Abstract: A dust hood, useful for use in the compressed air and vacuum cleaning of a dusty apparatus placed therein, which is in the form of a flexible bag having a portion of its front face transparent with that front face also containing holes for a hose supplying compressed air and a hose supplying vacuum, respectively, for such cleaning.

Abstract: A substrate cleaning apparatus, includes a vaporizer configured to generate water vapor, a first heating part configured to heat a nitrogen gas to a first temperature, a second heating part configured to heat the nitrogen gas to a second temperature, wherein the second temperature is higher than the first temperature, and at least one cleaning chamber connected to the vaporizer, the first heating part, and the second heating part, wherein the at least one cleaning chamber is configured so that at least one substrate is exposed to the water vapor, the nitrogen gas having the first temperature, or the nitrogen gas having the second temperature under an atmospheric pressure.

Abstract: Containing device for a treatment machine for loose products, provided internally with a treatment compartment that has at least an open side for loading the loose products to be treated, and for unloading the loose products that have been treated; the containing device comprises at least a first loading door for the loose products to be treated, positioned on a first portion of said open side and associated with at least a respective opening and closing unit, and at least a second unloading door for the loose products that have been treated, positioned on a second portion of said open side and associated with at least a respective opening and closing unit.

Abstract: A cleaning method is provided. In the cleaning method, residues of elements of a group for a common semiconductor material in a chamber are removed with plasma of a halogen-containing gas. Residues of metal elements of groups 12 and 13 and groups 14 and 15 in the chamber are removed with plasma of a hydrocarbon-containing gas. A C-containing material in the chamber is removed with plasma of an O-containing gas. Further, the removing with the plasma of the halogen-containing gas, the removing with the plasma of the hydrocarbon-containing gas, and the removing with the plasma of the O-containing gas are performed in that order or the removing with the plasma of the hydrocarbon-containing gas, the removing with the plasma of the O-containing gas, and the removing with the plasma of the halogen-containing gas are performed in that order X times where X?1.

Abstract: An assembly includes a housing defining a chamber and having an air inlet. The assembly includes a blower in the chamber and in fluid communication with the air inlet. The assembly includes a sensor defining a field of view and supported by the housing. The housing has an outlet vent of variable size. The outlet vent is in communication with the blower and aimed across the field of view of the sensor.

Abstract: The cleaning device (20) for cleaning a cylindrical roller (50), for example an anilox roller of a printing machine, includes a cleaning head (30) with a cleaning chamber (110), in which there is housed a mechanical cleaning member (60), and with which there are associated feeding members (70) for feeding a cleaning liquid into the cleaning chamber (110). The mechanical member (60) and cleaning liquid dispensed by the feeding members work in combination inside said cleaning chamber (110) to clean the lateral surface of the roller (50).

Abstract: The invention relates to a device for cleaning the surface of a tool for shaping the surface of a large-area fiber composite material body using a highly pressurized cleaning liquid, having a nozzle support which is held on a central bearing in a rotatable manner, at least one jet nozzle which is held in an arm of the nozzle support and out of which the highly pressurized cleaning liquid exits during operation, and a control unit for controlling the cleaning liquid pressure to be applied, wherein the nozzle support is surrounded by a housing which is provided with an opening towards the tool surface to be cleaned. The housing is connected to a suction device by means of which a housing interior equipped with the nozzle support can be suctioned.

Abstract: Disclosed is a first cleaning apparatus including a first cleaning bath, a cover provided at the upper part of the first cleaning bath, a drainage portion provided at the lower part of the first cleaning bath, a first cleaning unit and a second cleaning unit provided respectively at a first side surface and a second side surface in the first cleaning bath, and first and second moving units configured to move the first and second cleaning units, respectively, wherein each of the first and second cleaning units includes a plurality of cleaning solution supply pipes provided at different heights and a plurality of nozzles provided at each of the cleaning solution supply pipes, the nozzles provided at one cleaning solution supply pipe have identical cleaning solution spray angles, and the nozzles provided at the other cleaning solution supply pipes have different cleaning solution spray angles.

Abstract: Provided is an adhesive removing device for removing an adhesive for adhering a mask and a pellicle from the mask. The adhesive removing device includes: a laser irradiating unit configured to irradiate a laser beam to an adhesive layer formed between the mask and the pellicle; a controller configured to control a wavelength, a waveform, and an energy density of the laser beam, so as to remove the adhesive layer through emission of the laser beam; and an imaging unit configured to monitor a region to which the laser beam is irradiated.

Abstract: A household dishwasher includes: a washing water spray nozzle module disposed on an area of inner surfaces of a washing chamber and spraying washing water, which is supplied from a water supply tube, into the washing chamber; a steam generation module disposed in the washing chamber and supplying steam into the washing chamber using the washing water supplied from the washing water spray nozzle module; an induction module disposed on an outer surface of the washing chamber and heating the washing water supplied in the washing chamber; an ultrasonic vibration module disposed on an outer surface of the washing chamber and applying ultrasonic vibration to the washing water in the washing chamber to perform ultrasonic washing; and a controller disposed in a body and controlling operational relationships of internal components in response to washing order signals from a user.

Abstract: A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a chamber having a first housing and a second housing that are combined with each other to form a processing space inside, and a housing actuator that moves the first housing to open or close the processing space. The housing actuator includes a plurality of cylinder units coupled to the first housing, a fluid supplier that supplies a fluid for operating the plurality of cylinder units, and a deviation corrector that corrects an operation deviation between the plurality of cylinder units. The deviation corrector corrects the operation deviation between the plurality of cylinder units coupled to the chamber, thereby minimizing particles that are generated when the chamber is opened/closed.

Abstract: A machine that includes a cooling package and a method for cleaning debris from the cooling package is disclosed. The cooling package may include a housing, a cooler, a heat exchanger, a conduit, and plurality of nozzles mounted on the conduit. The cooler may be configured to receive heated machine fluid generated by the machine. The heat exchanger may be configured to convey heat away from the cooler and may include a plurality of fins coupled to and extending outward from the cooler. The plurality of fins may define a plurality of channels. The conduit may be disposed between the housing and the plurality of fins. The plurality of nozzles are configured to discharge a fluid on the fins. The fluid may be air or a release agent. In some embodiments, a release agent may be discharged on the fins prior to the discharge of air on the fins.

Abstract: In accordance with some embodiments, a wafer processing method is provided. The wafer processing method includes placing a semiconductor wafer on a wafer stage with a backside surface of the semiconductor wafer facing downwardly. The wafer processing method further includes positioning a first brush assembly below the backside surface of the semiconductor wafer. The wafer processing method also includes moving a first brush assembly toward the backside surface of the semiconductor wafer to a first position. At the first position, an inner brush member and an outer brush member of the first brush assembly, made of different materials, are in contact with the backside surface of the semiconductor wafer. In addition, the wafer processing method includes rotating the first brush assembly relative to the semiconductor wafer while the first brush assembly is in the first position.

Abstract: A smoking pipe cleaning assembly for cleaning a smoking pipe includes a cylinder that is hollow to contain a fluid cleaning solution. A smoking pipe is insertable into the cylinder to submerge the smoking pipe in the fluid cleaning solution for cleaning the smoking pipe. A first cap is removably attachable to the cylinder and the first cap engages the smoking pipe to inhibit the smoking pipe from striking the cylinder. A second cap is removably attachable to the cylinder and the second cap receives the smoking pipe to inhibit the smoking pipe from striking the second cap. A base for is provided that insertably receives the cylinder when the smoking pipe is positioned in the cylinder.

Abstract: The method of using the flow within a pipeline to clean the inner wall of the pipeline including placing the cleaning pig into the pipeline to be cleaned at a first location, using a restraining rope or cable to cause the cleaning pig to move along the pipeline at a speed slower than the speed of the flow within the pipeline and thereby causing a pressure differential between the upstream side and the downstream side of the cleaning pig, providing one or more jetting nozzles and using the pressure differential to jet a portion of the flow within the pipeline through the one or more jetting nozzles onto the inner wall of the pipeline while providing a flow area through the cleaning pig to bypass the portion of the flow which does not pass through the one or more jetting nozzles.

Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.

Abstract: A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of a substrate, a holding-layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding-layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removal of the particle holding layer from the substrate, a liquid film of a second processing liquid, a gas phase layer forming step of forming a gas phase layer for holding the liquid film between the upper surface of the substrate and the liquid film, and a liquid film removing step of removing the second processing liquid from the upper surface of the substrate by moving the liquid film on the gas phase layer.

Abstract: A foreign particle removal system for removing a foreign particle from a surface of an object has a tool gripper which grips a particle removal tool. A tip of the particle removal tool has a sticky tip portion. The sticky tip portion has an apex region at a remote end of the sticky tip portion and a flank region adjoining the apex region. The tool gripper holds the particle removal tool at an oblique angle with respect to the surface so that the flank region of the sticky tip portion faces towards the surface. The tilted particle removal tool is conveyed with the tool gripper to contact the foreign particle on the surface with the flank region of the sticky tip portion and a force is exerted onto the surface to attract the foreign particle onto the flank region. The particle removal tool may then be lifted away from the surface together with the foreign particle.

Abstract: Methods and apparatuses for the production of HF in an electron-beam generated plasma. A gas containing fluorine, hydrogen, and an inert gas such as argon, e.g., Ar/SF6/H2O or Ar/SF6/NH3 flows into a plasma treatment chamber to produce a low pressure gas in the chamber. An electron beam directed into the gas forms a plasma from the gas, with energy from the electron beam dissociating the F-containing molecules, which react with H-containing gas to produce HF in the plasma. Although the concentration of the gas phase HF in the plasma is a very small fraction of the total gas in the chamber, due to its highly reactive nature, the low concentration of HF produced by the method of the present invention is enough to modify the surfaces of materials, performing the same function as aqueous HF solutions to remove oxygen from an exposed material.

Abstract: A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.