Abstract: A device operable to clean an imaging element of a visualization scope comprises a visualization scope engagement body, a cleaning element having a first end portion thereof located adjacent to a distal end of the visualization scope engagement body and a cleaning head attached to the visualization scope engagement body at the distal end thereof. The first end portion of the cleaning element is engaged with the cleaning head. The cleaning head is movable between a deployed configuration relative to the visualization scope engagement body and a retracted configuration relative to the visualization scope engagement body. A centerline longitudinal axis of the visualization scope engagement body extends through the cleaning head when the cleaning head is in the deployed configuration and does not extend through the cleaning head when the cleaning head is in the retracted configuration. The cleaning element is movable for cleaning debris from the imaging element.

Abstract: A cleaning tool for cleaning a glass surface of an accelerator column is disclosed. The cleaning tool includes a shaft including a first end and a second end; a foam body located at the first end of the shaft; and a mounting bracket coupled to the first end of the shaft, the mounting bracket receiving the foam body. An outer circumference of the foam body includes a textured cleaning surface for contacting the glass surface of the accelerator column.

Abstract: High-performance substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus are provided. A substrate cleaning apparatus, including: a substrate holding and rotating mechanism that holds and rotates a substrate; a first cleaning mechanism that brings a cleaning tool into contact with the substrate to clean the substrate, cleans the substrate using two-fluid jet, or cleans the substrate using ozone water; and a second cleaning mechanism that cleans the substrate using an ultrasonic cleaning liquid is provided.

Abstract: A reticle cleaning system includes a casing, a reticle holder, and a static charge reducing device. The reticle holder is in the casing and configured to hold a reticle. The static charge reducing device is above the reticle holder and includes a fluid generator, an ionizer, and a static charge sensor. The fluid generator is configured to control a humidity condition in the casing. The ionizer is configured to provide ionized air molecules to the reticle. The static charge sensor is configured to detect a static charge value on the reticle, wherein the ionizer is between the fluid generator and the static charge sensor.

Abstract: A cleaning device for a pair of spectacles, comprising a housing defining a cleaning space, a mounting part for holding the pair of spectacles inside said space, sets of opposing cleaning elements for cleaning opposing faces of glasses of the pair of spectacles, and a drive unit for moving the pair of spectacles and the cleaning elements relative to each other during a cleaning operation. The sets of opposing cleaning elements are positionable relative to each other between an inactive position, that is configured to have at least one of the sets of the cleaning elements lie spaced from at least one of the opposing faces of the respective glasses, and a cleaning position, that is configured to have the sets of opposing cleaning elements lie against both opposing faces of the respective glasses.

Abstract: The invention concerns a device (100) for cleaning the optical surface (162) of at least one optical sensor (160) for a motor vehicle. The cleaning device (100) includes a source (110) for emitting a laser beam and means for guiding the laser beam onto at least a part of the optical surface (162) of an optical sensor (160) so as to clean it.

Abstract: A substrate processing method includes a substrate holding step of holding a substrate having a front surface on which a metal is exposed, an inert gas replacing step of replacing an atmosphere around the front surface of the substrate with an inert gas by supplying an inert gas to a vicinity of the front surface of the substrate, an adjusting step of adjusting a pH of the rinsing liquid so as to form an inactive state in which the metal does not react with the rinsing liquid or so as to form a passive state by allowing the metal to react with the rinsing liquid, and a rinsing liquid supplying step of supplying the rinsing liquid whose pH has been adjusted to the front surface of the substrate after the atmosphere around the front surface of the substrate has been replaced with the inert gas.

Abstract: Dishwasher, in particular household dishwasher, with a washing compartment a control device for carrying out a washing program from a number of washing programs and with an automatic dosing device for automatically dosing a plurality of dosing quantities from a supply a cleaning agent present as a solid in the washing area, the control device for cleaning the automatic dosing device being set up to control the automatic dosing device to switch to a cleaning state and to control the automatic dosing device for cleaning the automatic Dosing device to carry out a specific wash program from the number of wash programs.

Abstract: Dishwashing machine comprising: a controller; a spray arm assembly comprising a spray arm having one or more spray holes for spraying a washing load with water, and a pipe for delivering water to the spray arm; a pump for pumping water through the pipe and to the spray arm; the pipe being constructed and arranged to at least partially restrict flow of water from the pump to at least a part of the spray arm dependent on spray arm orientation relative to the pipe, a power consumption of the pump thereby being dependent at least in part on the spray arm orientation relative to the pipe; and the controller being configured to monitor the power consumption of the pump in order to determine rotational information of the spray arm.

Abstract: A cleaning device includes: a treatment container; a workpiece carrier arranged in the treatment container and configured to hold at least one workpiece; at least one nozzle configured to discharge a cleaning jet directed onto the workpiece carrier and mounted such that the at least one nozzle is moveable on a circulation track about the workpiece carrier and is pivotable about a pivoting axis extending parallel to an axis of rotation of the workpiece carrier; a pivoting device configured to pivot the at least one nozzle; and a controller configured to control a circulating movement of the at least one nozzle on the circulation track and a pivoting movement of the at least one nozzle, such that a specified point on a surface of the workpiece is impacted repeatedly by the cleaning jet at a respectively different angle, within a specified timeframe.

Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.

Abstract: Image classification is used to dynamically control one or more wash parameters in an automated cleaning machine. An imaging device installed in the wash chamber of the cleaning machine captures one or more image(s) of articles to be cleaned at various times throughout a cleaning process. A computing device analyzes the captured image(s) to classify the images as to an article type and a rack volume. Based on the article type classification and the rack volume, the computing device dynamically controls one or more parameters of the cleaning process to achieve a satisfactory cleaning and/or sanitizing result.

Abstract: An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism (1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.

Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.

Abstract: Methods and apparatuses for the production of HF in an electron-beam generated plasma. A gas containing fluorine, hydrogen, and an inert gas such as argon, e.g., Ar/SF6/H2O or Ar/SF6/NH3 flows into a plasma treatment chamber to produce a low pressure gas in the chamber. An electron beam directed into the gas forms a plasma from the gas, with energy from the electron beam dissociating the F-containing molecules, which react with H-containing gas to produce HF in the plasma. Although the concentration of the gas phase HF in the plasma is a very small fraction of the total gas in the chamber, due to its highly reactive nature, the low concentration of HF produced by the method of the present invention is enough to modify the surfaces of materials, performing the same function as aqueous HF solutions to remove oxygen from an exposed material.

Abstract: A reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer. A reflective mask cleaning apparatus according to an alternative embodiment comprises a third supply section configured to supply a plasma product produced from a reducing gas to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.

Abstract: A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

Abstract: A robotic arm can clean an end-of-arm tool using a cleaning station. The end-of-arm tool can be positioned at an introduction position with a portion of the end-of-arm tool in contact with a cleaning agent contained within the cleaning station. The end-of-arm tool can be positioned at a scrubbing position with the end-of-arm tool in contact with a cleaning surface. And the end-of-arm tool can be positioned at a drying position for drying of the end-of-arm tool.

Abstract: The natural oxidation film of polysilicon, which is exposed at a side surface of a recess portion 83 provided in a substrate W, is removed and a thin film 84 of polysilicon is exposed at the side surface of the recess portion 83. Liquid IPA is brought into contact with the thin film 84 of polysilicon after the natural oxidation film of polysilicon is removed. Diluted ammonia water is supplied to the substrate W and the thin film 84 of polysilicon is etched after IPA comes into contact with the thin film 84 of polysilicon.

Abstract: A device cleans a core engine of a jet engine. The device has: a nozzle installation which is configured for introducing a cleaning medium into the core engine; a connector configured to connect the device in a rotationally fixed manner to a shaft of a fan of the jet engine; and a line connection configured to supply the cleaning medium, which is connected to the nozzle installation by a rotary coupling. The nozzle installation comprises nozzles, comprising at least one flat jet nozzle, and at least one full cone nozzle or hollow cone nozzle.