Abstract: A semiconductor memory device includes a memory cell array from which all bits of a data signal having a first number of the bits composed of a main data signal and an error detection/correction code data signal are simultaneously read, a sense amplifier for amplifying the read data signal, a selection unit for selecting a data signal having a second number of bits forming a part of the data signal amplified by the sense amplifier, and an error detection/correction unit for performing error detection and correction based on at least a part of the selected data signal having the second number of bits, wherein the selection by the selection unit is performed based on a row address.

Abstract: Various embodiments include an apparatus comprising a memory device including a plurality of addressable memory locations, and a memory manager coupled to the memory device, the memory manager including a scheduling unit and a histogram data structure including a plurality of counters, the scheduling unit operable to detect a single-bit error in data read from the memory device, and to increment a value in a particular one of the plurality of counters, the particular one of the plurality of counters corresponding to the particular bit in the accessed data which incurred the single-bit error in the read data.

Abstract: A semiconductor device test circuit includes a data producing unit to produce first test data to be fed into a semiconductor device, and expected value data; a first data retaining unit to retain the first test data, and feed the first test data into the semiconductor device; a second data retaining unit to retain the expected value data; a comparison unit to compare output data outputted through the first data retaining unit and the expected value data outputted from the second data retaining unit to supply data indicating comparison result between the output data and the expected value data; and a switching unit to switch the data fed into the second data retaining unit between the expected value data and the output data, wherein the first data retaining unit and the second data retaining unit form parts of a scan chain into which second test data may externally be fed.

Abstract: In an apparatus including a joint test action group (JTAG) authentication device, and a JTAG authentication method using the apparatus, the apparatus includes a joint test action group (JTAG) authentication device, the apparatus comprising a JTAG access circuit that determines whether to access a JTAG-compliant device according to a predetermined protocol that governs the JTAG-compliant device and the apparatus, wherein the JTAG access circuit at least one of inactivates at least one of inner bus lines and inner units and activates the at least one of the inner bus lines and the inner units according to whether the JTAG-compliant device is accessed.

Abstract: A replacement data storage circuit stores an address of a defective memory cell. The replacement data storage circuit includes a plurality of word lines, a plurality of bit lines, and a plurality of replacement data memory cells. The replacement data memory cells are connected to the word lines and the bit lines to store an address of a defective memory cell. Each of the word lines is connected to a plurality of replacement data memory cells and each of the bit lines is connected to one replacement data memory cell.

Abstract: Disclosed herein are exemplary methods, apparatus, and systems for performing timing-aware automatic test pattern generation (ATPG) that can be used, for example, to improve the quality of a test set generated for detecting delay defects or holding time defects. In certain embodiments, timing information derived from various sources (e.g. from Standard Delay Format (SDF) files) is integrated into an ATPG tool. The timing information can be used to guide the test generator to detect the faults through certain paths (e.g., paths having a selected length, or range of lengths, such as the longest or shortest paths). To avoid propagating the faults through similar paths repeatedly, a weighted random method can be used to improve the path coverage during test generation. Experimental results show that significant test quality improvement can be achieved when applying embodiments of timing-aware ATPG to industrial designs.

Abstract: An integrated test device reduces external wiring congestion to a memory. The integrated test device provides for separate decoder testing and debugging to find specific errors in the memory. The device also helps in reducing the complexity of the test of external BIST. Furthermore, the number of clock cycles required for the decoder testing for an N-address memory is reduced from 4N cycles to N clock cycles. Additionally, the access time for the memory is reduced as the test device is used as a pipelining device in normal operation mode.

Abstract: A method and apparatus allows controlling a plurality of test operations in an electronic device, and in particular a volatile or non-volatile memory device in which a test mode has already been established, without the need for additional device connections. One such operation may be switching device operation from test mode to functional mode, the normal operating mode of the device. Other test operations include support of continuity testing by external circuitry, support of externally accessing device identification with which the device has been previously programmed, support of built in self-test, support of self-repair and support of other operations determined as needs arise.

Abstract: A testing device for testing a high-speed serial transmitter or other device includes an input stage having a first comparator, a second comparator, and a digital-to-analog converter. The first comparator compares first differential signals from a device under test. The second comparator compares the first differential signals and second differential signals from the digital-to-analog converter. An analysis unit identifies first beats based on an output of the first comparator and second beats based on an output of the second comparator. The analysis unit identifies one or more characteristics of the device under test (such as jitter, differential signal swing, and transition time) based on the first and second beats. A clock unit provides an adjustable clock signal to the comparators. The clock signal may have a frequency shift with respect to a frequency of the device under test.

Abstract: An apparatus having a memory module and an initialization module is disclosed. The initialization module may be configured to (i) mark a particular location in the memory module as an uninitialized location by writing a predetermined word into the particular location in response to an occurrence of an event, (ii) read a read word from an address in the memory module in response to a read cycle and (iii) generate an interrupt signal by analyzing the read word, the interrupt signal being asserted where the read word indicates that the address is the uninitialized location in the memory module.

Abstract: Provided are a generation device and the like for generating a test vector which can reduce capture power efficiently. The generation device 100 generates a test vector for a logic circuit by assigning logic values to each of a plurality of unspecified bits (X-bits) included in a test cube.

Abstract: A plurality of stacked memory device die and a logic circuit are connected to each other through a plurality of conductors. The stacked memory device die are arranged in a plurality of vaults. The logic circuit die serves as a memory interface device to a memory access device, such as a processor. The logic circuit die includes a plurality of link interfaces and downstream targets for transmitting received data to the vaults. The logic circuit die includes a packet builder and broadcaster configured to receive command, address and data signals over separate interfaces from a conventional tester, format the signals into a packet and broadcast the signals to a plurality of vaults.

Abstract: A scan clock generator includes a clock signal input for receiving a clock signal, a scan shift mode signal input for receiving a scan shift mode signal, and a sequence controller coupled to the clock signal input for gating a selected number of clock signal pulses at a time to generate a sequence of nonconcurrent scan clock signals at separate outputs respectively in response to a first state of the scan shift mode signal.

Abstract: Provided are a conversion device and others for converting a test vector set so as to reduce a logic value difference generated before and after scan capture in outputs of scan cells included in a full scan sequential circuit. A conversion device converts a test vector set corresponding to the full scan sequential circuit. The conversion device comprises a setting unit for setting a candidate bit which can be a don't care bit and a fixed bit which cannot be the don't care bit according to predetermined constraint conditions based on an input-output relationship in the logic circuit in order to identify the don't care bit identifiable as don't care from each test vector of the test vector set, and a logic value deciding unit for deciding a logic value for the don't care bit in view of a relationship in a plurality of bit pairs in relation to a test cube including the don't care bit identified by the setting unit.

Abstract: Column redundancy data is selectively retrieved in a memory device according to a set of storage elements which is currently being accessed, such as in a read or write operation. The memory device is organized into sets of storage elements such as logical blocks, where column redundancy data is loaded from a non-volatile storage location to a volatile storage location for one or more particular blocks which are being accessed. The volatile storage location need only be large enough to store the current data entries. The size of the set of storage elements for which column redundancy data is concurrently loaded can be configured based on an expected maximum number of defects and a desired repair probability. During a manufacturing lifecycle, the size of the set can be increased as the number of defects is reduced due to improvements in manufacturing processes and materials.

Abstract: Methods and systems for storing data in a memory system with different levels of redundancy are disclosed. Methods and systems consistent with the present invention provide allow a redundancy level to be associated with received data, wherein associating the redundancy level of the data includes determining a desired level of protection for that data and determining the redundancy level based on the desired level of protection. A zone within a memory system is located that has a redundancy level that matches the redundancy level of the data, and the data is stored in the located zone with the desired redundancy level.

Abstract: A single-pass, concurrent validation method for generating test pattern sequences for sequential circuits maps fault objects arriving at circuit next-state lines into good next-state fault objects, and passes these mapped results to a next time-frame by placing the good next-state fault objects on present-state lines corresponding to the next-state lines at which to fault objects arrived. Path-enabling functions created during an initial time-frame are reused for all subsequent time-frames, permitting a fault-propagation size and a path-enabling function size to be bounded by a function size established during the initial time-frame. A valid test pattern sequence is found when a primary output line has a good output level that is a complement of a faulty output level for the line. In one embodiment, the determination and comparison of output levels is carried out concurrently.

Abstract: [PROBLEMS] To provide a semiconductor integrated circuit by which what has been referred to as two-pattern test is made possible without greatly increasing an occupying area. [MEANS FOR SOLVING PROBLEMS] The semiconductor integrated circuit is provided with a plurality of flip-flop circuits and selectors corresponding to each flip-flop circuit. Each flip-flop circuit is provided with a master latch and a slave latch connected to the master latch. The selector is electrically connected with the master latch of the flip-flop circuit to which the selector corresponds, and is also connected with the master latch of the flip-flop circuit other than the one to which the selector corresponds.

Abstract: An apparatus and method for economical testing of dies in a multichip module. Internal I/O pins on a die are logically connected to external I/O pins of the multichip module through the use of a silicon interposer on which the dies are attached. Multiplexers on the interposer can select between the external pins of the multichip module and the internal pins of the dies. The silicon interposer can be economically manufactured using manufacturing technology having relatively a large feature size, such as is found in a relatively mature IC fabrication plant. Further, use of the present invention allows multichip modules to be tested for faults without the necessity of redesigning test circuitry or adding additional pins to the package.

Abstract: A system-in-package type semiconductor device includes a logic chip; and a memory chip connected with external terminal through the logic chip. The logic chip includes a data holding circuit configured to hold a test data in a test mode, and store the test data supplied through the data input/output terminal in the data holding circuit in response to a test data set command, and writes the test data which has been stored in the data holding circuit in the memory chip in response to the test data write command.