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by heating the adhesive composition to a higher curing temperature.
    Type: Grant
    Filed: February 6, 1990
    Date of Patent: March 10, 1992
    Assignee: Exxon Chemical Patents Inc.
    Inventor: Mun F. Tse
  • Process for preparing a free-flowing, modified polypropylene powder
    Patent number: 5093399
    Abstract: A process for preparing a free-flowing powder is disclosed, which powder is useful in primer compositions. The process comprises the steps of (a) dissolving a polar group-containing modified propylene polymer (MPP) at an elevated temperature in a solvent for the MPP, (b) cooling the solution to precipitate particles of the MPP, (c) collecting the precipitated particles by simultaneously centrifuging and spraying the particles with a liquid capable of removing the solvent from the particles and which is also a solvent for a film forming resin, such as an epoxy, which is present in the primer composition, (d) continuing step (c) until substantially all of the solvent for the MPP has been removed from the particles, and (e) collecting the resulting powder, which has an average particle size of less than about 5 microns.
    Type: Grant
    Filed: December 14, 1989
    Date of Patent: March 3, 1992
    Assignee: Morton International, Inc.
    Inventor: Richard L. Brook
  • Epoxy-acrylic graft polymers with aminoplast
    Patent number: 5093392
    Abstract: An epoxy-acrylic graft copolymer useful as a paint film is prepared by the in-situ copolymerization of ethylenically unsaturated monomers including between 1% and 25% by weight of alkylated alkylol acrylamide monomer in the presence of at least 3% by weight of peroxide initiator in the absence of water. The unsaturated monomer chains are grafted by carbon-to-carbon grafts to the epoxy resin backbone. The resulting epoxy-acrylic graft copolymer is dispersed into water by adding amine, and is blended with from 1 to 40 parts by weight of aminoplast per 100 parts by weight of copolymer.
    Type: Grant
    Filed: May 8, 1991
    Date of Patent: March 3, 1992
    Assignee: The Glidden Company
    Inventors: James T. K. Woo, Richard M. Marcinko
  • Composition of polyepoxy compounds, linear polymer and aromatic diamine
    Patent number: 5091481
    Abstract: A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: February 25, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroyuki Nakajima, Takashi Takahama, Fumiyuki Miyamoto, Seiji Oka, Toshio Isooka, Yoshihiro Maruyama, Yasushi Yamamoto
  • Exopy resin with aromatic oligomer and rubber particles
    Patent number: 5089560
    Abstract: Fiber reinforced composite structures based on epoxy resin formulations having a phase-separated or multiphase morphology when cured are effectively toughened by adding preformed carboxylated rubber particles to the matrix resin prior to curing the composite.
    Type: Grant
    Filed: January 5, 1990
    Date of Patent: February 18, 1992
    Assignee: Amoco Corporation
    Inventors: Hugh C. Gardner, Richard H. Newman-Evans
  • Epoxy resin composition with polyamide powder
    Patent number: 5084525
    Abstract: An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epoxy resins is an unmodified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The other epoxy resin is an urethane-modified or glycol-modified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The polyamide powder has an average particle size of 150 .mu.m or less and a melting of at least 170.degree. C. and is present in an amount 1-50 parts by weight per 100 parts by weight of liquid epoxy resin admixture.
    Type: Grant
    Filed: February 1, 1990
    Date of Patent: January 28, 1992
    Assignee: Somar Corporation
    Inventors: Ichiro Akutagawa, Tutomu Yamaguchi, Kunimitsu Matsuzaki
  • Hot-melt adhesive of epoxy resins and amino groups-containing polyoxypropylene
    Patent number: 5084532
    Abstract: A reactive hot-melt adhesive is described, which contains a resin component, at least one thermally activatable latent curing agent for the resin component and optionally accelerators, fillers, thixotropic agents and further conventional additives. The adhesive is characterized in that the resin component is obtainable by reacting a) an epoxy resin solid at room temperature and b) an epoxy resin liquid at room temperature with c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resins a) and b) are used in such a quantity, based on the polyoxypropylene with amino terminal groups, that an excess of epoxy groups, based on the amino groups, is ensured.
    Type: Grant
    Filed: August 7, 1989
    Date of Patent: January 28, 1992
    Assignee: Teroson GmbH
    Inventor: Hubert Schenkel
  • Semiconductor sealing composition containing epoxy resin and polymaleimide
    Patent number: 5082880
    Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.
    Type: Grant
    Filed: September 8, 1989
    Date of Patent: January 21, 1992
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Mikio Kitahara, Koichi Machida, Takayuki Kubo, Motoyuki Torikai, Koutarou Asahina
  • Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimide
    Patent number: 5080965
    Abstract: The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
    Type: Grant
    Filed: March 26, 1990
    Date of Patent: January 14, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Katuo Sugawara, Akio Takahashi, Junichi Katagiri, Akira Nagai, Masahiro Ono, Toshikazu Narahara
  • Trisphenol, bisphenol and halogenated bisphenol epoxy resins composition
    Patent number: 5081206
    Abstract: A heat-resistant, flame-retardant epoxy resin composition is provided by combining or reating members selected from a polyfunctional epoxy resin, a bisphenol type epoxy resin, a highly halogenated bisphenol type epoxy resin, a low halogenated bisphenol type epoxy resin, and a halogenated bisphenol. The composition is suitable as a laminate useful for printed circuit boards.
    Type: Grant
    Filed: May 29, 1990
    Date of Patent: January 14, 1992
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Kiyomi Yasuda, Terufumi Suzuki, Toshimasa Takata, Isao Kaneko