Abstract: This invention relates to a resin composition which is used for the production of printed circuit boards. The feature of said resin composition is to add barbituric acid or its derivatives to a bismaleimide resin, and mixed in a solvent or solvent system. The mixture is then added with epoxy resin and suitable amount of curing agent to form the required resin composition. The resin composition has high glass transition temperature and good toughness and other physical and electrical properties. Meanwhile, it would not cause phase separation, so is a high-performance material for the production of printed circuit boards.

Abstract: Thermoformable, thermosettable resins essentially free of secondary alcohol groups are obtained by reaction of oxiranes in active hydrogen-free polyepoxides with carboxylate and/or carbonate groups in active hydrogen-free aryl polyesters, polycarbonates or copolyestercarbonates in the presence of catalytically effective amounts of certain polyorgano phosphonium or phosphine iminium salts.

Abstract: Thermoplastic resin compositions comprising polyarylate and polyamide resins as main components, polyethylene terephthalate and an epoxy resin of the following formula [1] in a predetermined amount are provided. ##STR1##The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.

Abstract: A two part primer composition comprising a main component comprising at least one styrene-ethylene-butene-styrene block copolymer or styrene-ethylene-propylene-styrene copolymer, said copolymer being copolymerized with maleic anhydride hydrogenated, and an amine catalyst, and a curing component comprising an epoxy resin having two or more functional groups, which has excellent heat-resistant adhesion and durable adhesion and is suitable for adhering between polyolefinic substances or between an polyolefinic substance and other organic substance.

Abstract: Curable, high solids, liquid coating compositions are disclosed. The resinous binder comprises a copolymer of an alpha-olefin or cycloolefin and an olefinically unsaturated monoanhydride which may include a half-ester thereof. The coating compositions are useful as clear coats in color-plus-clear automotive coatings and have good humidity resistance and mar resistance.

Abstract: The invention relates to lacquers based on a substance mixture of epoxide compounds and possibly polyesters as well as salts of primary (cyclo)aliphatic C.sub.4-18 -diamines with benzene polycarboxylic acid as hardeners as well as the usual additives and a procedure for the production of flat lacquer coatings.

Abstract: An improved curing agent for use in coatings, laminates, moldings, castings and adhesives comprising the use of an amine-borane adduct along with a mixture of an anhydride polymer or copolymer having at least two anhydride groups and an epoxy polymer or copolymer having at least two epoxy groups. Also provided is an improved process for the preparation of tertiary amine borane curing agents.

Abstract: Non-gelled amine-epoxide reaction products are obtained by co-reacting a secondary amine, a polyoxyalkylene polyamine, a polyepoxide and a monoepoxide. The products are cross-linkable and are useful in aqueous coating compositions, particularly when applied to a substrate by cathodic electrodeposition.

Abstract: Epoxy compositions having improved toughness and flexibility comprising a polyepoxide of the formula ##STR1## wherein each X is H, allyl or glycidyl, Y is allyl or glycidyl and R is an alkyl of 1 to 4 carbons with there being at least two epoxy groups on the ring modified with a carboxy terminated polymer.

Abstract: Curable compositions are described comprising(A) an epoxy resin having on average more than one epoxide group per molecule,(B) a curing agent which can be activated at an elevated temperature for component (A),(C) a liquid copolymer based on butadiene, acrylonitrile and, if appropriate, further ethylenically unsaturated comonomers, and(D) a selected segmented copolymer consisting essentially of recurring soft segments containing polypropylene glycol units or polybutylene glycol units and selected hard segments having a softening point above 25.degree. C. These compositions are suitable for use as, for example, adhesives.

Abstract: This invention provides an adduct of an epoxy resin and a hydroxy free acrylate resin. The novel adduct contains vinyl unsaturation and hence may be copolymerized with an ethylenically unsaturated monomer to provide a tough thermoset resin.

Abstract: A process for preparing an epoxy resin and a process for preparing a hardened and cured epoxy resin adhesive is provided, together with the epoxy resins and adhesives made thereby. The epoxy resin is prepared by mixing together about 76 parts per hundred of a novolac epoxy resin, about 19 parts per hundred of a bisphenol F epoxy resin, and about 5 parts per hundred of carboxy-terminated butadiene acrylonitrile, heating the mixture to a temperature of from about 290 to about 350 degrees Fahrenheit for a time of from about two to about three hours, and then cooling. An epoxy adhesive is prepared by mixing 100 parts of the material so prepared with about 20 parts of a curing agent consisting essentially of diethyltriamine. The resulting adhesive mixture has a paste-like consistency that is easily applied and cured at ambient temperature. The shear strength of the cured adhesive is about 4000 psi at ambient temperature and about 2000 psi at 250 degrees Fahrenheit.

Abstract: This invention relates to polyepoxide resins cured with an amine composition containing 1-methyl-2,6-cyclohexanediamine. The resulting polyepoxide resins generally are more easily processable and have improved thermal stability, greater elongation and enhanced fracture toughness.

Abstract: Chain extended tougheners derived from the reaction of a propenylphenol, a di- or polyphenol, and an epoxy resin may be used to increase the toughness of bismaleimide resin systems.

Abstract: A resin composition comprising 100 parts by weight of a polyester composition comprised of(A) 5-95% by weight of an aromatic polyester, and(B) 95-5% by weight of a polyphenylene ether having a repeating unit of ##STR1## and/or a modified polyphenylene ether obtained by reacting 0.05-20% by weight of an active functional group containing monomer to said polyphenylene ether,(C) 0.05-30 parts by weight of an epoxy compound represented by the formula ##STR2## and (D) 1-60 parts by weight of an impact modifier.

Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.

Abstract: Phenolic molding compositions, particularly useful as sheet molding compositions comprise: (1) a resole phenolic resin, (2) a thickening agent selected from the group consisting of alkaline earth metal oxides or hydroxides and silanes, (3) a filler selected from the group consisting of clay, talc, and mixtures thereof, and (4) an epoxy resin.

Abstract: Described herein are curable molding compositions comprising a mixture of:(a) a vinyl ester produced by the addition of an unsaturated monocarboxylic acid to a polyepoxide and having a molecular weight greater than 300;(b) acrylic or methacrylic acid or a functionalized derivative thereof having a molecular weight of less than 300;(c) an ethylenically unsaturated monomer which is soluble in and copolymerizable with (a) and (b) and which is different from (b).The compositions can also contain one or more fibers with a melting point or a glass transition temperature above about 130.degree. C.

Abstract: The thermosetting powder coating composition which has good stability and good physical properties, such as appearance, flexibility, hardness, solvent resistance and corrosion resistance, is disclosed. The composition comprises a co-reactable particulate mixture of a carboxylic acid group-containing polymer, a polyepoxide, and a beta-hydroxylalkylamide.

Abstract: The present invention provides a resin which is a mixture of (a) the product of a diol and one or more diepoxides and (b) an A-B-A block copolymer wherein A represents blocks of an epoxy/diol copolymer which is the reaction product of a diol and a diepoxide, and B represents blocks of an epoxy-capped, carboxyl-terminated polybutadiene or polybutadiene/acrylonitrile copolymer.Amine resins, produced by reaction of this resin with an amine are useful as the principal resin in electrocoating formulations which produce deposited films having excellent corrosion resistance and improved impact and chip resistance.